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TO-5

The TO-5 is a standardized hermetically sealed metal can package for transistors and other semiconductor devices, defined under the Joint Electron Device Engineering Council (JEDEC) transistor outline specifications.^[1] Characterized by its cylindrical steel or alloy body with axial leads on a 0.200-inch (5.08 mm) pin circle diameter, it provides robust protection and thermal management for components in demanding environments.^[1]^[2] The package typically measures about 0.315 inches (8 mm) in body diameter and 0.260 inches (6.6 mm) in height, making it suitable for through-hole mounting on printed circuit boards.^[3] Commonly available in configurations with 3 to 10 leads, the TO-5 supports a range of applications requiring high reliability, such as general-purpose amplification, switching, and power regulation.^[2] Its construction, often featuring glass-to-metal seals for hermeticity with moisture levels below 5000 ppm, ensures durability in high-frequency RF and microwave systems, industrial controls, and optical devices like laser diodes and photodiodes.^[4]^[5] The TO-5's design emphasizes excellent thermal conductivity and process stability for wire bonding and die attachment, contributing to its use in military, aerospace, and medical equipment where environmental resilience is critical.^[4]^[5]

History and Development

Origins in Early Transistor Technology

The TO-5 package emerged in the late 1950s as a key advancement in semiconductor encapsulation, developed to house early silicon transistors during the transition from germanium-based devices. Texas Instruments introduced one of the first instances of the TO-5 in 1957 with its 2N332 series of silicon NPN transistors, marking a shift toward standardized metal-can designs capable of supporting higher-performance silicon dies compared to prior packages.^[6] However, Fairchild Semiconductor played a pivotal role in popularizing the package through its 1958 release of the 2N696 and 2N697 silicon mesa transistors, the first commercially produced silicon devices from Silicon Valley, which utilized the TO-5 for mass production and demonstrated superior switching speeds for computer applications.^[7]^[8] These transistors, initially supplied to IBM at $150 each, addressed the growing demand for reliable silicon components in early digital systems.^[9] The TO-5 design drew inspiration from earlier metal-can packages like the TO-1, which had been used for germanium transistors since the mid-1950s, but it offered enhancements tailored to silicon's properties, including improved hermetic sealing via glass-to-metal bonds to protect against moisture and oxidation, and better heat dissipation through its robust metal construction.^[10]^[11] Initial dimensions were standardized around an 8.9 mm base diameter to accommodate expanding die sizes in planar silicon processes, allowing for three to six leads while maintaining a compact footprint suitable for emerging military and consumer electronics.^[12] This package facilitated the replacement of vacuum tubes in applications such as radios, early computers like IBM's systems, and military equipment, where transistors enabled miniaturization and increased reliability.^[9] Early production of TO-5 packaged devices faced challenges, particularly with achieving consistent glass-to-metal seals, as mismatches in thermal expansion coefficients between the Kovar alloy base and borosilicate glass could lead to cracks or leaks during high-temperature assembly processes.^[13] Fairchild's implementation for the 2N696 and 2N697 overcame initial yield issues by refining diffusion and etching techniques for mesa structures, enabling hermetic encapsulation that supported the transistors' operation up to 40 V and 150 mA, critical for high-speed switching in 1950s-era computing circuits.^[7] These advancements solidified the TO-5's role in pioneering the silicon transistor era, paving the way for broader adoption in electronics by the early 1960s.

