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Ansys HFSS

Ansys HFSS, short for High-Frequency Structure Simulator, is a commercial software tool for three-dimensional simulation, primarily used to and analyze high-frequency electronic components such as antennas, RF/ devices, interconnects, and integrated circuits. Developed originally by Ansoft Corporation and introduced in 1990 as a pioneering (FEM) solver for complex EM structures, it revolutionized electromagnetics by reducing reliance on physical prototyping through accurate virtual . Ansys, Inc. acquired Ansoft in 2008 for approximately $832 million, incorporating HFSS into its broader suite of engineering products and enhancing its capabilities for multiphysics and multiscale analyses. In July 2025, itself was acquired by , Inc., further integrating HFSS into advanced silicon-to-systems workflows. At its core, HFSS employs a full-wave EM solver based on the in both frequency and time domains, complemented by (IE), asymptotic, and hybrid solvers like SBR+ for handling electrically large environments. Key features include automatic adaptive meshing for high accuracy without manual intervention, coupled EM system solving for component-to-system workflows, and specialized tools for (EMI)/compatibility (EMC) analysis, multipaction in space applications, and RF interference in complex scenarios. These capabilities enable engineers to model intricate geometries, predict in high-speed interconnects, optimize performance, and simulate radar cross-sections, making it indispensable in industries like , , automotive (e.g., ADAS and autonomous vehicles), and . HFSS supports encrypted 3D design sharing for collaborative development and integrates with other tools, such as Electronics Desktop, for seamless multiphysics simulations involving thermal, structural, and electrical effects. Recent enhancements, including Mesh in 2021 and 3D Component Array capabilities in the 2025 R1 release, have expanded its efficiency for large-scale arrays and hybrid modeling, addressing the growing demands of /, , satellite communications, and electric vehicle electrification. Widely regarded for its unmatched accuracy and solver versatility, HFSS remains a in simulation, trusted by global teams to accelerate while minimizing development costs and time-to-market.

Overview

Core Functionality

Ansys HFSS is a full-wave electromagnetic field solver specialized in simulating high-frequency electronic components, such as antennas, RF/ devices, (IC) packages, and printed circuit boards (PCBs). This software enables engineers to model and analyze complex electromagnetic interactions in these structures with high fidelity, supporting designs for applications in communications, automotive , and systems. At its core, HFSS solves in either the time or to predict key electromagnetic behaviors, including wave propagation, radiation patterns, and signal coupling. By employing the , it achieves accurate results for electrically large structures where wavelength-scale effects are critical, ensuring reliable predictions of performance metrics like S-parameters and far-field radiation. The typical workflow in HFSS begins with defining the 3D geometry of the structure, followed by assigning material properties to objects and boundaries. Simulation parameters, such as excitation sources and frequency ranges, are then configured before running the solver to compute solutions. Results are visualized through post-processing tools that display , currents, and derived quantities like antenna gain or impedance. For broader analyses, HFSS integrates seamlessly with Ansys Desktop to facilitate multiphysics simulations involving or structural effects.

Role in Ansys Electronics Desktop

Ansys Electronics Desktop (AEDT) is the unified simulation platform that integrates 's suite of electronics design tools, enabling HFSS to function alongside complementary solvers such as Ansys Maxwell for low-frequency electromagnetic analysis and Ansys Q3D Extractor for parasitic parameter extraction. This environment provides a single interface for creating, analyzing, and optimizing electronic systems, supporting workflows from component-level to full-system simulations. Within AEDT, HFSS leverages interoperability features that allow seamless data exchange with other tools, such as exporting high-frequency results to for coupled electromechanical studies or to Q3D Extractor for enhanced parasitic modeling in hybrid simulations. For instance, electromagnetic data from HFSS can be directly linked to simulations in or thermal analyses in Ansys Icepak, enabling comprehensive multiphysics evaluations without manual data transfer. These integrations offer significant user benefits, including reduced setup time through shared geometry, materials, and setups across tools, which facilitate rapid iterations in . studies and automated optimization loops can span multiple solvers within AEDT, allowing engineers to perform analyses and goal-driven optimizations efficiently, thereby accelerating time-to-market and improving reliability. The evolution of HFSS's role in AEDT traces back to Ansys's acquisition of Ansoft Corporation in 2008, which brought HFSS and related high-frequency tools into the portfolio as standalone applications. Post-acquisition, these tools were progressively integrated into the AEDT framework, transforming them from isolated environments into a cohesive ecosystem that supports advanced electronics workflows.

