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Renesas Electronics

Renesas Electronics Corporation is a multinational manufacturer headquartered in , specializing in the , development, design, manufacture, sale, and servicing of microcontrollers, analog, power, and system-on-chip () products for embedded applications across automotive, industrial, infrastructure, and () sectors. The company, listed on the under the ticker 6723, operates globally with approximately 21,907 employees as of June 30, 2025, and reported consolidated revenue of 1,348.5 billion yen for the ended December 31, 2024, marking an 8.2% decrease from the previous year primarily due to market conditions in certain segments. Formed through a series of mergers, Renesas traces its origins to the 2003 establishment of Renesas Technology Corp. from the combination of semiconductor operations by and Electric, followed by the 2010 merger with Electronics to create the current entity, which began operations on April 1, 2010. Since then, Renesas has expanded through strategic acquisitions, including in 2017 to bolster analog and power capabilities and in 2024 to enhance software and design tools for systems. Under the leadership of and CEO Hidetoshi Shibata, the company focuses on delivering Winning Combinations—integrated solutions combining analog, power, processing, and —to address end-to-end needs from sensors to actuators. Renesas' business is divided into key segments, with the Automotive division generating 702.8 billion yen in non-GAAP in 2024 (a 6.4% year-over-year increase), driven by demand for solutions in vehicle electrification, advanced driver-assistance systems (ADAS), and autonomous driving. The Industrial segment supports and automation, while Infrastructure and offerings target energy efficiency, connectivity, and for safer, greener, and healthier applications. With a capital stock of 153,209 million yen as of December 31, 2024, Renesas continues to innovate in processing, emphasizing sustainability through support for the (SDGs) and recent initiatives like a dedicated software and digitalization organization established in 2024.

Overview

Company profile

Renesas Electronics Corporation was established on April 1, 2010, through the merger of Electronics Corporation and Renesas Technology Corp. The name "Renesas" derives from "" and "Semiconductor," reflecting aspirations for innovation and revival in the industry. Headquartered in , , Renesas maintains a global footprint with sales offices across , , the , and regions, alongside manufacturing and design facilities primarily in and . As of June 30, 2025, the company employs 21,907 people worldwide. Renesas focuses on the design, manufacture, and sale of advanced semiconductors tailored for systems, with primary emphasis on automotive, (IoT), and infrastructure applications to enable smarter, more efficient solutions. As the second-largest provider of automotive microcontrollers globally, Renesas derives over 50% of its revenue from the automotive sector in recent years, underscoring its pivotal role in vehicle electrification and . Looking ahead, Renesas has set a strategic goal to rank among the top three embedded suppliers by 2035, achieved through advancements in power-efficient technologies and expanded solution portfolios.

Leadership and governance

Hidetoshi Shibata has served as President and of Renesas Electronics since July 2019, bringing extensive experience in semiconductor operations and financial management to guide the company's strategic direction. Prior to his CEO role, Shibata joined Renesas in 2013 as Executive Vice President and during a period of corporate restructuring, leveraging his engineering background and prior roles in investment and operations within the technology sector. As of 2025, key executives include Utae Nakanishi, who joined as Senior Vice President and in January 2025 to drive talent development and organizational culture initiatives. Zaher Baidas was appointed Senior Vice President and General Manager of the Power Product Group in July 2025, succeeding Chris Allexandre and focusing on expanding power solutions amid growing demand for efficient semiconductors. Additionally, Shinichi Yoshioka serves as Co-Chief Technology Officer since January 2025, overseeing hardware and automotive technologies as part of the dual CTO structure that also emphasizes software and digitalization. In October and November 2024, Renesas announced several transitions effective January 1, 2025, aimed at supporting digitalization efforts and long-term growth strategies, including the establishment of co-CTO roles and enhanced leadership. On November 13, 2025, Renesas announced further enterprise changes effective January 1, 2026, including the appointments of Gaurang as and of Embedded Processing, Peter Jenkins as and of Analog & Mixed Signal, Stephen Limoges as and Chief Sales Officer, Ivo Marocco as and Head of UX, and Balaji Kanigicherla as , Head of and CTO (succeeding Shinichi Yoshioka). These changes underscore an emphasis on , with new programs to foster inclusive talent development and pipelines aligned with the company's mission to deliver embedded processing solutions. The Board of Directors comprises six members as of March 2025, consisting of one internal director (CEO Shibata) and five independent outside directors to ensure balanced oversight. The governance framework includes specialized committees: a three-member Audit Committee (all outside directors) for financial and compliance auditing, a Nomination Committee (three outside directors), and a Compensation Committee (four members, three outside), all contributing to robust risk oversight and ethical standards. Renesas adheres fully to Japan's Code, promoting transparent decision-making, shareholder rights through measures like virtual shareholder meetings with three-week advance notices, and comprehensive via the Global Rule for , which includes taskforces for critical issues such as disruptions. Compliance is enforced through the Renesas Global and a whistleblower , overseen by the Board to maintain across operations.