Standardization and Industry Adoption

The TO-5 package was formally registered by the Joint Electron Device Engineering Council (JEDEC) as TO-205AA in the late 1950s, establishing it as a de facto standard for medium-power transistors and promoting uniformity in the burgeoning semiconductor industry.^[14] This registration aligned with JEDEC's formation in 1958 to standardize solid-state devices, including transistor outlines, under the auspices of the Electronic Industries Alliance (EIA).^[15] Major manufacturers rapidly adopted the TO-5, with Texas Instruments introducing the first commercial silicon transistors in this package, such as the 2N332 series in 1957, which helped drive its acceptance as an industry benchmark.^[6] RCA followed suit in the early 1960s, further solidifying its prevalence across production lines.^[16] By the early 1960s, the package's design tolerances were refined through collaborative efforts involving EIA and the International Electrotechnical Commission (IEC), ensuring compatibility and easing global interchangeability.^[15] A pivotal milestone occurred in 1965 with the TO-5's integration into military specifications (MIL-SPEC), enabling its use in ruggedized applications for defense electronics and enhancing reliability standards for high-stakes environments. In the late 1960s, adoption expanded beyond discrete transistors to early integrated circuits, including operational amplifiers like the μA741, which leveraged the package's thermal and hermetic properties for analog signal processing.^[17] This versatility accelerated mass production.

Design and Construction

Physical Structure and Materials

The TO-5 package utilizes a robust metal construction for hermetic encapsulation of semiconductor devices, primarily transistors. The base is fabricated from cold-rolled steel or Kovar alloy, measuring 8.9 mm in diameter, and serves dual purposes as a heat sink to dissipate thermal energy from the die and as a mounting flange for attachment to circuit boards or chassis.^[18]^[19]^[20] The enclosure is completed by a metal cap, typically welded to the base via resistance welding for airtight sealing, with dimensions of 8.1 mm in diameter and 6.3 mm in height to accommodate the internal components while maintaining a compact footprint.^[18]^[11] Internally, the structure incorporates glass-to-metal or ceramic insulators to electrically isolate the leads from the conductive base, preventing short circuits while allowing axial leads arranged on a 0.200-inch (5.08 mm) pin circle. The semiconductor die is often bonded to the base using methods such as gold-silicon eutectic attachment, which provides low thermal impedance and high reliability under varying temperatures.^[1]^[19]^[21] Key performance metrics include a package weight of about 2 grams. Hermetic integrity is ensured through fine leak testing, achieving rates below 5 × 10^{-8} atm-cc/sec to protect against moisture and contaminants.^[22]^[23]

Lead Configuration and Thermal Management

The TO-5 package employs a standard three-lead configuration for bipolar junction transistors, with pin 1 as the emitter, pin 2 as the base, and pin 3 as the collector. The leads are arranged in an equilateral triangular pattern on a circle with a diameter of 5.08 mm (0.200 inches), ensuring compatibility with standard assembly processes. A mounting tab on the base, positioned at a 45° angle from pin 1, provides orientation reference and mechanical support during insertion. Some configurations include an optional fourth pin connected to the case for grounding applications. The hermetic sealing of the leads is achieved through a glass frit process or ceramic-to-metal bonds, providing electrical isolation and a moisture-resistant barrier that protects internal components from environmental ingress. The cap is attached via resistance welding to complete the enclosure seal.^[24] Thermal management in the TO-5 relies on the electrical and thermal connection of the case to the collector terminal (pin 3), allowing direct heat transfer from the transistor die to an external heatsink or chassis. This path minimizes thermal impedance, supporting reliable operation under moderate power conditions. The maximum junction temperature is rated at 150°C in many specifications, with power dissipation capabilities up to 500 mW at a 25°C ambient temperature without additional cooling. The junction-to-case thermal resistance, denoted as \theta_{JC}, quantifies the package's heat dissipation efficiency from the die to the case surface and is approximately 40°C/W for the TO-5. It is calculated using the formula

\theta_{JC} = \frac{T_J - T_C}{P_D},

where T_J is the junction temperature in °C, T_C is the case temperature in °C, and P_D is the power dissipation in watts. This equation derives from Fourier's law of heat conduction, assuming steady-state conditions and one-dimensional heat flow through the package materials; solving for P_D enables determination of safe operating limits given cooling constraints.^[25]^[26]^[24]^[14]

Variants

Three- and Four-Pin Variants (TO-39, TO-9, TO-16, TO-42)