History

Origins at Carnegie Mellon

Ansys HFSS originated in the 1980s as an academic finite element solver for electromagnetic problems, developed by Professor Zoltan Cendes and his students at . This research effort began while Cendes was a faculty member in the Department of Electrical and Computer Engineering, focusing on advancing computational techniques to model complex electromagnetic fields. The software emerged from Cendes's broader work in numerical electromagnetics, which laid the groundwork for practical simulation tools in high-frequency engineering. A key innovation from this period was the introduction of tangential vector finite elements, which enabled accurate modeling of curved structures and irregular geometries by aligning basis functions tangentially to surfaces, thereby eliminating spurious modes that plagued earlier finite element approaches. This method, detailed in foundational work by Cendes and collaborators, transformed the into a form suitable for finite element discretization, providing robust solutions for and metallic structures without the limitations of nodal elements. The approach addressed critical challenges in representing electromagnetic fields near boundaries and interfaces, marking a significant advancement in the field. HFSS's initial focus was on solving three-dimensional electromagnetic field problems, particularly those involving complex shapes where traditional methods, such as the method of moments, encountered difficulties due to their reliance on integral equations suited mainly to simpler, open geometries. By employing the , the software allowed for volumetric meshing of arbitrary structures, enabling full-wave analysis of enclosed cavities, waveguides, and antennas that were intractable with surface-based techniques. This capability positioned HFSS as a pioneering tool for academic research in electromagnetics during the late . By the late , the had evolved sufficiently to attract interest, transitioning toward a marketable product. In 1990, Ansoft Corporation, founded by Cendes in 1984 based on this Mellon , commercialized HFSS as its flagship electromagnetic .

Commercialization and Acquisitions

Ansoft Corporation was founded in 1984 by Zoltan J. Cendes, a professor at , and his brother Nicholas Cendes, to commercialize electromagnetic simulation technologies developed from academic . The company initially focused on advancing finite element methods for high-frequency applications, leading to the development of HFSS as its flagship product. In 1989, Ansoft entered a agreement with to sell HFSS as a standalone electromagnetic simulator, marking its entry into the market. The first version of HFSS was released in February 1990, introducing a full-wave finite element solver that revolutionized and by providing accurate simulations previously limited to simpler methods. Throughout the and , Ansoft expanded HFSS's capabilities through strategic partnerships and product enhancements. A key milestone was the 1996 collaboration with , which integrated optimization features into HFSS, enabling automated tuning and parametric sweeps to improve efficiency in electromagnetic analysis. In the , the software saw significant expansions for and integrated circuit () applications, incorporating advanced solvers for complex structures like phased arrays and RFICs, which broadened its adoption in and industries. These developments positioned HFSS as a leading tool for high-frequency simulations, with Ansoft growing into a publicly traded company on by 1996. In 2008, Ansys Inc. acquired Ansoft for approximately $832 million in a combination of cash and stock, integrating HFSS into the Ansys Electronics Desktop suite and rebranding it as Ansys HFSS to leverage Ansys's broader ecosystem. This acquisition enhanced HFSS's interoperability with mechanical and thermal solvers, accelerating its use in multidisciplinary engineering workflows. On July 17, 2025, completed its $35 billion acquisition of , following regulatory approvals, which further strengthens HFSS's integration within design ecosystems by combining it with 's tools for advanced chip-package-system co-design.

