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Shallow trench isolation

Shallow trench isolation (STI) is a semiconductor fabrication technique used to electrically isolate adjacent active devices, such as transistors, on a silicon wafer by etching shallow trenches into the substrate and filling them with an insulating dielectric material, typically silicon dioxide (SiO₂).^[1] This method prevents current leakage between devices, enabling higher integration densities in complementary metal-oxide-semiconductor (CMOS) integrated circuits.^[2] The process begins with the deposition of a pad oxide layer and a silicon nitride mask, followed by photolithography and reactive ion etching (RIE) to define trenches approximately 250–400 nm deep.^[1] A thin liner oxide is then thermally grown on the trench sidewalls, the trenches are filled with high-density plasma (HDP) oxide or tetraethylorthosilicate (TEOS), and the surface is planarized using chemical mechanical polishing (CMP) to remove excess material and achieve a flat topography.^[3] Developed as a solution to the limitations of earlier isolation methods like local oxidation of silicon (LOCOS), STI was first conceptualized in the early 1980s to address issues such as lateral oxide encroachment and poor scalability.^[4] Key advancements were demonstrated in 1988 by researchers at IBM, including B. Davari et al., who introduced a variable-size STI structure with diffused sidewall doping for submicron CMOS technologies, marking a pivotal step toward practical implementation.^[5] Widespread adoption occurred in the late 1990s, driven by progress in CMP and RIE equipment; for instance, Toshiba initiated mass production for dynamic random-access memory (DRAM) in 1996, while IBM applied it to 0.35 μm nodes.^[4] By the early 2000s, STI had become the industry standard for advanced ultra-large-scale integration (ULSI) processes below 0.25 μm.^[3] Compared to LOCOS, which suffers from "bird's beak" formation that consumes active silicon area and creates non-planar surfaces, STI offers independent control of isolation depth and width, superior planarity for lithography alignment, and enhanced resistance to latch-up phenomena.^[1] These benefits facilitate device scaling, reduced parasitic capacitance, and improved electrical performance in high-density circuits like microprocessors and memory devices.^[2] However, STI introduces challenges such as mechanical stress from the oxide fill, which can affect carrier mobility in narrow channels, often mitigated through optimized liner processes or stress-relief techniques.^[3] As of 2025, STI remains essential in sub-10 nm nodes, including 3 nm and 2 nm processes with gate-all-around field-effect transistors (GAAFETs).^[6]

Overview

Definition and Purpose

Shallow trench isolation (STI) is a planar isolation technique used in semiconductor manufacturing to electrically separate active device regions in integrated circuits. It involves etching shallow trenches, typically 0.25–0.35 μm deep, into the silicon substrate and filling them with an insulating dielectric material, such as silicon dioxide, followed by planarization to create a flat surface.^[1] This method ensures precise definition of active areas while minimizing topographic variations that could complicate subsequent processing steps.^[2] The primary purpose of STI is to prevent parasitic current leakage between adjacent transistors in complementary metal-oxide-semiconductor (CMOS) devices, which is crucial for maintaining signal integrity and avoiding unintended electrical interactions. By providing a robust barrier of insulating material, STI suppresses the formation of parasitic bipolar transistors that can lead to latch-up—a low-impedance path causing device failure under certain conditions.^[1] This isolation is essential for the reliable operation of high-density integrated circuits, where closely packed components increase the risk of such parasitic effects.^[7] STI became the standard isolation approach for CMOS technology nodes at and below 250 nm, where traditional methods like local oxidation of silicon (LOCOS) failed to scale effectively due to issues such as bird's beak encroachment limiting feature sizes.^[8] Its adoption enabled continued device miniaturization and performance improvements in ultra-large-scale integration (ULSI) circuits.^[2]

