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Macronix

Macronix International Co., Ltd. is a Taiwanese semiconductor company specializing in the design, manufacture, and supply of non-volatile memory (NVM) integrated circuits and related solutions. Founded in 1989 and headquartered in Hsinchu Science-Based Industrial Park, Taiwan, the company operates as an integrated device manufacturer (IDM) with a focus on NOR Flash, NAND Flash, ROM, e.MMC, and specialized products like ArmorFlash for security applications. With approximately 5,530 employees as of recent reports, Macronix serves diverse sectors including , communications, , industrial applications, automotive, networking, and the (IoT), providing high-performance memory solutions for global markets across Asia-Pacific, the Americas, and Europe. The company maintains fabrication facilities, including a 12-inch fab (Fab 5) and an 8-inch fab (Fab 2), supporting advanced technologies such as 19nm NAND Flash and serial NOR Flash densities ranging from 512Kbit to 2Gbit. Key innovations include the introduction of BE-SONOS Flash technology and XtraROM, a mask-programmable , positioning Macronix as a leader in reliable, low-power for systems. It was the first semiconductor firm in to achieve SA8000:2001 social accountability certification and holds ISO 26262 ASIL-D certification for , underscoring its commitment to quality and ethical manufacturing. Founded by Miin Chyou Wu, who serves as chairman and CEO, Macronix emphasizes R&D with numerous patents and global partnerships to drive customer-specific NVM advancements.

Company overview

Founding and mission

Macronix International Co., Ltd. was founded on December 9, 1989, by Miin Wu in Taiwan's , marking it as the nation's first dedicated memory manufacturer. Wu, who served as the company's initial president and later became chairman and CEO, established Macronix with a vision to cultivate domestic expertise amid Taiwan's emerging high-tech ecosystem. From its inception, Macronix focused on developing indigenous technologies, particularly in , to lessen Taiwan's dependence on international suppliers and shift from traditional original equipment manufacturing (OEM) models toward innovative, self-reliant production. This emphasis on home-grown solutions was driven by Wu's efforts to pioneer a "," attracting Taiwanese engineers from abroad to build a robust local . Macronix's core mission is to deliver innovative, customer-oriented system solutions in non-volatile memory by leveraging advanced technology, superior quality, and dependable service, positioning the company as a leading semiconductor supplier. Adopting an integrated device manufacturing (IDM) approach early on, Macronix integrated design, production, and marketing under one roof to ensure control over the entire value chain and foster sustained technological advancement.

Headquarters and facilities

Macronix's headquarters is situated in Hsinchu City, Taiwan, within the Hsinchu Science Park at No. 16, Li-Hsin Road. The company's primary manufacturing facilities are also located in the Hsinchu Science Park. Fab 5, a 12-inch wafer fabrication plant dedicated to advanced processes, is at No. 19, Li-Hsin Road, while Fab 2, an 8-inch wafer fab focused on legacy and specialty production, operates at the headquarters address. These facilities enable end-to-end (IDM) operations from design to fabrication. Macronix's facilities hold the distinction of being the first in to achieve :2001 social accountability .

Products

NOR Flash memory

Macronix offers a comprehensive lineup of NOR products designed for execute-in-place (XIP) applications, where code can be directly executed from the memory without buffering to . These products emphasize capabilities, distinguishing them from block-oriented NAND by enabling efficient storage and execution in resource-constrained environments. Serial NOR Flash from Macronix spans densities from 512Kb to 2Gb and supports operating voltages of 1.2V (1.1V-1.6V range), 1.8V (1.65V-2V), 2.5V/3V (2.7V-3.6V), making them suitable for low-power and standard designs. These devices feature multi-I/O interfaces (up to 8x I/O), dual/quad/octa modes, and clock speeds up to 200MHz for fast read operations, with applications in like wearables and mobile devices, automotive systems for and ECUs, and endpoints for secure code storage and over-the-air updates. Parallel NOR Flash products cover densities from 2Mb to 1Gb, with 3V (2.7V-3.6V) and 5V (4.5V-5.5V) options, including boot block and uniform sector architectures for with legacy microcontrollers. They support x8/x16 bus widths, page and burst read modes, and access times as low as 70ns at 5V, targeting high-performance systems such as controls and networking equipment where interfaces remain prevalent. Specialized variants enhance versatility: OctaBus Memory provides high-speed interfaces with 8 I/O lines and transfer rates up to 500MB/s in densities like 2Gb at 1.8V or 3V, ideal for automotive XIP and OTA applications. Wide Range Vcc Flash operates across 1.65V-3.6V for flexible integration in battery-powered devices, while 1.2V NOR targets ultra-low-power scenarios such as sensors. ArmorFlash is a secure NOR offering advanced data protection features, including unique address scrambling and authentication, compatible with standard serial NOR interfaces, and suitable for security-critical applications in automotive, , and consumer devices. In August 2025, Macronix introduced ArmorBoot, a high-performance member of the ArmorFlash family with enhanced secure boot capabilities. Across the NOR portfolio, key features include high reliability with industrial-grade temperature ranges (-40°C to +85°C), fast read speeds supporting XIP, and endurance of up to 100,000 program/erase cycles, ensuring long-term in demanding environments.