The three- and four-pin variants of the TO-5 package, including the TO-39, TO-9, TO-16, and TO-42, represent compact modifications that reduce overall size while preserving the essential hermetic metal can structure for reliable protection against environmental contaminants. These variants are designed for applications requiring fewer leads, emphasizing space efficiency and compatibility with standard TO-5 pin orientations where applicable, such as axial lead configurations on a 0.200-inch pin circle. All maintain the hermetic seal of the original TO-5 but exhibit reduced thermal capacity, limited to a maximum of 350 mW dissipation without external heatsinking at 25°C ambient, due to their smaller form factors.^[1]^[11] The TO-39 package, with its 9.53 mm height and three pins arranged in a standard emitter-base-collector layout, is commonly used for low-power audio transistors in amplification circuits. Its leads extend to 12.7 mm in length, facilitating straightforward soldering and mechanical stability in through-hole assemblies. This variant balances compactness with moderate thermal performance, suitable for general-purpose switching and signal processing where power levels remain below 350 mW under ambient conditions.^[27]^[28]^[29] In contrast, the TO-9 features a flat base design with four pins, incorporating an additional grounding pin to enhance electrical isolation and reduce parasitic effects in RF applications. This configuration improves grounding efficiency, making it ideal for high-frequency operations where stable signal integrity is critical. The flat base also aids in mounting to heat sinks or PCBs for better thermal contact compared to rounded variants.^[2]^[4] The TO-16 and TO-42 serve as miniaturized versions with a 6.35 mm diameter, both supporting three pins for simplified connectivity in space-constrained designs (note: TO-16 is an obsolete JEDEC outline). These packages excel in high-frequency switching tasks, such as in RF and pulse circuits, where their reduced size minimizes inductance while upholding the hermetic integrity essential for longevity in harsh environments. Their compact profile limits power handling to the 350 mW threshold, prioritizing speed over high dissipation.^[1]^[2]^[14]

Five- to Eight-Pin Variants (TO-12, TO-33, TO-75, TO-76, TO-77)

The five- to eight-pin variants of the TO-5 package, such as the TO-12, TO-33, TO-75, TO-76, and TO-77, extend the original design to support increased pin density for analog integrated circuits and transistors, enabling more sophisticated signal processing and power handling in compact hermetic enclosures. These packages maintain the characteristic metal can construction with a .200-inch (5.08 mm) pin circle diameter for lead arrangement, but incorporate axial or dual-in-line lead configurations to accommodate 5 to 8 pins, facilitating applications in power amplification and operational amplification where additional connections are needed for inputs, outputs, and bias.^[1] The TO-12 and TO-33 variants are configured with 5 to 6 pins and elongated leads of 38.1 mm length, optimized for power amplifiers in environments requiring flexible wiring and enhanced heat dissipation through extended lead exposure. These designs allow for direct integration into point-to-point circuits, reducing parasitic inductance while supporting moderate power levels suitable for audio and RF amplification stages. The TO-33, in particular, features 4 to 6 axial leads arranged on the .200-inch pin circle, providing a balance between pin count and the mechanical robustness of the TO-5 base.^[1]^[4] The TO-75 package supports up to 8 pins in a 6-lead axial configuration on a .200-inch (5.08 mm) pin circle, with gold-plated leads for superior corrosion resistance and conductivity in military-grade applications. Measuring 38.1 mm in overall height, it achieves a power rating of 1 W through its hermetic seal and efficient thermal path, making it ideal for rugged environments like aerospace and defense systems where reliability under vibration and temperature extremes is critical.^[1]^[30]^[31] The TO-76 and TO-77 packages feature a hermetic style with 8 axial leads on the .200-inch (5.08 mm) pin circle, tailored for operational amplifiers requiring multiple connections for differential inputs, outputs, and power supplies. The TO-76 features 8 axial leads for broad analog IC integration, while the TO-77's 8-lead arrangement enhances board mounting and signal integrity in precision circuits, as exemplified by its use in devices like the μA741 op-amp for general-purpose amplification in early integrated electronics. These variants prioritize hermetic sealing to protect sensitive silicon dies from moisture and contaminants, supporting applications in instrumentation and control systems.^[1]^[32]^[33]