History

Formation and early development

The origins of Renesas Electronics trace back to two key predecessor companies in the Japanese industry. Electronics Corporation was established on November 1, 2002, through the of Corporation's operations, creating a wholly-owned subsidiary with annual sales of approximately $5.7 billion focused on integrated circuits and microcontrollers. Independently, Renesas Technology Corp. was formed on April 1, 2003, as a between , Ltd. (55% ownership) and Electric Corp. (45% ownership), consolidating their businesses to specialize in microcontrollers, analog devices, and system-on-chips for consumer and automotive applications. These entities merged on April 1, 2010, to establish Renesas Electronics Corporation, integrating their operations to form a major player in the global semiconductor market with combined net sales exceeding ¥1 trillion for the fiscal year ended March 31, 2010. The merger, agreed upon in a definitive pact signed on September 16, 2009, aimed to leverage complementary strengths in microcontroller technologies, creating a unified entity headquartered in Tokyo with a focus on embedded processing solutions. This consolidation positioned Renesas as a leader in 8-bit and 16-bit microcontrollers, particularly for consumer electronics and automotive sectors, while establishing a core intellectual property portfolio from the merged technologies of Hitachi, Mitsubishi, and NEC. In the early post-merger years from 2010 to 2012, Renesas faced significant challenges amid recovery from the global , including ongoing operating losses and the need for structural reforms. The company undertook cost-cutting measures, such as rationalizing product lines and reforming production facilities, to achieve profitability. A pivotal milestone was the March 2011 Great East Japan Earthquake, which severely damaged the Naka Factory—a key site for automotive production—leading to an estimated ¥11.9 billion in losses over three months and widespread disruptions in the . Renesas responded by shifting production to undamaged facilities, restoring operations within months and demonstrating resilience through integrated R&D efforts that unified architectures across legacy product families. By 2012, these initiatives culminated in a major restructuring plan announced on July 3, including workforce reductions of over 5,000 positions to streamline operations and enhance competitiveness in markets.

Mergers, acquisitions, and strategic shifts

Renesas Electronics has pursued an aggressive acquisition strategy since 2013 to bolster its capabilities in key areas such as power management, connectivity, and sensing technologies, particularly targeting the automotive and industrial markets. Notable early acquisitions included Intersil in 2017 for $3.2 billion, which strengthened analog and power management offerings, and Integrated Device Technology (IDT) in 2019 for $6.7 billion, adding mixed-signal and high-performance computing solutions. A landmark deal was the 2021 acquisition of Dialog Semiconductor for approximately $5.9 billion, which enhanced Renesas' portfolio in low-power management integrated circuits (PMICs) and battery management systems, critical for energy-efficient devices. This was followed by the 2021 acquisition of Celeno Communications for $315 million, adding advanced Wi-Fi 6/6E solutions to support high-performance wireless connectivity in IoT and automotive applications. In 2022, Renesas acquired Steradian Semiconductors for an undisclosed amount, integrating radar system-on-chips (SoCs) to strengthen its position in advanced driver-assistance systems (ADAS). The 2023 purchase of Panthronics AG, also for an undisclosed sum, expanded near-field communication (NFC) offerings, enabling secure contactless transactions and device pairing. More recently, in 2024, Renesas acquired Transphorm Inc. for $339 million to incorporate gallium nitride (GaN) power devices, improving efficiency in electric vehicle chargers and data centers, and Altium Ltd. for $5.9 billion to gain PCB design software, facilitating end-to-end electronics development. Alongside acquisitions, Renesas has executed divestitures to streamline its operations and focus on high-growth areas. In October 2024, it sold its (RF) components business to India's for $36 million, transferring related , assets, and employees to prioritize core segments. By October 2025, Renesas was exploring the sale of its timing device business, potentially valued at $2 billion, as part of efforts to divest non-strategic assets amid a shifting landscape toward and automotive applications. Strategically, Renesas shifted emphasis toward and power efficiency following its 2016 operational recovery, aligning with rising demand for and electrification in vehicles. This pivot involved investing in technologies for energy-efficient systems, evidenced by subsequent acquisitions that integrated advanced power and analog solutions. In February 2020, Renesas unveiled its Mid-Term Growth Strategy, aiming to achieve top-three status among global embedded solution providers by 2025 through portfolio expansion and revenue growth in automotive, industrial, and sectors. Acquired technologies have been incorporated into core product lines, such as enhancements to the RA family of Arm-based microcontrollers, which now feature improved low-power modes from Dialog and Wi-Fi integration from Celeno for broader connectivity. These moves have driven significant expansion into solutions and software tools, diversifying Renesas' revenue beyond traditional microcontrollers, supporting a projected 10% annual increase in embedded processing revenues and reinforcing market leadership in automotive semiconductors.