Technical Foundations

Finite Element Method Implementation

Ansys HFSS employs the (FEM) to perform high-frequency electromagnetic simulations by discretizing three-dimensional domains into tetrahedral elements, which form a representing the computational . This approach enables the solution of Maxwell's curl equations in both frequency and time domains, where the \mathbf{E} is typically solved directly, and other field components are derived using constitutive relations. The tetrahedral meshing allows for flexible representation of complex structures, with field values interpolated from nodal points on vertices and edges within each element. The core of the FEM implementation in HFSS involves formulating the weak form of to convert the differential equations into an suitable for numerical solution. Starting from the frequency-domain derived from Maxwell's curl equations, \nabla \times \left( \frac{1}{\mu_r} \nabla \times \mathbf{E} \right) - k_0^2 \varepsilon_r \mathbf{E} = 0, where \mu_r is the , \varepsilon_r is the , and k_0 is the free-space , the weak form is obtained by multiplying by vector testing functions \mathbf{N} (basis functions) and integrating over the volume. This yields \int_V \left( \nabla \times \mathbf{E} \right) \cdot \left( \frac{1}{\mu_r} \nabla \times \mathbf{N} \right) \, dV - k_0^2 \int_V \left( \varepsilon_r \mathbf{E} \cdot \mathbf{N} \right) \, dV = \oint_S \mathbf{N} \cdot \left( \frac{1}{\mu_r} \nabla \times \mathbf{E} \right) \, dS, with the surface integral representing boundary terms. HFSS utilizes vector basis functions, such as edge elements, which are tangential to element edges to ensure continuity of tangential field components across element boundaries, avoiding spurious solutions common in scalar formulations. These edge elements associate degrees of freedom with edges rather than nodes, facilitating accurate representation of field behaviors in vector spaces. The element formulation in HFSS addresses singularities, such as those at sharp metallic edges or corners, and material interfaces by employing hierarchical basis functions and proper tangential continuity enforcement, which maintain physical accuracy without introducing numerical artifacts. For material interfaces, the method incorporates discontinuous material properties within the weak form integrals, ensuring that field discontinuities align with physical boundaries like perfect electric conductors. This formulation supports lossy and dispersive materials through complex-valued \varepsilon_r and \mu_r. Compared to the finite-difference time-domain (FDTD) method, which relies on uniform Cartesian grids, HFSS's FEM excels in handling arbitrary and complex geometries due to its unstructured tetrahedral meshing, reducing the need for excessive elements in non-uniform regions and improving efficiency for intricate designs like antennas with curved surfaces. While FDTD is advantageous for time-domain simulations on regular structures, FEM provides superior accuracy for frequency-domain analysis of irregular shapes without staircasing approximations.

Adaptive Meshing and Solution Process

Ansys HFSS employs an adaptive meshing process that begins with an initial coarse tetrahedral generated based on the and electrical characteristics of the model. This is then iteratively refined through multiple passes, where the electromagnetic fields are solved, and error estimators assess the accuracy. Specifically, the Delta S error , which measures the maximum change in S-parameters between passes, guides the refinement; by default, up to 30% of the "worst" elements are subdivided in each iteration until the error falls below a user-defined , typically 0.02, or a maximum number of passes is reached. This automated refinement ensures the captures field gradients accurately without manual intervention, leveraging the finite element method's discretization for high-fidelity results. The overall solution process in HFSS follows a structured six-step : first, boundaries are defined to enclose the ; second, excitations such as ports are assigned to drive the fields; third, the initial is created; fourth, the adaptive solving iterates to ; fifth, sweeps are performed using methods like , interpolating, or fast sweeps; and sixth, results are reported and post-processed for . The core solving step involves discretizing the finite element derived from the and solving it with either a direct solver—employing a multi-frontal solver as the default for exact solutions—or an iterative solver for memory efficiency in larger cases. For electrically large models, HFSS addresses computational challenges through (DDM), which partition the mesh into subdomains solved in parallel across distributed resources, enabling scalability for simulations like antenna arrays. Additionally, GPU acceleration supports the frequency-domain and time-domain solvers, leveraging CUDA-enabled hardware to reduce solve times by accelerating matrix operations in shared- or distributed-memory setups. Introduced in 2021 R1, HFSS Mesh Fusion technology enhances system-level simulations by combining hybrid meshes—integrating finite element method (FEM) with method of moments (MoM) or shooting and bouncing rays (SBR+)—in a parallel, fully coupled manner without requiring full re-meshing of the entire structure. This approach allows for efficient handling of complex, multi-scale designs, such as IC-package-PCB assemblies or 5G systems, by locally meshing components and fusing them into a single electromagnetic matrix, thereby maintaining accuracy while minimizing computational overhead.