Relation to Device Isolation Techniques

In integrated circuits, electrical isolation between active devices is essential to prevent parasitic interactions mediated by the substrate, such as latch-up in complementary metal-oxide-semiconductor (CMOS) structures, where unintended thyristor action can lead to destructive current paths.^[9] This isolation ensures that neighboring transistors operate independently, minimizing leakage currents and maintaining signal integrity across the chip.^[9] Early isolation techniques relied on junction isolation, pioneered by Kurt Lehovec in the mid-1950s through the use of reverse-biased p-n junctions to separate devices on a shared silicon substrate, initially for bipolar integrated circuits.^[10] This method effectively blocks substrate conduction by leveraging the depletion regions of doped junctions, thereby reducing risks like latch-up in multi-device layouts.^[11] However, junction isolation introduces significant parasitic capacitances at the isolating junctions, which degrade high-frequency performance and increase power consumption, while also consuming substantial chip area due to diffusion requirements, limiting overall device density.^[11]^[12] By the 1970s, local oxidation of silicon (LOCOS) emerged as the dominant isolation method for MOS technologies, involving selective thermal oxidation masked by silicon nitride to form thick field oxides that electrically separate devices.^[8] LOCOS provided better planarity and isolation than junction methods but suffered from bird's beak encroachment, where lateral oxide growth under the mask edges reduced active area and caused non-planar surfaces, restricting scalable pitches to approximately 1.2–1.5 μm and hindering further miniaturization.^[13] These geometric limitations, combined with field oxide thinning in narrow regions, made LOCOS unsuitable for sub-micron feature sizes, as they exacerbated stress and leakage issues during scaling.^[14] The shift to shallow trench isolation (STI) in the 1990s addressed these shortcomings by etching trenches into the silicon and filling them with dielectric material, enabling planar topography and isolation widths below 0.4 μm for pitches under 250 nm.^[8]^[9] This technique eliminated bird's beak effects and allowed independent control of trench depth and width, facilitating tighter device spacing and supporting the continued scaling of transistor density in line with Moore's Law for advanced nodes.^[9]

History

Early Development

Shallow trench isolation (STI) was conceptualized in the early 1980s as semiconductor device dimensions approached submicron scales, driven by the need to overcome limitations of the prevailing local oxidation of silicon (LOCOS) method.^[1] LOCOS suffered from non-planar topography due to oxide overgrowth and the "bird's beak" effect, which encroached on active areas and hindered scaling below 1 μm by reducing available device space and complicating subsequent lithography steps.^[15] These issues motivated the pursuit of planar isolation techniques capable of supporting feature sizes of 0.5 μm and smaller in complementary metal-oxide-semiconductor (CMOS) technologies.^[1] IBM researchers led the initial development of STI in the late 1980s, with the first detailed demonstration presented in a seminal 1988 paper by B. Davari and colleagues. Their approach involved etching shallow trenches into the silicon substrate using reactive ion etching (RIE), filling them with chemical vapor deposition (CVD) oxide, and achieving surface planarization to maintain uniformity across the wafer. To mitigate parasitic sidewall inversion and leakage in n-channel metal-oxide-semiconductor field-effect transistors (nMOSFETs), they introduced a novel boron diffusion technique for sidewall doping, which also minimized channel width bias and narrow-channel effects. Early prototypes from this IBM work focused on enabling isolation widths under 1 μm, integrating STI into a minimum interaction twin-tub (MINT) cell for 16-Mb dynamic random-access memory (DRAM) fabrication. The process allowed self-aligned boron doping to the n-well using a single masking step in CMOS integration, demonstrating reliable electrical isolation without the topographic irregularities of LOCOS. This pioneering effort established STI as a viable path for high-density scaling, with trench depths typically around 0.3-0.4 μm to balance isolation effectiveness and process simplicity.

Industry Adoption

Shallow trench isolation (STI) saw widespread adoption in the semiconductor industry during the late 1990s, particularly with IBM's integration into its 0.25 μm CMOS logic processes, which enabled high-density embedded SRAM cells and advanced metallization.^[16] By the early 2000s, STI had become the standard isolation technique for technology nodes at or below 250 nm, replacing earlier methods in both logic and memory fabrication facilities due to its scalability for sub-micron devices.^[8]^[17] A primary driver for this adoption was STI's compatibility with chemical-mechanical planarization (CMP), a process invented by IBM in 1983 that provides superior surface flattening essential for precise lithography in advanced nodes.^[18] This planarization capability minimized topography variations after trench filling, allowing reliable patterning of finer features without the bird's beak encroachment issues of prior isolation techniques.^[19] Key industry milestones included the 1996 International Electron Devices Meeting (IEDM) presentation by Chatterjee et al., which demonstrated STI integration for 0.25/0.18 μm CMOS technologies using high-density plasma oxide filling, highlighting manufacturability for high-performance applications.^[20] For instance, Toshiba adopted STI for mass production of DRAM in 1996, marking an important step in memory fabrication.^[4] By 2000, STI had achieved full replacement of local oxidation of silicon (LOCOS) in production fabs for deep sub-0.5 μm processes, driven by its ability to support denser transistor packing in logic and memory chips.^[19]