Ten-Plus Pin Variants (TO-78, TO-79, TO-80, TO-99, TO-74, TO-96, TO-97, TO-100, TO-73, TO-101, TO-205)

The ten-plus pin variants of the TO-5 package represent evolutionary extensions designed to support higher integration levels in integrated circuits and hybrid modules, featuring axial leads arranged in a circular pattern similar to the original TO-5's 5.08 mm pin circle diameter but scaled for additional pins.^[1] These packages maintain the hermetic metal can or ceramic construction for reliability in demanding environments, with lead pitches typically at 2.54 mm to facilitate through-hole mounting.^[34] The TO-78, TO-79, TO-80, and TO-99 packages accommodate 8 axial leads on a 0.200-inch (5.08 mm) pin circle, often employing ceramic bodies for enhanced thermal stability and hermetic sealing in early digital ICs and operational amplifiers.^[1] For instance, the TO-99 features a metal header with a minimum body diameter of 12.70 mm and height of 6.35 mm, numbered pins 1 through 8 in a circular configuration, and compliance with JEDEC MO-002-AK standards.^[34] These variants were particularly suited for premium-quality ICs requiring robust encapsulation, such as early logic gates and amplifiers, where the ceramic construction provided superior protection against moisture and mechanical stress.^[35] Expanding to 10 pins, the TO-74 uses a 0.200-inch pin circle, while the TO-96, TO-97, and TO-100 employ a slightly larger 0.230-inch (5.84 mm) pin circle, enabling hybrid assemblies with dimensions typically ranging from 12.7 mm to 19.05 mm in length for multi-device integration.^[1] These configurations supported transitional applications in analog-digital hybrids, prioritizing pin density without significantly altering the TO-5's cylindrical form factor for compatibility in existing assembly processes. For power-oriented designs, the TO-73 and TO-101 variants offer up to 12 axial leads—the former on a 0.200-inch pin circle and the latter on 0.230-inch—with extended cap heights around 6.35 mm to improve heat dissipation in RF modules and high-current devices.^[1] The TO-205 family encompasses these power extensions as a header-type package, with the TO-205AA designation representing one of the larger configurations in the series for demanding transistor applications.^[1] Overall, the TO series includes over 20 such variants, emphasizing scalability from the base TO-5 design for evolving semiconductor needs.^[1]

Applications and Uses

Historical Applications in Electronics

The TO-5 package played a pivotal role in military and aerospace electronics during the 1960s and 1970s, valued for its hermetic seal and robustness in extreme environments. In the Apollo program, the early Block I Apollo Guidance Computer incorporated Fairchild Micrologic integrated circuits housed in TO-5 style metal can packages, enabling compact logic functions essential for spaceflight reliability.^[36] These packages facilitated the transition from discrete transistors to early ICs, with thousands of units deployed in guidance systems that demanded high performance under vibration and temperature stress. Similar applications extended to military communications equipment, including radios, where TO-5 transistors ensured operational integrity in field conditions.^[37] In consumer electronics, the TO-5 became a staple for small-signal amplification and switching from the late 1950s through the 1970s, appearing in early transistor radios, televisions, and stereo systems. Germanium and early silicon transistors, such as those in the TO-5 format, powered audio amplifiers and RF stages in devices like portable radios, contributing to the miniaturization of home entertainment.^[10] For example, Fairchild's pioneering 2N696 and 2N697 silicon transistors, introduced in TO-5 packages, were integrated into consumer audio circuits for their stable performance. The package's prevalence in these applications stemmed from its compatibility with through-hole assembly techniques dominant at the time. Industrial applications in the 1970s leveraged the TO-5 for control circuitry, particularly in automation systems requiring precise regulation. The TO-5 was one of the most common packages for transistors during the 1960s, reflecting its widespread adoption across sectors before the advent of plastic alternatives.^[37] Its usage declined sharply in the 1980s with the rise of surface-mount devices (SMD), which offered smaller footprints and automated assembly, though TO-5 persisted in high-reliability and select high-voltage scenarios demanding hermetic protection.^[38]