NAND Flash and other memory solutions

Macronix offers a range of memory solutions optimized for high-density , emphasizing reliability and integration in systems. These products include single-level () and serial variants, which provide cost-effective alternatives to NOR by prioritizing and greater storage capacity over random read speeds. Unlike NOR , which excels in execute-in-place applications due to its speed, solutions from Macronix focus on density for applications requiring large data volumes, such as solid-state drives (SSDs) and mobile storage. SLC NAND Flash from Macronix utilizes single-level cells to achieve high endurance and reliability, making it suitable for and automotive environments where is critical. The portfolio includes the MX30LF/MX60LF family operating at 3V with densities from 512Mb to 8Gb, and the MX30UF family at 1.8V supporting 1Gb to 4Gb densities, all fabricated on advanced processes down to 19nm for compact, efficient designs. These devices incorporate features like (ECC) requirements of 8 bits per 512 bytes and support bus widths of x8 or x16, enabling robust performance in sequential read/write operations up to 25 ns. Applications span , automotive systems, and SSDs, where wear-leveling and ECC ensure long-term under harsh conditions. Serial NAND Flash products feature a SPI-compatible with low pin counts, facilitating easy integration into space-constrained devices like wearables and sensors. Available in 3V (MX35L) and 1.8V (MX35U) variants with densities of 1Gb to , these support single, dual, and quad I/O modes for high-speed data transfer up to 166MHz clock rates. The design emphasizes cost-effective storage expansion for embedded applications, including digital TVs, set-top boxes, and routers, with built-in to maintain data accuracy during frequent access cycles. Complementing these, Macronix provides embedded (eMMC) modules that integrate with an onboard controller in a compact BGA package, compliant with eMMC 5.1 standards. Supporting densities from 2GB to 8GB and bus widths up to x8 with HS400 mode for throughput exceeding 400MB/s, eMMC solutions include wear-leveling, power-loss protection, and field updates for enhanced reliability in mobile devices, systems, and networking equipment. Known Good Die (KGD) offerings focus on bare SLC dies, such as the MX30UF4G28ADWG at 4Gbit , pre-tested for functionality, endurance, and to streamline system-in-package () assembly. These support industrial temperature ranges from -40°C to +105°C and are applied in devices, automotive modules, and portable electronics, reducing integration risks through Macronix's quality controls. LybraFlash represents a specialized -based solution that delivers NOR-like performance for secure, high-capacity storage in automotive applications. With densities of 1Gb to 2Gb, interfaces supporting quad I/O at 104MHz for ~50MB/s read throughput, and an embedded engine, it minimizes hardware modifications while providing robust endurance and for code storage in and control systems. Additionally, Macronix's XtraROM® serves as a flexible mask-programmed (ROM) alternative, enabling customizable serial ROM production without traditional mask ROM limitations. This solution preserves cost advantages and high quality for applications like electronic toys, printers, and game cartridges, offering in-house programming for efficient delivery.