Products

Microcontrollers

Renesas Electronics provides a comprehensive portfolio of microcontrollers (MCUs) spanning 8-, 16-, and 32-bit architectures, optimized for tasks with emphasis on low-power operation ideal for battery-powered and energy-efficient devices. These MCUs support a variety of applications requiring reliable processing, from simple interfaces to complex system management. Key MCU families include the RL78 series, which offers 16-bit (with some 8-bit variants) ultra-low-power designs operating at up to 48 MHz, featuring exceptional efficiency at 37.5 μA/MHz for sensors and portable devices. The RX family employs a 32-bit core, delivering high performance up to 240 MHz with advanced functions for and industrial applications. The RA family integrates cores, providing scalable 32-bit processing up to 200 MHz, enhanced security via Arm TrustZone, and connectivity options for secure endpoints. Additionally, the RE family, introduced in 2023, leverages the open-source architecture for flexible, cost-effective general-purpose MCUs focused on developer freedom and ecosystem compatibility. For automotive use, the RH850 series delivers 32-bit MCUs with compliance (up to ASIL D), high reliability, and integrated diagnostics tailored for engine management and systems. These MCUs incorporate rich integrated peripherals, including analog-to-digital converters (ADCs), timers, communication interfaces like CAN, and security hardware, enabling compact system designs without external components. Flash memory options scale from 16 in entry-level devices to 4 or more in high-end variants, supporting code density and needs across product lines. Renesas emphasizes scalability, allowing seamless migration between families for evolving design requirements. Renesas MCUs find primary applications in automotive electronic control units (ECUs) for body, , and advanced driver-assistance systems (ADAS), as well as industrial for , factory controls, and machinery. The company maintains a leading position in the global automotive MCU market, shipping over 3.5 billion units annually with approximately 50% dedicated to automotive uses.

Microprocessors and SoCs

Renesas Electronics develops 32-bit and 64-bit microprocessors (MPUs) and system-on-chip () solutions that integrate high-performance CPU cores, graphics processing units (GPUs), and specialized accelerators to support demanding applications in multimedia, (), and real-time processing. These products emphasize , enabling seamless integration with Renesas' (MCU) families for hybrid systems that balance compute-intensive tasks with control-oriented functions. Unlike simpler MCUs, Renesas' MPUs and SoCs target complex, high-compute scenarios requiring multi-core architectures and advanced peripherals. The RZ family represents Renesas' core lineup of general-purpose MPUs, built around cores for industrial and . The RZ/G series, for instance, features up to quad-core configurations with Cortex-A57 or A55 processors clocked at 1.5 GHz or higher, paired with integrated GPUs for high-resolution human-machine interfaces (HMIs). The RZ/A series offers dual-core Cortex-A9 options at 400 MHz, suitable for cost-effective graphics rendering in embedded displays. For -enhanced processing, the RZ/V series incorporates dynamic reconfigurable processors (DRP-AI) accelerators, such as the DRP-AI3 in the RZ/V2H model, which delivers up to multiply-accumulate operations per cycle for vision-based tasks, alongside quad Cortex-A55 cores at 1.8 GHz. In the automotive domain, Renesas' R-Car SoCs provide integrated platforms for advanced driver-assistance systems (ADAS), , and gateways. The R-Car Gen4 lineup, including the R-Car V4H, combines cores with neural processing units (NPUs) achieving 34 TOPS for inference, supporting real-time in automated driving. Models like the R-Car H3e offer dual Cortex-A57/A53 cores at up to 2 GHz, with integrated image signal processors (ISPs) and GPUs for cockpit displays and NCAP-compliant vision systems. The upcoming R-Car Gen5, such as the R-Car X5, introduces chiplet-based designs for software-defined vehicles, optimizing multi-domain computing with enhanced power efficiency. Key features across these families include multi-core processing for parallel workloads, DDR4/LPDDR4 memory interfaces for high-bandwidth data handling, and security enhancements like OP-TEE trusted execution environments to protect sensitive operations in edge and automotive environments. Power optimization techniques, such as dynamic voltage scaling and low-power modes, enable efficient deployment in battery-constrained or thermally limited settings. These MPUs and SoCs find applications in industrial HMIs for factory , automotive gateways for vehicle-to-cloud , and smart infrastructure for AI-driven monitoring, where their integrated accelerators reduce system complexity and latency.