Modern and Specialized Applications

In aerospace and defense sectors, hermetic TO-5 variants remain essential for their ability to withstand extreme conditions, including radiation exposure in satellites and missiles. These packages provide robust sealing that protects internal components from vacuum, thermal cycling, and ionizing radiation, ensuring long-term reliability in space missions and guided munitions systems. For instance, radiation-tolerant optocouplers in 6-lead TO-5 configurations, such as the Skyworks OLH249, exhibit minimal degradation in current transfer ratio under gamma, neutron, and proton bombardment, making them suitable for optical isolation in high-reliability aerospace electronics.^[39] In RF and microwave applications, the TO-5-8 variant is employed in low-noise amplifiers, leveraging its hermetic design for EMI shielding and thermal dissipation in high-frequency circuits up to microwave bands. This package supports oscillators and amplifiers in environments requiring precise signal integrity, where non-hermetic alternatives may fail due to contamination or mechanical stress. Manufacturers like Electronic Products Inc. (EPI) produce these for custom RF modules, emphasizing compression or matched seals to maintain performance in demanding telecom and surveillance infrastructure.^[5] TO-5 packages find continued use in medical devices and industrial sensors operating in harsh environments, where their hermetic construction and longevity—often exceeding 20 years—outweigh size constraints. In industrial settings like oilfield or chemical sensors, it provides protection against corrosion and vibration. These applications prioritize the package's proven durability over modern surface-mount options, particularly in legacy upgrades or mixed-technology boards combining through-hole and SMD components for enhanced reliability.^[5] As of 2025, TO-5 production is niche and primarily custom-ordered, with global hermetic packaging supporting high-reliability sectors, driven by aerospace and defense demands rather than mass consumer markets. This limited scale reflects a shift toward specialized fabrication, with suppliers focusing on variants tailored for radiation-hardened or high-power needs. The hermetic packaging market is estimated at USD 4.23 billion in 2025.^[40]

Standards and Specifications

JEDEC and EIA Definitions

The JEDEC standard TO-205AA establishes the registered outline for the TO-5 package, specifying it as a header-type configuration with axial leads arranged on a 0.200-inch (5.08 mm) pin circle diameter. This standard details the package's physical dimensions, including a nominal body diameter of 0.315 to 0.350 inches (8.00 to 8.89 mm) and a height of approximately 0.215 to 0.250 inches (5.46 to 6.35 mm), ensuring compatibility across manufacturers for through-hole mounting. Pin 1 is designated by a unique orientation feature, such as a beveled edge or tab on the package flange, positioned at a specific angular reference relative to the lead circle to facilitate consistent assembly and identification. Materials are outlined to include a ferrous alloy base (typically Kovar or cold-rolled steel) for the header, with gold-plated or solder-dipped leads for corrosion resistance and electrical performance, promoting hermetic sealing when welded with a metal lid. Updates to the standard align with environmental regulations like RoHS by specifying compatible finishes for leads, such as tin-based over nickel underplating, without altering core dimensional tolerances.^[1] Complementing JEDEC's outline specifications, EIA (now incorporated into joint standards with JEDEC and IPC) defines thermal and electrical testing protocols essential for TO-5 qualification, focusing on reliability under operational stresses. For thermal management, JESD22-A104 outlines temperature cycling procedures, subjecting the package to repeated exposures between -55°C and +125°C (Condition C) for up to 1,000 cycles at a rate of 2 cycles per hour, to evaluate mechanical integrity of welds, seals, and lead attachments against thermal expansion mismatches. Electrical testing protocols, such as those in JESD22-A117 for electrostatic discharge and JESD22-A115 for steady-state life, verify insulation resistance (>1 GΩ at 500 VDC) and dielectric withstand voltage (up to 1.5 kV), ensuring the package maintains performance in high-reliability environments. Solderability is assessed per JESD22-B102, which mandates dip-and-look or wetting balance tests on lead terminations, requiring at least 95% coverage with eutectic Sn-Pb or lead-free Sn-Ag-Cu solder after steam aging, to confirm robust PCB assembly without voids or dewetting. These protocols collectively ensure the TO-5's robustness, with maximum lead coplanarity limited to 0.25 mm to prevent insertion issues during automated soldering. As of November 2025, the latest revision of JESD22-A104 is F.01 (April 2023).^[41]^[42] No major revisions to the TO-205AA standard have occurred since its last update, reflecting the package's mature status and ongoing relevance in legacy and specialized applications, with reaffirmations maintaining compatibility updates.^[1]