Simulation Capabilities

Electromagnetic Analysis Types

Ansys HFSS supports a range of electromagnetic types to model high-frequency phenomena in electronic components and systems. These analyses leverage the software's (FEM) and other solvers to solve , enabling accurate predictions of wave propagation, scattering, and energy distribution. The primary analysis domains include frequency-domain and time-domain , supplemented by specialized solvers for computationally intensive scenarios. In frequency-domain analyses, HFSS computes key metrics such as S-parameters, which characterize signal transmission and reflection in networks like filters and interconnects; , which assesses matching and power transfer efficiency; and radiation patterns for antennas, revealing , , and beamwidth. These simulations operate over a specified frequency sweep, typically from to millimeter-wave bands, to evaluate steady-state responses in structures such as waveguides and phased arrays. For instance, S-parameters are derived from port excitations and expressed in rectangular or polar formats, including Smith charts for impedance visualization. Time-domain capabilities in HFSS, powered by the transient solver, focus on excitations to simulate transient responses for high-speed signals, such as time-domain reflectometry (TDR) in transmission lines and pulse propagation through dispersive media. This approach captures time-varying fields without frequency sweeps, making it suitable for analyzing impulse responses in digital circuits and radar pulses, where causal signals reveal phenomena like ringing or not fully apparent in frequency-domain results. The solver employs a discontinuous Galerkin time-domain (DGTD) for time-stepping, ensuring stability and accuracy in modeling time-dependent behaviors. Specialized solvers extend HFSS's versatility for targeted applications. The (IE) solver uses method-of-moments on surface meshes to efficiently compute far-field patterns and from open structures like , avoiding volumetric meshing for faster solutions in unbounded domains. It excels in calculating asymptotic far-fields for and wire , integrating seamlessly with FEM for hybrid analyses. Complementing this, the asymptotic shooting and bouncing rays plus (SBR+) solver applies ray-tracing techniques to model electromagnetic interactions on electrically large platforms, such as or , where full-wave methods are prohibitive due to size. SBR+ traces rays with and multiple reflections, predicting installed performance and radar cross-sections for structures exceeding thousands of wavelengths. Post-processing outputs in HFSS provide detailed visualizations and quantitative metrics derived from simulation results. Near-field and far-field plots display electric and distributions, with far-fields computed via boundaries to yield patterns in spherical, Cartesian, or sine-space coordinates for evaluation. Power loss calculations quantify ohmic, , and radiated losses, often integrated over volumes or surfaces to assess efficiency in components like filters. For bio-electromagnetics, HFSS computes (SAR), measuring localized in tissues exposed to RF fields, compliant with standards like IEEE C95.1 for devices such as phones and wearables. These outputs support 2D/3D plots, animations, and data exports for further analysis.

Material and Boundary Modeling

Ansys HFSS enables users to define material properties through an integrated that encompasses dielectrics, conductors, and magnetic materials, each characterized by key parameters such as \varepsilon_r and \sigma. These properties can be specified as constants or made frequency-dependent using models like piecewise-linear or data tables, allowing accurate representation of real-world behaviors across operating frequencies. The includes predefined entries for common materials, such as and aluminum for conductors, and various Rogers substrates for dielectrics, facilitating quick assignment while supporting custom definitions for specialized applications. Dielectric materials in HFSS are modeled with support for anisotropic properties, where \varepsilon_r varies directionally via a diagonal tensor, and dispersive effects through causal models such as the , which describes relaxation phenomena with parameters like static permittivity and relaxation time, or the Djordjevic-Sarkar model, which uses a single reference frequency and loss tangent to extrapolate broadband behavior while preserving for time-domain compatibility. Conductors are defined by bulk \sigma, with options for finite conductivity boundaries for good conductors (thicker than depth) using surface impedance Z_s = \sqrt{\frac{j \omega \mu}{\sigma}}, applicable when the material thickness exceeds depth. Magnetic materials incorporate frequency-dependent complex \mu_{rk}, modeled similarly to dielectrics with Debye-like formulations to capture core losses and bias effects via dedicated sources. Boundary conditions in HFSS define the electromagnetic environment at model surfaces, simplifying computations by approximating infinite domains or enforcing physical constraints. The perfect electric conductor (PEC) boundary, applied by default if unspecified, sets the tangential to zero, ideal for highly conducting enclosures. The perfect magnetic conductor (PMC) enforces zero tangential , useful for symmetry or artificial boundaries in simulations. Radiation boundaries absorb outgoing waves with minimal reflection, positioned at least a quarter-wavelength from radiating structures and using second-order approximations for improved accuracy at oblique incidences. planes reduce by mirroring fields, with options for electric (E) or magnetic (H) and scaling factors like 2 for quarter-model efficiency. Lumped ports model discrete excitations on internal gaps, representing ideal voltage or current sources with associated RLC elements for circuit-like terminations. Excitation sources drive the simulations by injecting electromagnetic into the model. Wave ports, assigned to outer faces of structures, automatically compute fields, yielding (S-parameters), constants, and characteristic impedances for waveguide or microstrip analyses. Lumped ports serve as internal excitations, integrating voltage or current along a line between conductors to excite specific modes, commonly used for feeds or circuit elements. excitations simulate far-field incidents for problems, defining uniform E- and H-field polarizations and directions. Voltage and current sources provide simple ideal excitations, primarily for field visualization rather than full port analysis. To ensure model integrity, HFSS includes validation features such as built-in material explorers for verifying property assignments against the library and impedance boundary checks during setup, which flag inconsistencies like invalid values or mismatched impedances to prevent errors. These tools integrate with the Engineering Data workspace, allowing users to import or edit frequency-dependent data while cross-referencing against causal constraints.