Analog and power devices

Renesas Electronics provides a comprehensive of discrete and integrated analog components essential for mixed-signal systems, enabling precise and conditioning in various applications. These include operational amplifiers (op-amps), data converters, and other analog ICs designed for low-noise performance and high accuracy. Complementing these, Renesas' power management solutions focus on efficient and energy conversion, supporting compact designs with minimal heat generation. Key products in the analog domain encompass operational amplifiers offering precision characteristics such as low offset voltage (under 1 mV) and high-speed operation with gain-bandwidth products up to several MHz, suitable for signal amplification in instrumentation and control systems. For , Renesas offers power management integrated circuits (PMICs), including buck and boost converters like the ISL9110 series, which achieve up to 95% efficiency across a 1.8V to 5.5V input range, optimizing power delivery for battery-operated devices. Additionally, following the 2024 acquisition of Transphorm, Renesas expanded into (GaN) power transistors, providing high-voltage devices rated up to 650V offering superior efficiency compared to traditional alternatives, enhancing efficiency in high-power applications. management ICs, such as the ISL78714, integrate cell monitoring, balancing, and for lithium-ion packs, ensuring and longevity in multi-cell configurations. These devices feature advanced capabilities like low-noise 12-bit analog-to-digital converters (ADCs) in products such as the HI-574A series, delivering high with reduced through current-based signal transmission for accurate . In power solutions, high-voltage field-effect transistors (FETs) support up to 650V operation with integrated thermal management to maintain reliability under load. Silicon carbide (SiC) elements, sourced via partnerships like the 2023 Wolfspeed agreement, complement for applications requiring even higher voltages and temperatures. Renesas' analog and power devices find primary use in automotive powertrains for efficient DC-DC conversion and , industrial automation for driving motors with minimal energy loss, and for inverters that maximize solar or harvest.

Connectivity and sensors

Renesas Electronics offers a range of integrated circuits (ICs) for wireless and sensing technologies, emphasizing low-power solutions tailored for (IoT) applications. These products enable efficient data transmission and environmental detection in resource-constrained devices, supporting protocols such as (LE) 5.3, /6E, and (NFC). Enhanced by acquisitions including , Celeno Communications, Panthronics AG, and Semiconductors, Renesas' portfolio addresses the growing demand for seamless, secure in edge devices. In wireless connectivity, Renesas provides LE SoCs like the DA1453x family, which deliver ultra-low power consumption with integrated Cortex-M33 processors for extended battery life in always-on scenarios. These support LE 5.3 for secure pairing and low-energy data exchange, integrating with microcontrollers (MCUs) via standard interfaces such as and I2C to facilitate rapid development. modules, derived from Celeno technology, include the DA16200 ultra-low power SoC, which achieves over a year of battery life for continuously connected devices while supporting protocol for interoperability in smart ecosystems. solutions from Panthronics, such as the PTX130W reader IC, offer high-sensitivity, multi-protocol Forum compliance for applications requiring secure, short-range communication without compromising power efficiency. Renesas' sensor offerings focus on advanced detection technologies, including mmWave radar and optical time-of-flight (ToF) sensors for precise . The RAA270205 mmWave radar transceiver, leveraging Steradian's 4D imaging expertise, features 4 transmit and 4 receive channels operating in the 76-81 GHz band, enabling high-resolution up to 300 meters with low power consumption for automotive advanced driver-assistance systems (ADAS). Optical ToF sensors like the ISL29501 provide long-range distance measurement with integrated signal processing, supporting low-cost, low-power implementations for and proximity sensing. These sensors integrate seamlessly with Renesas MCUs via /I2C, allowing for compact designs in applications. These connectivity and sensor solutions find applications in smart homes for device control and , wearables for health monitoring, and ADAS for enhanced . The portfolio's emphasis on 5G-enabled edge devices has driven adoption in and industrial , where low-latency, secure protocols ensure reliable performance in diverse environments.