History

Establishment and early years (1989–2000)

Macronix International Co., Ltd. was incorporated on December 9, 1989, in Taiwan's , marking it as the island's first dedicated firm. The company commenced operations that same month, initially focusing on Mask ROM production to address the growing demand for in and devices. This establishment aligned with Taiwan's push to build a domestic ecosystem, leveraging the Science Park's for and fabrication. In the early 1990s, Macronix expanded its product lineup by shifting toward EPROMs alongside Mask ROMs, enabling programmable non-volatile storage solutions that gained traction in industrial and embedded applications. By 1997, the company had achieved global supplier status, dominating segments of the Mask ROM and EPROM markets through efficient manufacturing and strategic partnerships, such as joint development efforts with Japanese firms like NKK Corporation starting in 1990. These developments were supported by key operational milestones, including the start of construction on its first 6-inch wafer fab (Fab 1) in 1990 and the initiation of production there in 1991, which laid the groundwork for scaled output. Facing early challenges in a semiconductor landscape reliant on foreign technology transfers, Macronix prioritized building in-house R&D capabilities to foster home-grown innovations in and fabrication processes. This included securing initial patents, such as the U.S. flat patent in 1992, which improved and efficiency in non-volatile arrays. efforts advanced with ISO 9002 certification in 1993 and ISO 9001 in 1995, enhancing reliability and international competitiveness. By the late , process technology upgrades—from 0.45 µm to 0.4 µm in 1996 and to 0.32 µm in 1998—supported the establishment of basic 8-inch operations, transitioning toward higher-volume production while maintaining focus on ROM and technologies.

Expansion and key milestones (2001–present)

In the early 2000s, Macronix marked its entry into the market by developing Serial NOR technologies, beginning mass production of 150nm 3V Serial Flash products in June 2005 to address growing demand for storage solutions. Concurrently, the company upgraded its logic process technology from 0.5μm to 0.35μm in 2001, enabling more efficient fabrication of ROM and related devices. These advancements were complemented by the achievement of certification in 2002, affirming Macronix's focus on occupational health and safety standards across its operations. From 2006 to 2010, Macronix accelerated its innovations, launching the world's first 256Mbit Serial in October 2009, which incorporated a novel 32-bit addressing scheme to extend density while maintaining compatibility with existing interfaces. The company also entered the business during this period, presenting its initial 3D technical paper at the 2006 VLSI Technology Symposium and advancing toward commercial products. By 2010, Macronix acquired and unveiled Fab 5, a 12-inch facility that significantly expanded its scale, contributing to a milestone of reaching 100,000 wafers per month in overall capacity as part of subsequent fab optimizations. Between 2011 and 2015, Macronix introduced BE-SONOS technology, a bandgap-engineered silicon-oxide-nitride-oxide-silicon structure optimized for high-density , with initial testing at 75nm half-pitch in 2007 and formal recognition by 2011. This period saw robust growth in automotive applications, culminating in cumulative shipments of 100 million AEC-Q100 qualified devices by 2016, underscoring the reliability of Macronix's memory solutions in vehicular systems. The operational ramp-up of the 12-inch Fab 5, acquired in 2010, further supported these expansions by enabling volume production of advanced nodes like 55nm Serial . Since 2016, Macronix has advanced its NAND capabilities with the start of 19nm 3V mass production in 2019, targeting cost-effective, high-reliability storage for and uses. In 2024, President Chih-Yuan Lu received the George E. Pake from the in recognition of his contributions to materials and devices. In 2024, Macronix introduced the world's first 3D NOR , showcased at electronica 2024, enabling higher densities and for applications. In 2025, the company achieved of 45nm 1.8V in July and began sampling 55nm 1.2V in August, enhancing for next-generation applications. In October 2025, President Chih-Yuan Lu received the Future Science from the Future Science Prize Foundation for advancements in materials and devices. Sustainability efforts gained prominence with certifications like CG6002 for in 2007, alongside ongoing recognitions for environmental management.