Applications and Use Cases

High-Frequency Component Design

Ansys HFSS plays a pivotal role in the design of high-frequency components by enabling precise electromagnetic simulations that predict performance metrics such as , , and before physical prototyping. This capability is essential for RF and microwave engineers working on discrete elements like antennas and filters, where accurate modeling of wave propagation and interactions ensures optimal functionality in compact, high-speed environments. In antenna design, HFSS facilitates the simulation of various configurations, including , , and arrays, to optimize key parameters like , (VSWR), and radiation patterns. For instance, engineers model a probe-fed by defining parameterized geometry, assigning materials, and applying wave ports for excitation, allowing evaluation of and far-field through adaptive meshing that converges on S-parameter accuracy within 1.5%. antennas are simulated by creating symmetric arms with lumped ports, analyzing VSWR to achieve values below 2:1 across the operating band, such as 900 MHz with 10% impedance bandwidth and 2 dB . For array antennas, HFSS supports finite element analysis of phased arrays, enabling pattern optimization by sweeping element spacing and phase shifts to maximize and reduce , as demonstrated in simulations of arrays. HFSS is widely used for designing RF components such as filters, couplers, and transitions, with a focus on extracting S-parameters to inform matching networks and ensure minimal . In , the software integrates with libraries like Modelithics to simulate LC bandpass filters, where full-wave captures between resonators, yielding S-parameters for performance verification. Couplers, such as single-section stripline designs, are modeled with port excitations to compute coefficients and isolation, optimizing dimensions for balanced power division via S21 and S31 magnitudes. Transitions between and lines benefit from HFSS's ability to simulate performance, extracting S-parameters that guide and reduce reflections. For IC and package design, HFSS addresses signal integrity challenges in high-speed interconnects by modeling multi-layer structures to minimize and losses. Simulations of IC packages involve analysis of via transitions and traces, predicting eye diagrams and bit rates for rates up to 224 Gbps, with optimizations like adjusting pin lengths to suppress near-end in dense arrays. In multi-layer packages, HFSS evaluates signaling paths, incorporating substrate dielectrics and ground planes to reduce far-end , ensuring compliance with standards for high-speed interfaces. A typical in HFSS for high-frequency component design employs sweeps to tune dimensions based on electromagnetic performance metrics, streamlining optimization without multiple standalone models. Engineers define variables such as width or offset in the , set up sweeps for S-parameter computation, and run automated sweeps that vary parameters in increments, generating response surfaces for goals like minimizing VSWR or maximizing coupling efficiency. For example, in a filter, sweeping post diameters and spacings converges on a with under 0.6 dB, using HFSS's Optimetrics to evaluate hundreds of iterations efficiently on standard hardware. This approach integrates seamlessly with broader system designs, where component S-parameters feed into circuit-level simulations for overall performance verification.