Operations

Research and development

Renesas Electronics allocates a substantial portion of its revenue to research and development, with R&D expenses reaching ¥249.6 billion in fiscal year 2024, representing approximately 18.5% of total revenue of ¥1,348.5 billion. This investment underscores the company's commitment to innovation in embedded processing and analog solutions, supporting a global workforce exceeding 21,000 employees, many dedicated to advancing semiconductor technologies. The company's R&D operations are anchored in Japan, with key facilities including the Tokyo headquarters for strategic development and the Naka site for advanced . Internationally, Renesas has expanded its footprint, particularly in , where it inaugurated enhanced R&D centers in and in 2025, employing around 500 staff focused on designing high-performance 3nm system-on-chips (SoCs), with plans to scale to 1,000 employees by year-end. In the United States and , dedicated design centers in locations such as San Jose and emphasize automotive applications and AI development, leveraging local expertise to address regional market needs. Renesas' R&D priorities center on power-efficient semiconductors, edge AI processing for real-time applications, and functional safety in automotive systems compliant with ISO 26262 standards. These efforts are bolstered by strategic collaborations, such as the 2025 memorandum of understanding (MOU) with India's Centre for Development of Advanced Computing (C-DAC) to advance VLSI design and embedded semiconductor systems, fostering innovation through shared resources and talent development. Notable innovations from these initiatives include the unveiling of an in-house 32-bit CPU core in 2023, leading to Renesas' first general-purpose microcontrollers (MCUs) launched in 2024 for low-power embedded applications; integration of (GaN) technology into power devices for higher efficiency in data centers and automotive systems; and active contributions to ecosystems to enhance developer accessibility. These advancements, such as those enabling the power-efficient RA family of MCUs, drive the acceleration of Renesas' multi-year , as detailed in its 2025 Capital Market Day presentations, while yielding over 1,000 patents filed globally on an annual basis to safeguard .

Manufacturing facilities

Renesas Electronics operates five front-end fabrication facilities in , all managed by its Renesas Semiconductor Manufacturing Co., Ltd. These include the Naka Factory in Hitachinaka, ; the Takasaki Factory in , ; the Saijo Factory in Saijo, ; the Kawashiri Factory in , ; and the Kofu Factory in Kai, . The facilities primarily handle processing for microcontrollers, , and power semiconductors. In April 2024, Renesas commenced operations at the reopened Kofu Factory, converting it into a dedicated 300-mm plant for power semiconductors such as insulated gate bipolar transistors (IGBTs). This reopening followed a decision in May 2022 and involved a 90-billion-yen to address surging demand for power devices in electric vehicles (EVs). The move doubles Renesas' power semiconductor production capacity starting in 2025. Renesas' back-end assembly and testing operations are distributed globally, with the largest site at Renesas Semiconductor (Malaysia) Sdn. Bhd. in , , , which handles packaging for analog and discrete . Additional back-end facilities include Renesas Semiconductor Package & Test (Suzhou) Co., Ltd. in , , and operations in , , for assembly and testing of microcontrollers and connectivity devices. In , support facilities in locations such as Oita and Yonezawa provide specialized back-end services for high-value products. The company's manufacturing processes target process nodes from 40 nm to 180 nm, optimized for microcontrollers and analog/power devices, enabling high integration and low power consumption. These nodes support embedded and multi-core architectures suitable for automotive and applications. Renesas emphasizes automotive-grade quality standards, with products qualified under AEC-Q100 for reliability in harsh environments. Following the 2011 Great East Earthquake, which disrupted multiple facilities including Naka, Renesas diversified its by expanding overseas back-end operations and reducing reliance on single-site production. For advanced nodes below 40 nm, Renesas partners with foundries such as to outsource fabrication, combining in-house MONOS flash technology with external capacity. In 2025, amid geopolitical risks like U.S.- trade tensions, Renesas prioritizes resilient sourcing through multi-region procurement and supplier diversification to mitigate disruptions. Renesas' front-end facilities support expansions like Kofu targeting increased output for power semiconductors to support EV market growth.