Operating Principle

Isolation Mechanism

Shallow trench isolation (STI) provides physical and electrical separation of active device regions in integrated circuits by etching narrow trenches into the silicon substrate surrounding these areas. The trenches are typically lined with a thin thermal oxide layer, serving as a liner to protect and passivate the exposed silicon sidewalls, preventing defects that could lead to leakage. These trenches are then completely filled with a dielectric material, most commonly silicon dioxide (SiO₂), which forms a robust barrier that blocks current flow through the underlying substrate between neighboring devices. This structural design ensures that active silicon regions remain isolated without encroaching on the device footprint, enabling higher packing densities compared to earlier isolation methods.^[9]^[1] The core isolation mechanism of STI exploits the superior insulating properties of the filler dielectric. Silicon dioxide possesses an exceptionally high electrical resistivity, greater than $10^{14} \, \Omega \cdot \mathrm{cm}, which effectively suppresses the lateral diffusion of charge carriers across the trench, maintaining electrical independence between adjacent transistors even under bias conditions. Furthermore, the trench depth is engineered to penetrate sufficiently deep into the substrate—typically extending beyond the doped well boundaries—to interrupt potential parasitic conduction paths without relying solely on p-n junction depletion for isolation. This combination of material resistivity and vertical geometry provides reliable device-to-device separation, minimizing risks such as latch-up in CMOS circuits.^[21]^[22] Geometrically, STI trenches in sub-100 nm CMOS processes developed in the early 2000s featured widths of 0.1 to 0.3 μm, allowing for compact layouts while preserving isolation integrity. To reduce mechanical stress concentrations that could induce defects or degrade carrier mobility at the silicon-dielectric interface, the upper corners of the trenches are rounded during processing, distributing stress more evenly across the structure. This design optimization enhances overall reliability without compromising the isolation effectiveness. In advanced nodes beyond 10 nm as of 2025, trench widths have scaled down further to support continued device miniaturization.^[1]^[9]

Electrical Properties

Shallow trench isolation (STI) provides excellent electrical isolation with very low leakage currents, typically below 10^{-12} A/μm at biases up to 5 V, enabling reliable device performance in sub-micron CMOS technologies.^[23] This low leakage arises from the planar dielectric fill that minimizes edge defects and parasitic paths, resulting in off-state currents less than 1 pA/μm for 0.25 μm MOSFETs at 2.5 V supply.^[23] Compared to LOCOS isolation, STI offers superior performance by significantly reducing parasitic junction capacitance, which lowers overall power consumption and improves switching speeds in integrated circuits.^[24]^[25] Key electrical metrics of STI include a breakdown voltage exceeding 15 V for isolation structures, ensuring robustness against high-voltage transients in standard CMOS processes.^[26] This high breakdown capability supports reliable operation without premature failure, even under reverse bias conditions. Additionally, STI allows isolation spacing to scale down to 0.1 μm while maintaining off-state currents without significant increases, facilitating denser device layouts in advanced nodes beyond 0.13 μm technologies.^[27] Regarding device-level effects, STI has minimal influence on threshold voltage in wide-channel transistors, preserving nominal operation. However, in narrow channels (below 0.5 μm), STI-induced effects can lead to reverse narrow width behavior, where threshold voltage decreases with shrinking width due to stress and diffusion enhancements at the isolation edges.^[28] These narrow channel effects are noted but do not compromise overall isolation integrity in typical applications.