International Equivalents and Variations

The TO-5 package, originally defined by JEDEC standards in imperial units, is adapted internationally through metric dimension specifications to support global manufacturing and interoperability. Internationally, equivalents often involve direct metric conversions of JEDEC dimensions, such as a nominal body diameter of 8.0 to 9.0 mm and pin circle diameter of 5.08 mm, without unique designation codes in standards like IEC 60747 (which focuses on device characteristics rather than outlines). Regional standards such as German DIN, Japanese EIAJ, Russian GOST, British BS, and Chinese GB/T typically reference or adapt JEDEC outlines with mm-based tolerances for local fabrication, emphasizing hermetic sealing in industrial applications. Interoperability across these systems is facilitated by IPC-7351 guidelines for PCB footprints, which provide standardized land patterns in metric units to ensure reliable global assembly.^[43]^[2]

Advantages, Disadvantages, and Comparisons

Key Benefits and Limitations

The TO-5 package offers excellent hermetic sealing, typically achieving leak rates below 5 × 10^{-8} atm-cc/sec helium, which protects internal components from moisture and contaminants over extended periods.^[44] This sealing enables a lifespan exceeding 20 years in sealed conditions, as demonstrated by calculations showing moisture ingress times of up to 24.5 years for packages with leak rates around 4.4 × 10^{-10} atm-cm³/sec air under standard environmental assumptions.^[45] Its metal can construction provides superior thermal dissipation, supporting power handling up to approximately 1 W depending on the device and mounting, with junction-to-ambient thermal resistance around 158 °C/W derived from derating factors in representative integrated circuits.^[46] The robust Kovar base and resistance-welded lid also confer mechanical ruggedness, making it suitable for vibration-prone environments through enhanced structural integrity compared to non-metal enclosures.^[11] However, the TO-5's bulky size, with a diameter of approximately 8 mm (0.315 inches) and height around 6.6 mm (0.260 inches), limits its use in high-density PCB layouts where space is constrained.^[3] Through-hole mounting requires additional assembly steps like drilling and manual or wave soldering, increasing production time relative to surface-mount alternatives.^[47] Furthermore, the hermetic metal construction results in higher costs, often $0.50 or more per unit for components in this package, compared to pennies for equivalent SMD types, due to specialized materials and sealing processes.^[11] Non-lead-free versions with pure tin plating on leads are susceptible to tin whisker growth, potentially causing short circuits over time in high-reliability applications.^[48]