Corporate affairs

Financial performance

Renesas Electronics reported consolidated of ¥1,348.5 billion for 2024, marking a decline from ¥1,469.7 billion in 2023, primarily due to normalization following the semiconductor supply chain disruptions. In the third quarter of 2025, reached ¥334.2 billion, representing an 8.2% year-over-year decrease attributed to ongoing inventory adjustments in the automotive and sectors. For the full year 2025, the company forecasts in the range of ¥1,300 billion to ¥1,315 billion, reflecting cautious expectations amid market volatility. Profitability metrics for the third quarter of 2025 showed resilience, with a non-GAAP of 57.6% and operating of ¥103.2 billion, supported by reductions and improved product mix despite pressures. Post-acquisition integrations, including those enhancing analog and power capabilities, have shifted emphasis toward EBITDA as a key , with nine-month 2025 non-GAAP EBITDA of ¥336.3 billion. Revenue segmentation in 2025 highlights the automotive at approximately 50% of total (¥476.4 billion for nine months), driven by demand for microcontrollers and SoCs in electric vehicles; the , , and segment accounts for approximately 50% (¥485.8 billion for nine months). Acquisitions such as and have bolstered growth in power and analog devices, adding high-margin contributions to these segments. Key financial metrics as of 2025 include a of 0.58, indicating moderate following debt management post-acquisitions. spending reached ¥175.9 billion for the nine months ended 30, 2025, underscoring investments in embedded processing and applications. On the (TSE: 6723), Renesas' stood at approximately ¥3.43 trillion as of early November 2025 and ¥3.5 trillion as of November 19, 2025. External factors influencing performance in 2025 include yen depreciation, which provided a foreign exchange tailwind estimated at 1-2% of quarterly , and recovery from prior shortages through normalized supply chains. Challenges persist from exploration of a potential sale of the timing device business, valued at up to $2 billion, as part of strategic .

Sustainability and responsibility

Renesas Electronics has established a comprehensive framework to guide its sustainability efforts, including alignment with the (SDGs). The company supports 13 of the 17 SDGs, focusing on areas such as , , clean water, and responsible consumption and production. As part of this commitment, Renesas has set ambitious targets, including achieving usage by 2025 and carbon neutrality by 2040, with its Scope 1 and 2 (GHG) emissions reduction goal of 38% by 2030 (from a 2021 baseline) validated by the (SBTi). In environmental stewardship, Renesas has made notable progress in reducing its carbon footprint, achieving a 21.6% reduction in GHG emissions compared to 2021 levels through energy conservation measures and efficiency improvements. The company also emphasizes water resource management, maintaining a 32% water recycling rate across its operations and investing ¥484 million in 2024 for resource circulation initiatives, including water conservation at fabrication facilities. Additionally, Renesas adheres to a Responsible Minerals Procurement Policy aligned with OECD guidelines to ensure conflict-free sourcing, prohibiting the use of minerals that finance armed conflicts or contribute to human rights violations. On the social front, Renesas promotes diversity, equity, and inclusion (DE&I) with a goal of 30% gender diversity on its Board of Directors, supported by initiatives like the Women's Leadership Initiative pledge and a third consecutive Gold rating from Pride Index Japan for LGBTQ+ inclusion. The company invests in employee development through high-impact leadership and training programs, fostering growth via Employee Resource Groups such as Renesas Pride and Women in Technology. Community engagement includes partnerships in India, such as a 2024 memorandum of understanding with the Ministry of Electronics and Information Technology for chip design training and workforce development, as well as collaborations with institutions like the Indian Institute of Technology Hyderabad; in Japan, efforts involve volunteering and donations totaling over ¥9 million in 2024. Governance practices at Renesas include robust measures, enforced through its Global Anti-Bribery and Anti-Corruption Policy, with mandatory training on anti-corruption procedures and internal audits by the Audit and Sustainability Committee. Supply chain responsibility is upheld via the CSR Deployment Guidebook, which mandates ethical standards, and Renesas earned CDP Supplier Engagement Leader status for the second consecutive year in 2024 through rigorous audits and partner assessments. The company's annual , as detailed in the 2024 Business & Sustainability Report, underscores progress in areas, including the promotion of power-efficient products that contribute to lower energy use in end applications. Key initiatives include the Green Devices program, which certifies semiconductors with at least 10% improvements in resource use, , or chemical reduction compared to standard products; in fiscal 2024, 89% of new development projects qualified as Green Devices, emphasizing low-power microcontrollers for automotive and industrial applications. Renesas also advances principles in semiconductors by maintaining a waste recycling rate above 90% and investing in , though specific partnerships in this area remain integrated into broader efforts.

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