Technology and innovation

Core technologies

Macronix's core technologies center on innovative architectures and process advancements that enhance the performance, reliability, and scalability of its solutions. A pioneering is BE-™ (Bandgap Engineered SONOS), a charge-trapping device developed in 2010 for 3D architectures. This employed a simple structure that facilitated vertical stacking of memory cells, enabling scalability beyond 10nm nodes while maintaining high reliability through improved endurance characteristics, such as demonstrated in sub-20nm prototypes with robust program/erase cycling. In recent years, Macronix has advanced to 3D NOR Flash technology, which uses vertical stacking to achieve higher densities and overcome 2D scaling limitations. As of 2025, this innovation supports capacities up to 32GB in embedded applications, improving performance for code execution in automotive and devices. In terms of advanced process nodes, Macronix utilizes a 19nm process for its flash , which allows for higher densities and cost-effective scaling compared to larger nodes, supporting capacities up to 8GB in single-level (SLC) configurations. For low-voltage Serial NOR flash, the company employs 45nm and 55nm processes, which optimize power efficiency by reducing operating voltages to as low as 1.65V while achieving densities up to , thereby extending battery life in power-constrained applications. Interface innovations further distinguish Macronix's technologies, particularly the OctaBus interface for NOR flash, which utilizes an 8 I/O configuration to deliver up to 8 times faster data transfer rates than traditional single I/O , reaching read throughputs of 500 MB/s at 250 MHz clock speeds while maintaining with standard Serial NOR protocols. Complementing this, Macronix's Serial NAND flash incorporates compatibility, allowing seamless integration with existing interfaces through support for single, dual, and quad I/O modes up to 166 MHz, simplifying design without requiring specialized controllers. To ensure reliability, especially in demanding environments, Macronix integrates error correction codes () and wear-leveling algorithms into its automotive-grade solutions. These features mitigate bit errors through on-chip capable of correcting multiple bits per sector and distribute program/erase cycles evenly across blocks to prevent premature wear, meeting AEC-Q100 Grade 1 standards for operation from -40°C to +125°C and supporting extended lifetimes in systems.

Research, patents, and awards

Macronix maintains a substantial (R&D) operation, employing over 1,700 R&D and technical personnel as of , representing a significant portion of its total workforce of approximately 3,800 employees as of end . The company invests heavily in innovation, allocating around 20-26% of its annual revenue to R&D in recent years, with expenditures reaching NT$6.73 billion in 2024 alone. These efforts are supported by advanced facilities in Taiwan's , including design centers such as Mxtran Inc. for development, alongside fabrication plants like FAB 5 for 12-inch processing and dedicated testing buildings. The company's intellectual property portfolio underscores its focus on (NVM) advancements, with over 9,500 s approved globally by the end of 2024, spanning NVM design, fabrication processes, and reliability enhancements. Key examples include patents on Serial Flash interfaces, such as those enabling ultra-low-power operations in NOR Flash devices, and 3D stacking methods, exemplified by innovations in 3D NOR array architectures (US8630114B2) and early 3D NAND cell technologies that enable vertical scaling for higher density. Macronix filed 309 new patent applications in 2024, with more than 1,300 pending worldwide, primarily in regions like the (over 3,500 patents), (over 3,300), and (over 2,300). Macronix contributes actively to the academic and technical community through publications on memory scaling and low-power technologies, with papers presented at prestigious conferences including the International Electron Devices Meeting (IEDM), International Solid-State Circuits Conference (ISSCC), VLSI Symposia, and International Memory Workshop (IMW). These works highlight advancements in NVM efficiency and integration, drawing from the company's ongoing R&D in and standalone solutions. Macronix and its leadership have received notable recognitions for innovation and governance. In 2025, President Chih-Yuan Lu was awarded the Future Science Prize in for pioneering developments in non-volatile technologies, including cell density improvements and device reliability. Lu also received the 2024 George E. Pake Prize from the for outstanding contributions to physics in . On the corporate level, Macronix ranked in the top 10% of companies in the Stock Exchange's 2021 Corporate Governance Evaluation, reflecting strong practices in and . Additional honors include multiple EE Awards Asia for best memory products, such as the 2024 award for the ArmorBoot MX76 solution.