Comparisons with Modern Package Types

The TO-5 package provides better thermal management than smaller through-hole and surface-mount alternatives like the TO-92 and SOT-23, primarily due to its metal can design that allows direct attachment to heatsinks for enhanced heat dissipation. For instance, the TO-5 supports power dissipation of up to 800 mW at an ambient temperature of 25°C derating to 200°C, and 3.0 W at a case temperature of 25°C. In contrast, the TO-92 typically handles 500-625 mW under similar ambient conditions, while the SOT-23 is limited to around 200-300 mW due to its compact plastic encapsulation and reliance on PCB traces for cooling. However, the TO-5's footprint, with an 8 mm diameter body, is approximately 10 times larger in area than the SOT-23's 1.3 mm × 2.9 mm dimensions, making it preferable for applications exceeding 200 mW where board space is available but thermal performance is critical, such as in legacy power amplification circuits.^[26] Compared to high-density modern packages like QFN and BGA, the TO-5 lags in integration scale, supporting only 3 to 8 pins versus the 32+ pins in a typical QFN or hundreds in a BGA, limiting its use in complex IC assemblies requiring high I/O counts. Nonetheless, the TO-5 excels in reliability for harsh environments, with an operational temperature range of -65°C to 200°C enabled by its hermetic metal construction, surpassing the standard -40°C to 125°C limits of non-hermetic plastic QFN and BGA packages that are more susceptible to moisture and thermal cycling failures. This durability positions the TO-5 in niche high-reliability sectors like aerospace, where density is secondary to robustness.^[26]^[49] The TO-5 offers comparable hermeticity to ceramic flat-packs, both providing sealed protection for sensitive components, but at lower cost for medium-power discrete devices due to simpler metal fabrication over ceramic processing. While ceramic flat-packs maintain favor in ultra-high-reliability military applications, TO-5 adoption has waned since the early 2000s amid the shift to surface-mount technologies for miniaturization and automated assembly, compounded by RoHS directives favoring lead-free materials—though many TO-5 variants now comply with exemptions for high-melt solder. As of 2025, trends indicate hybrid integration, where TO-5 persists for power-handling elements alongside SMD components in mixed-signal boards for automotive and industrial systems, balancing legacy compatibility with modern density needs.^[4]^[50]^[51] A key differentiator is the TO-5's effective thermal conductivity of approximately 50 W/m·K for steel bodies or 17 W/m·K for Kovar bodies, versus 0.2-1 W/m·K for typical plastic SMD encapsulants, enabling superior heat spreading without additional substrates.^[52]^[53]