Fabrication Process

Key Processing Steps

The fabrication of shallow trench isolation (STI) structures occurs early in the front-end-of-line processing of complementary metal-oxide-semiconductor (CMOS) devices, typically after substrate preparation and well formation but before gate stack deposition, to define active regions and prevent electrical crosstalk between transistors.^[29] The process begins with the growth of a thin pad oxide layer, usually 10-20 nm thick, on the silicon substrate via thermal oxidation; this layer serves as a stress-relief buffer between the substrate and the subsequent hard mask.^[30] Following this, a silicon nitride layer, approximately 100-200 nm thick, is deposited using low-pressure chemical vapor deposition (LPCVD) to act as an etch mask and chemical mechanical polishing (CMP) stop layer.^[31]^[30] Next, photolithography patterns the nitride layer to outline the trench locations, followed by an anisotropic dry etch to form the trenches. This etch sequentially removes the exposed nitride and pad oxide, then penetrates 250-350 nm into the silicon substrate using a reactive ion etching process, employing a chlorine-based plasma, such as a Cl₂/HBr mixture, to achieve vertical sidewalls and minimal lateral undercutting.^[1]^[32] After resist stripping and cleaning, a thermal oxidation step grows a thin liner oxide layer, typically 5-10 nm thick, on the trench sidewalls and bottom to repair etch-induced damage and round sharp corners, thereby reducing stress concentration.^[1] The trenches are then filled with a high-density plasma chemical vapor deposition (HDP-CVD) silicon dioxide dielectric to provide electrical isolation, ensuring void-free filling even in high-aspect-ratio features.^[33] Excess oxide is removed via CMP, which planarizes the surface and stops on the nitride layer, resulting in a flat topography for subsequent processing.^[31] An optional variation involves angled ion implantation along the trench sidewalls prior to liner oxidation, using species like germanium or silicon to amorphize the surface and suppress crystalline defects during subsequent thermal steps.^[34] The nitride and pad oxide layers are later stripped after STI completion, but these removal steps fall outside the core trench formation sequence.^[31] This overall flow enables scalable isolation for sub-micron CMOS technologies while minimizing parasitic effects.^[2]

Materials and Deposition Methods

Shallow trench isolation (STI) fabrication begins with a silicon substrate, typically single-crystal silicon, which serves as the foundational material for etching the isolation trenches. A thin thermal silicon dioxide (SiO₂) liner, grown via thermal oxidation, is then formed on the trench walls and bottom to passivate the exposed silicon surface, mitigating defects and stress concentrations during subsequent processing steps.^[35] This liner is typically 5-10 nm thick and provides electrical isolation while protecting the silicon lattice. Additionally, a silicon nitride (Si₃N₄) hard mask, deposited prior to trench etching, defines the trench pattern and acts as an etch stop layer, with thicknesses around 100-200 nm to ensure precise control over the isolation regions.^[36] The primary dielectric fill material for STI is high-density plasma (HDP) SiO₂, which enables void-free deposition in high-aspect-ratio trenches exceeding 2:1, critical for sub-0.25 µm nodes where narrow, deep trenches (aspect ratios up to 5:1) are common.^[37] HDP chemical vapor deposition (HDP-CVD) is the dominant method for this fill, employing a plasma-enhanced process with precursor gases including silane (SiH₄), oxygen (O₂), and argon (Ar) at substrate temperatures of 400-600°C to achieve conformal, dense oxide coverage without keyhole voids.^[38] The simultaneous deposition and sputter-etch capability of HDP-CVD, facilitated by the argon plasma, ensures gap-fill integrity by redepositing sputtered material on trench sidewalls, making it suitable for aggressive scaling.^[39] Alternative approaches include sub-atmospheric chemical vapor deposition (SACVD) using tetraethylorthosilicate (TEOS) precursors at similar or slightly higher temperatures (around 400-500°C), which provides good step coverage for less demanding aspect ratios but may require additional optimization for void-free fills in advanced nodes.^[40] Following deposition, post-fill annealing is performed in a nitrogen ambient at 900-1100°C to densify the oxide, enhance its mechanical stability, and relieve intrinsic stresses induced by the plasma process or thermal mismatch with the silicon substrate.^[41] This high-temperature treatment, often lasting 30-60 minutes, improves the film's dielectric properties and reduces void-related defects, ensuring reliable isolation performance.^[42] Such annealing steps are essential for integrating STI with subsequent CMOS layers without compromising yield.