Integration in Broader Systems

Ansys HFSS facilitates system-level modeling by integrating its 3D electromagnetic simulations with circuit-level tools within the Electronics Desktop environment, enabling co-simulation of RF front-ends in devices. This coupling allows engineers to combine HFSS's full-wave EM analysis with circuit simulators like Circuit to predict interactions between antennas, filters, and amplifiers in complex communication systems, optimizing and reducing physical prototyping needs. For instance, in RF front-end designs, HFSS exports S-parameters to circuit models, simulating end-to-end performance including and across the system. Multiphysics coupling in HFSS extends electromagnetic simulations to and structural domains, critical for analyzing interactions in high-power components like amplifiers. -EM coupling involves mapping losses from HFSS EM solutions to or solvers, predicting temperature distributions in RF power amplifiers where elevated temperatures can degrade efficiency and reliability. For antennas, structural effects such as deformation due to or mechanical stress are incorporated via iterative mapping, where HFSS updates EM fields based on changes from coupled structural simulations, ensuring accurate performance under operational loads. For electrically large systems, HFSS employs hybrid solvers combining (FEM) with shooting and bouncing rays plus (SBR+) to efficiently model cross-sections () on platforms like and . The SBR+ asymptotic solver handles vast geometries by tracing rays for far-field , while hybrid integration with FEM refines near-field details around critical features, reducing computational demands for full-vehicle predictions in autonomous driving or applications. This approach enables accurate bistatic calculations, accounting for material absorption and edge , vital for design and integration. System optimization in HFSS supports automated design exploration for () compliance, particularly in where multiple components must coexist without . Using built-in optimizers and parametric sweeps linked to optiSLang, engineers automate iterations to minimize radiated emissions and in PCB assemblies, ensuring adherence to standards like FCC Part 15 for devices such as smartphones and wearables. This process identifies shielding configurations and trace routing that achieve EMC targets, with HFSS's field visualizations guiding adjustments to suppress unintended coupling in densely packed systems.

Recent Developments

Key Innovations Post-2020

One of the pivotal advancements in Ansys HFSS following the release was the introduction of Mesh Fusion technology in the 2021 R1 version. This innovation enables hybrid meshing for large-scale electromagnetic systems by combining (FEM) and asymptotic solvers into a , fully coupled , allowing for the simulation of complex, multi-component designs without the need for separate analyses. By applying optimal meshing at the component level in parallel across multiple cores or cloud resources, Mesh Fusion significantly reduces simulation complexity and enhances accuracy for high-fidelity results in integrated systems. In the 2022 R1 release, HFSS expanded its GPU acceleration capabilities with support for CUDA-enabled Data Center GPUs, targeting sparse solvers and eigenmode operations to accelerate matrix computations in frequency-domain and time-domain analyses. This enhancement allows for faster of large matrices during electromagnetic solves, leveraging shared- and distributed-memory parallelism on supported platforms like Windows and . Such optimizations are particularly beneficial for iterative designs requiring rapid feedback on solver performance. The 2023 R1 update introduced features to streamline workflows in HFSS, including automated port tuning with FilterSolutions for co-simulation in HFSS Layout, supporting optimization for RF components. Additional enhancements include parallel component adaptive ing for component arrays (), which reduces adaptive mesh time, and iterative solver improvements for mesh fusion that decrease solve times and usage for complex geometries. These capabilities improve user efficiency by reducing manual interventions and enhancing performance for demanding electromagnetic tasks. Updates in 2024 preceded the merger, while the 2025 R2 release, following the July 2025 acquisition, introduced Engineering Copilot, an AI-powered assistant embedded in HFSS via Electronics Desktop, providing real-time guidance for simulation setup and analysis in high-frequency domains. These developments build on prior foundations to address scalability in next-generation wireless and designs.

Integration with Ecosystem

Following the completion of the Synopsys-Ansys merger on July 17, 2025, HFSS has gained enhanced synergies within the ecosystem. This includes of Ansys HFSS-IC Pro for electromagnetic modeling on TSMC's advanced 5nm and 3nm (N3P) processes, enabling die-level for complex applications in AI and . These integrations facilitate accurate multiphysics , reducing verification times for complex chip designs while ensuring compliance with stringent performance requirements in sub-3nm technologies. As of November 2025, plans to deliver initial integrated capabilities in the first half of 2026, combining silicon design, , and for multiphysics workflows across multi-die advanced packaging. HFSS-IC supports co-simulation for system-in-package () designs, enabling evaluation of signal and power distribution effects across heterogeneous IC-to-system architectures and improving reliability in high-density packaging. The merger's market impact accelerates development in / communications and hardware by providing a unified silicon-to-systems platform that integrates EM simulation with EDA workflows. This platform supports rapid prototyping of mmWave components and accelerators, enabling shorter design cycles and higher efficiency in handling the thermal and electrical challenges of next-generation hardware. For instance, it streamlines validation for -driven SoCs in data centers and edge devices, contributing to broader adoption of advanced connectivity standards.