Leadership and governance

Executive team

Miin Wu founded Macronix International Co., Ltd. in 1989 and has served as its Chairman since March 2005, while also acting as CEO to oversee the company's overall strategy and operations. With over 30 years in the , including senior roles at VLSI Technology Inc., Intel Corp., , and Siliconix Inc., Wu holds an M.S. in Material Science & Engineering from and has driven Macronix's growth into a leading (IDM) focused on . Chih-Yuan Lu has been of Macronix since July 2007, leading its technical direction with a Ph.D. in Physics from and more than 30 years of experience in , including prior positions as of Vanguard International Semiconductor Corp. and Deputy General Director at ERSO/ITRI. Lu joined Macronix in 1999 as Senior Executive Advisor and CTO, contributing to advancements in technologies. He is a recipient of multiple awards for innovations, such as the 2012 IEEE Frederik Award and the 2024 George E. Pake Prize from the . Dang-Hsing Yiu serves as Senior Vice President and , managing marketing, sales, and business development strategies. Holding an M.S. in from the , Yiu has been with Macronix since 1990 in various leadership roles, including Vice President and Chief Operating Officer, and previously worked at Inc. while holding over 100 patents in memory IC design and operations. Wen-Sen Pan is Vice President of the Microelectronics and Memory Solution Group, responsible for operations including and backend IC production management. With a Ph.D. in from , Pan joined Macronix in 1996 to help establish its 8-inch fab and has advanced through roles from Department Manager to . The executive team's long-term stability, particularly under Wu and Lu's leadership since the company's founding and early expansion, has been instrumental in transforming Macronix from a startup into a prominent leader in NOR Flash and other solutions.

Corporate governance

Macronix International Co., Ltd. operates under a robust framework designed to promote , , and ethical decision-making. The , the highest body, comprises 14 members, including 5 independent directors (35.71%), as elected at the May 23, 2025, shareholders' meeting for a term from May 23, 2025, to May 22, 2028. New independent directors elected in 2025 include Huey-Jen Su and Hsuan-Lien Chu, alongside incumbents Tyzz-Jiun Duh, Chiang Kao, and Chien-Kuo Yang. Chaired by Miin Wu since 2005, directors complete governance training, with all completing at least 6 hours in 2024 through programs offered by the . To support specialized functions, the board has established key standing committees, including the Audit Committee, Compensation Committee, and Nomination Committee. The Audit Committee, consisting of 4 independent directors (Tyzz-Jiun Duh, Chiang Kao, Yan-Kuin Su, and John C.F. Chen), convenes at least quarterly—holding 6 meetings in 2024 with full attendance—to evaluate financial statements, internal controls, and compliance with legal requirements. The Compensation Committee, formed in 2005 and comprising 3 independent directors (effective May 23, 2025: Tyzz-Jiun Duh, Chiang Kao, and Huey-Jen Su), meets at least twice annually (3 meetings in 2024) to review executive compensation policies aligned with performance and risk. The Nomination Committee, established on January 22, 2019, and also with 3 independent directors under an independent chair, held 3 meetings in 2024 to assess director qualifications and succession planning. Additionally, a Sustainable Development Committee, created in February 2022, integrates ESG considerations into board deliberations. Macronix demonstrates strong compliance with regulatory and international standards to uphold operational integrity. As a listed company on the (TSE: 2337), it adheres to all applicable TSE listing rules, including timely disclosure of material information via the Market Observation Post System. The company holds ISO 9001 certification for quality management systems and has maintained ISO 14001 for environmental management since 1997 across its fabrication facilities, testing buildings, and management centers. Occupational health and safety compliance is evidenced by certification (transitioned to ), earning an Award of Excellence in 2024, alongside other standards like IECQ QC 080000 and for . Sustainability forms a core pillar of Macronix's governance, with dedicated ESG reporting initiated in 2021 in alignment with (GRI) standards. The company enforces ethical supply chains by adhering to the Responsible Business Alliance (RBA) Code of Conduct, conducting on suppliers, and prohibiting the use of conflict minerals such as , tin, , and gold, validated through independent smelters and refiners. Employee welfare is safeguarded via certification for social accountability, emphasizing fair labor practices and . In its fabrication facilities, environmental initiatives include a commitment to by 2050, expanded procurement, and NT$273,719,000 invested in in 2024, resulting in 367,365.479 metric tons of CO2e greenhouse gas emissions (Scopes 1 and 2) and recognition for Green Procurement Excellence. The shareholder structure reflects broad institutional participation, supporting stable . As a publicly traded entity on TSE: 2337, Macronix emphasizes transparent financial reporting through quarterly results, annual reports, and disclosures on its platform and the TSE's systems. Major institutional investors include Fuh Hwa Securities Co., Ltd. (6.45% ownership, or 119,617,000 shares as of 2024) and Cathay Life Insurance Co., Ltd. (1.83% as of June 30, 2024), alongside entities like MegaChips Corporation via its subsidiary Shun Yin Investment Ltd. This structure facilitates shareholder engagement, including annual meetings and dividend policies, while prioritizing long-term value creation.

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