Advantages and Limitations

Benefits Compared to LOCOS

Shallow trench isolation (STI) provides significant scalability advantages over local oxidation of silicon (LOCOS) by eliminating the bird's beak effect, which causes lateral oxide encroachment under the masking nitride in LOCOS processes. This encroachment in LOCOS typically limits isolation pitches to 1-2 μm, as the bird's beak length can extend 0.5 μm or more per side for field oxides around 0.5 μm thick, consuming valuable active area and hindering further miniaturization.^[43] In contrast, STI etches trenches directly into the silicon substrate and fills them with dielectric material, enabling reliable isolation pitches below 0.5 μm without such lateral diffusion, making it essential for sub-micron CMOS technologies.^[19] This scalability supports the progression to advanced nodes, such as 0.25 μm and below, where LOCOS becomes impractical due to field oxide thinning and increased leakage risks.^[9] Another key benefit of STI is its superior planarity, achieved through chemical mechanical polishing (CMP) of the deposited oxide fill, which results in a virtually flat wafer surface post-processing. LOCOS, by contrast, produces substantial topography variations of 0.5-1 μm between the elevated field oxide regions and the planar active areas, complicating alignment and lithography in multilevel interconnects and potentially leading to depth-of-focus issues in photolithography tools.^[19] The recessed nature of STI trenches, combined with CMP, minimizes these height differences to near zero, improving yield and process control in high-density layouts.^[44] This enhanced planarity is particularly valuable in logic IC fabrication, where precise overlay is critical for gate patterning and contact formation. Furthermore, STI delivers notable density gains by maximizing the utilization of silicon real estate, increasing the active area available for transistors by 20-30% compared to LOCOS in typical layouts. The absence of bird's beak encroachment in STI preserves more silicon for device channels and reduces the overall footprint of isolation structures, allowing tighter packing of transistors in logic integrated circuits. This improvement directly translates to higher circuit density and performance, enabling more complex designs within the same die area, a factor that drove the widespread adoption of STI starting in the late 1990s for 0.25 μm and finer technologies.^[19]

Technical Challenges

One of the primary technical challenges in shallow trench isolation (STI) arises from the compressive stress induced by the silicon dioxide (SiO₂) fill material, which can reach up to 500 MPa due to the volume expansion during thermal oxidation and differences in thermal expansion coefficients between silicon and SiO₂.^[9] This stress is particularly pronounced in narrow channels, leading to a threshold voltage shift (ΔV_t) of a few tens of millivolts, which degrades transistor performance by altering carrier mobility and bandgap narrowing.^[45]^[46] To mitigate these effects, techniques such as stress liners (e.g., contact etch-stop layers) and selective etch-back processes are employed to relieve localized stress at trench edges.^[47] Defect formation represents another significant issue in STI fabrication, particularly at trench corners where incomplete oxide fill can create parasitic transistors that enable unwanted leakage currents.^[48] These parasitic structures arise from sharp corners or voids during high-density plasma deposition, lowering the threshold voltage of edge devices and increasing off-state leakage. Additionally, divots—depressions formed post-chemical mechanical polishing (CMP)—expose the silicon surface, resulting in gate oxide thinning and heightened electric field stress, which can cause reliability failures such as time-dependent dielectric breakdown.^[49] The incorporation of STI also elevates fabrication costs through added process complexity, primarily from the anisotropic etch for trench formation and subsequent CMP for planarization, which introduce additional steps compared to earlier isolation methods.^[15] These extra operations require specialized equipment for precise control of etch depth and oxide fill uniformity, increasing overall manufacturing overhead and yield risks in scaled nodes.^[19]

Applications

Use in CMOS Integration

Shallow trench isolation (STI) is integral to CMOS integration, primarily by defining the active areas for NMOS and PMOS transistors within their respective wells. In the standard CMOS process flow, trenches are etched into the silicon substrate to delineate these active regions, preventing electrical interference between devices while allowing selective dopant implantation to form p-wells for NMOS and n-wells for PMOS structures. This precise definition of active areas supports the twin-tub process, where separate wells enable complementary operation essential for mixed-signal integrated circuits that combine analog and digital functions.^[50] STI integrates seamlessly with backend-of-line processes, including dual-damascene metallization for copper interconnects, as its planar surface facilitates subsequent deposition and patterning steps without introducing topography-related defects. This compatibility ensures STI can be incorporated into conventional CMOS fabrication without requiring modifications to metallization schemes, maintaining overall process efficiency. In logic applications, such as microprocessors, STI provides the isolation needed for dense transistor packing, enabling high-performance computing circuits by minimizing parasitic effects at device boundaries. For memory devices like DRAM, STI supports compact cell layouts, reducing the footprint of isolation regions and improving scalability in high-density arrays. These applications leverage STI's ability to handle submicron dimensions while preserving device integrity.^[51]^[52] A key performance benefit of STI in CMOS is its reduction of isolation-related capacitance compared to earlier LOCOS methods, which enhances switching speeds and lowers dynamic power dissipation in integrated circuits. This capacitance advantage stems from STI's vertical isolation profile, which limits overlap between active areas and field regions.^[53]