References

  1. [1]
    Ansys HFSS | 3D High Frequency Simulation Software
    Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF ...India · Italia · Antenna Design & Modeling... · HFSS-IC
  2. [2]
    Ansys, Inc. Acquires Ansoft Corporation - EE Times
    ANSYS will acquire Ansoft for a purchase price of approximately $832 million in a mix of cash and ANSYS common stock.
  3. [3]
    Ansys Launches HFSS Mesh Fusion, Redefines Product Development
    Jan 21, 2021 · Ansys' new breakthrough technology helps engineers improve product design for advanced applications ranging from autonomous vehicles to 5G communications.<|control11|><|separator|>
  4. [4]
    How NIST Uses Ansys HFSS for Measurement Calibrations
    May 21, 2021 · Both of us are solving Maxwell's equations, which proved to be universally correct over 150 years ago and – as formulated in Ansys HFSS with ...
  5. [5]
    Electronic Design & Electromagnetics Simulation Software - Ansys
    Ansys HFSS​​ A 3D electromagnetic field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address ...
  6. [6]
    [PDF] NEWS RELEASE
    Jul 31, 2008 · NEWS RELEASE. FOR IMMEDIATE RELEASE. ANSYS, INC. ANNOUNCES SUCCESSFUL COMPLETION OF ANSOFT ACQUISITION. AND NAMES DR. ZOLTAN J. CENDES TO ANSYS, ...
  7. [7]
    From Academic Entrepreneur to Small-Business Executive
    Zoltan Cendes founded Ansoft Corporation in 1984 while he was a professor of electrical and computer engineering at Carnegie Mellon University in Pittsburgh ...
  8. [8]
    Zoltan J. Cendes - MTT-S
    Zoltan J. Cendes, Ph.D. founded Ansoft Corp. in 1984 and served as its Chairman and Chief Technology O!cer until July 2008 when Ansoft was acquired by ANSYS<|control11|><|separator|>
  9. [9]
    Company Profile: Ansoft | Microwave Journal
    Jul 15, 2008 · Ansoft was founded in 1984 and grew out of research conducted at Carnegie Mellon University by Ansoft's chairman and chief technology officer, Zoltan J. Cendes.Missing: origins | Show results with:origins
  10. [10]
    https://www.microwavejournal.com/articles/6590-company-profile-ansoft
  11. [11]
    History of Ansoft Corporation - FundingUniverse
    Ansoft is a public company, trading on the NASDAQ. Founding the Company in 1984. Ansoft grew out of research conducted at Pittsburgh's Carnegie Mellon ...
  12. [12]
    [PDF] HFSS
    Prof. Cendes and his brother Nicholas Cendes founded Ansoft and sold HFSS stand-alone under a 1989 marketing relationship with Hewlett-Packard, and bundled ...
  13. [13]
    HFSS Software for Next-generation Design | Microwave Journal
    Jan 1, 2003 · When HFSS™ was introduced in February 1990, it created a new era in microwave design. Prior to this event, microwave design was limited to ...Missing: Windows | Show results with:Windows
  14. [14]
    Ansys HFSS - Wikipedia
    HP's acquisition was driven by HP's need for an optimization capability for HFSS. After various business relationships over the period 1996–2006, HP ...
  15. [15]
    Ansys buys Ansoft for $832 million | Reuters
    Mar 31, 2008 · Ansys buys Ansoft for $832 million. By Reuters. March 31, 20085:51 PM UTCUpdated March 31, 2008.Missing: date | Show results with:date
  16. [16]
    ANSYS, Inc. Signs Definitive Agreement to Acquire Ansoft Corporation
    Mar 31, 2008 · The acquisition of Ansoft is ANSYS' first foray into the ... Conference Call Date: March 31, 2008 Time: 11:30 a.m. Eastern (8:30 ...
  17. [17]
    Synopsys Completes Acquisition of Ansys - Jul 17, 2025
    Jul 17, 2025 · Synopsys (Nasdaq: SNPS) today announced the completion of its acquisition of Ansys. The transaction, which was announced on January 16, 2024, combines leaders ...Missing: Ansoft | Show results with:Ansoft
  18. [18]
    Synopsys Completes Acquisition of Ansys - PR Newswire
    Jul 17, 2025 · Synopsys (Nasdaq: SNPS) today announced the completion of its acquisition of Ansys. The transaction, which was announced on January 16, 2024, combines leaders ...
  19. [19]
    [PDF] An Introduction to HFSS: Fundamental Principles, Concepts, and Use