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[PDF] 2n2218 2n2218a silicon npn transistors - Central Semiconductor
Power Dissipation. PD. 800. mW. Power Dissipation (TC=25°C). PD. 3.0. W. Operating and Storage Junction Temperature. TJ, Tstg. -65 to +200. °C. ELECTRICAL ...Missing: dimensions thermal
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[PDF] but33-d.pdf - onsemi
Transistors with Base-Emitter. Speedup Diode. The BUT33 Darlington transistor is designed for high–voltage, high–speed, power switching in inductive circuits ...
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[PDF] MIL-DTL-45204D-Gold-Plating-Electrodeposited-.pdf
1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein.
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[PDF] µA741 General-Purpose Operational Amplifiers datasheet (Rev. G)
3 Description. The µA741 device is a general-purpose operational amplifier featuring offset-voltage null capability. The high common-mode input voltage ...Missing: 77 hermetic
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[PDF] DECEMBER 1977 RELIABILITY EVALUATION OF HERMETIC ...
An extensive study was conducted to evaluate the relative strengths and in-line packages. The study weaknesses of commonly used hermetic flat and dual.Missing: capacity | Show results with:capacity
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[PDF] 8-Pin Metal Header [TO-99]
The 8-Pin Metal Header [TO-99] has dimensions such as 0.2500 (6.35) MIN, 0.5000 (12.70) MIN, 0.1850 (4.70) 0.1650 (4.19) and is compliant to JEDEC standards MO ...Missing: ceramic | Show results with:ceramic
[36]
The beauty of ICs - Embedded
Dec 3, 2015 · Of course before we had DIL ICs we had the round TO-99 packages for op-amps and even some old digital ICs. The early 709 and 741 opamps were ...
[37]
ICs Rocket to Success - CHM Revolution - Computer History Museum
... Apollo Guidance Computer project was the largest user of ICs through 1965. ... computers used Fairchild Micrologic ICs in this TO-5 style metal can package.
[38]
Package is the First to Accommodate System Design Considerations
Typical 1960s transistors used TO-5 or TO-18 (Transistor Outline) metal-can packages with three external leads. Lower-cost plastic versions served applications ...
[39]
Early Electronic Calculators - John Wolff's Web Museum
Apr 12, 2020 · These early machines were built entirely with discrete components - thousands of individual transistors, diodes, and resistors. They were large, ...
[40]
[PDF] Radio-Electronics-1970-05.pdf
May 1, 1970 · ... TO -5 pack- ages, operate with supply voltages up to 24. Typical current drain is 4 mA at 4.5 volts and 8 mA at 12 volts. Typical voltage ...
[41]
Semiconductor Packaging History and Primer - SemiWiki
Mar 9, 2022 · Semiconductor packaging evolved from DIP to QFP, BGA, POP/SiP, and WLP. Early packaging was in ceramic or metal cans, then plastic and DIP.Missing: decline | Show results with:decline
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OLH249 - Skyworks | Products Details
... Package Photo. Package Info6-Lead Hermetic TO-5. Radiation TolerantYes. No Base Connection. Features. Radiation-tolerant version of 4N49; Current Transfer Ratio ...
[43]
Satellite Microelectronic Packages | Electronic Products Ind. (EPI)
TO-5 package · TO-8 Package · TO-18 Package · TO-39 Package · TO-46 Package ... These packages provide critical protection against vacuum and radiation exposure ...
[44]
Hermetic Packaging Market Share Analysis | Industry Report, 2025 ...
The global hermetic packaging market size was estimated at USD 4.01 billion in 2024 and is projected to reach USD 5.90 billion by 2030, growing at a CAGR of ...
[45]
Temperature Cycling - JEDEC
JESD22-A104F.01 ... This standard applies to single-, dual- and triple-chamber temperature cycling in an air or other gaseous medium and covers component and ...
[46]
[PDF] Solderability JESD22-B102E - JEDEC STANDARD
The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another ...
[47]
https://southelectronicpcb.com/are-surface-mount-components-cheaper/
[48]
[PDF] EIAJ ED-7303B
EIAJ ED-7303B is a standard for the name and code of semiconductor packages, related to the EIAJ ED-7300 standard.Missing: metric DIN
[49]
IPC 7351 Standards to Design a Footprint - Sierra Circuits
Dec 7, 2022 · IPC 7351 PCB footprint standard specifies the optimum size, shape, and tolerance for surface mount pads of your component land pattern.Missing: IEC 60747 DIN TF- EIAJ GOST British BS Chinese GB/ T
[50]
[PDF] MIL-STD-883E-Method-1014.pdf - EB Industries
a. Standaml leak rate. Standard leak rate is defined as that quantity of dry air at 25°C in atmosphere cubic centimeters flowingthrough a leak or multiple ...
[51]
[PDF] Hermetic Cover Seal Process Technology MIL-STD-883 TM 1014 Seal
MIL-STD-883 TM 1014 seal requires gross leak testing within one hour of removal from helium bombing, and uses the Howl-Mann method to determine leak rates.
[52]
[PDF] fairchild linear integrated circuits - Evil Mad Scientist Laboratories
tendencies make the µA741 ideal for use as a voltage follower. The high gain and wide range of operating voltage provides superior performance in integrator ...
[53]
https://www.hightempmetals.com/techdata/hitempKovardata.php
[54]
https://southelectronicpcb.com/are-surface-mount-components-cheaper/
[55]
Basic Info on Tin Whiskers - NASA NEPP
Jan 17, 2019 · Tin whiskers have been observed to grow to lengths of several millimeters (mm) and in rare instances to lengths in excess of 10 mm. Numerous ...
[56]
[PDF] Package Thermal Characterization - Texas Instruments
Tabular thermal data in this databook list the typical package thermal resistance data from each package family with differ- ent lead counts. θJA data are ...
[57]
IC Package Types | DIP, SMD, QFP, BGA, SOP, SOT, SOIC
Jan 5, 2024 · Here we explained what IC packaging is and the different types of IC Packages like DIP, QFP, BGA, SOP, SMD, QFN, SOIC, and SOT.
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Transistor Outline (TO) Package Market 2025 - Semiconductor Insight
Transistor Outline (TO) Package Market was valued at US$ 923.7 million in 2024 and is projected to reach US$ 1.38 billion by 2032, at a CAGR of 5.21%
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Thermal Conductivity of Metals and Alloys: Data Table & Reference ...
Thermal Conductivity - k - is the quantity of heat transmitted due to an unit temperature gradient, in unit time under steady conditions.