Evolution in Advanced Nodes

As semiconductor manufacturing scales to sub-10 nm nodes, shallow trench isolation (STI) faces significant challenges due to increased stress effects on 3D transistor structures like FinFETs. STI-induced compressive stress primarily impacts the sidewalls of the fins, leading to asymmetric stress distributions that degrade carrier mobility. For instance, in n-type FinFETs, this stress can cause up to 10% degradation in electron mobility, particularly when tensile gate stacks are used, as fin widths narrow.^[54] Such effects are more pronounced in narrow fins.^[55] To address these scaling challenges, process optimizations such as nitride liners deposited on STI walls have been widely adopted to reduce compressive stress and mitigate mobility degradation. These liners, often formed via nitridation of the STI oxide, help balance stress on the fin channels, improving drive current stability.^[55] Additionally, the transition to gate-all-around (GAA) architectures, as implemented in nodes below 5 nm, partially alleviates STI stress issues by encircling the channel more uniformly, though STI remains essential for isolating adjacent fins or nanosheets. In GAA nanosheet FETs, STI formation occurs after fin reveal, with liners ensuring minimal interference with stacked channel mobility.^[56] Recent advancements in STI for advanced nodes incorporate process optimizations to minimize stress and parasitic effects. These techniques have enabled reliable isolation in high-density logic, supporting performance gains in production chips at 3 nm and beyond.^[57] As of 2025, STI continues to be adapted for 2 nm GAA nanosheet processes, including low thermal budget isolation steps compatible with nanosheet stacking and backside power delivery schemes.^[58] Looking ahead, STI is expected to remain the cornerstone for isolation in 5 nm and larger logic processes, but emerging trends point to evolutions like enhanced nanosheet-specific isolation or selective deep trench alternatives for ultra-scaled or high-voltage applications. In stacked nanosheet GAA devices, optimizations such as full bottom dielectric isolation via SiGe liners are being explored to eliminate residual STI stress, potentially shifting away from conventional STI in sub-3 nm regimes while preserving its role in mainstream CMOS integration.^[59]

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[47]
[PDF] CMOS Processing - University of Notre Dame
Twin Tub CMOS w/STI & Al-W metal n-poly p-poly metal (Al). Drain. Source ... ❑ Shallow Trench Isolation (STI). ❖ Reduce source and drain capacitance.
[48]
Manufacturing optimization of shallow trench isolation for advanced ...
This paper discusses process control and manufacturing optimization of IBM's second-generation STI process ... Published in: 2001 IEEE/SEMI Advanced Semiconductor ...
[49]
A highly manufacturable trench isolation process for deep ...
A simple Shallow Trench Isolation (STI) process is proposed for deep sub-micron DRAM applications. The features of this STI flow are tapered trench ...
[50]
[PDF] University of Southampton Research Repository ePrints Soton
Apr 13, 2003 · gate/drain capacitance is 40% and the gate/source overlap capacitance 60% of that ... a trench etch after LOCOS or shallow trench isolation, as ...
[51]
On the efficiency of stress techniques in gate-last n-type bulk FinFETs
While for gate-first FinFETs, this leads to up to 10% mobility improvement at narrow widths, mobility degradation is predicted when tensile gates are used in a ...
[52]
Suppression of STI-Induced Asymmetric Stress in FinFET by CESL ...
Although STI wall oxide nitridation and densification of STI fill oxide in a pure nitrogen environment can reduce STI-induced stress and help mitigate ...Missing: relieve | Show results with:relieve
[53]
A Review of the Gate-All-Around Nanosheet FET Process ... - MDPI
Nov 3, 2022 · The components that are common between the two technologies include the shallow trench isolation, source/drain epitaxies, and the high-k metal ...
[54]
3nm Technology - Taiwan Semiconductor Manufacturing
In 2022, TSMC became the first foundry to move 3nm FinFET (N3) technology into high-volume production. N3 technology is the industry's most advanced process ...Missing: hybrid STI air- dielectrics
[55]
A Novel Scheme for Full Bottom Dielectric Isolation in Stacked Si ...
Oct 30, 2025 · 5Ge0.5 layer was proposed and demonstrated in a stacked Si nanosheet gate-all-around (NS-GAA) device structure using TCAD simulations. The ...