    The information in this book is a consolidation and review of materials from various inter- nally and externally published ANSYS, INC sources, as well as rules ...
  20. [20]
    [PDF] Ansoft HFSS — Technical Notes Topics: Go Back Contents Index
    To calculate the full 3D field solution, Ansoft HFSS calls the abc3d module. This module solves the following wave equation: where: • E(x,y,z) is a complex ...
  21. [21]
    FEM, MOM, FDTD) while simulating RF and microwave structure ...
    Nov 6, 2015 · FEM provides the most flexible EM analysis method, allowing to simulate most arbitrary 3D geometries.
  22. [22]
    [PDF] Lecture 3: HFSS FEM Solution Setup
    Adaptive meshing is the automated process that HFSS uses to create and refine the FEM simulation mesh. From the document An Introduction to HFSS, Chapter 1 ...
  23. [23]
    [PDF] An Introduction to HFSS: Fundamental Principles, Concepts, and Use
    Jin-Fa Lee, Din-Kow Sun, Zoltan J. Cendes, “Full-Wave Analysis of Dielectric Waveguides. Using Tangential Vector Finite Elements,” IEEE Trans. on Microwave ...Missing: Carnegie Mellon
  24. [24]
    [PDF] Lecture 3-1: HFSS 3D Design Setup - Ozen Engineering, Inc
    –After each solution, tetrahedral elements are “graded” for their accuracy to Maxwell's Equations. –User defines percentage of “bad” tetrahedral elements to ...
  25. [25]
    [PDF] ANSYS HPC Seminar Series Electronics Desktop
    Mar 10, 2021 · • HFSS supports multiple steps being parallelized: – ... – Solution Data contains all the information related to executed solution process.
  26. [26]
    Ansys 2023 R2 - GPU Accelerator Capabilities
    No information is available for this page. · Learn why
  27. [27]
    The Two Best Features in Ansys HFSS 2021 - Mesh Fusion
    Feb 19, 2021 · The 2021 R1 HFSS release introduces HFSS Mesh Fusion technology. It provides best-in-class parallel meshing technology, enabling fast simulation of large ...
  28. [28]
    [PDF] Lecture 4: Simulation Post Processing
    Setting up S-parameter plots is also available from: HFSS > Results > Create ____ Solution Data Report. The blank ___ gets filled in with a Solution.Missing: step | Show results with:step
  29. [29]
    Antenna Design & Modeling Software - Ansys
    The FEM transient solver incorporates HFSS adaptive meshing and analyzes transient applications such as ground penetrating radar (GPR), electrostatic discharge, ...Deutschland · Italia · FranceMissing: implementation | Show results with:implementation
  30. [30]
    [PDF] How to compare FEM and transient simulation results.
    TDR results may be simulated using HFSS FEM and HFSS Transient solvers. Both methods can be used to achieve accurate and efficient results. When comparing the ...
  31. [31]
    Ansys HFSS-IC | IC to System Simulation
    Ansys HFSS-IC provides a multiphysics and multiscale platform for IC/package/system designs including advanced packaging and 3DICs.
  32. [32]
    [PDF] Module 1: Introductions
    This module introduces ANSYS, a multi-discipline simulation software, AEDT, a common GUI, and HFSS, which uses the Finite Element Method (FEM).<|control11|><|separator|>
  33. [33]
    New HFSS SBR+ Technology in Ansys 2021 R2 a Big Step Forward ...
    Jul 16, 2021 · The Ansys HFSS Shooting and Bouncing Rays (SBR+) solver is an asymptotic, ray tracing electromagnetic solver that efficiently solves electrically large ...
  34. [34]
    Electronics in Healthcare with Ansys Tools | Education Resources
    Ability to simulate two Specific Absorption Rate (SAR) use cases: a) Cell Phone and b) Magnetic Resonance Imaging (MRI); Awareness of regulations, power ...
  35. [35]
    [PDF] Hfss 13 Tutorial
    HFSS 13 offers an extensive library of materials including: - Conductors (copper, aluminum, gold) - Dielectrics (FR4,. Rogers substrates) - Specialized ...
  36. [36]
    Frequency Dependent Material Definition in ANSYS HFSS - PADT, Inc.
    Oct 3, 2019 · Electromagnetic models, especially those covering a frequency bandwidth, require a frequency dependent definition of dielectric materials.
  37. [37]
    Antenna Design using Ansys HFSS - Resources
    Mar 25, 2024 · This post provides an overview of the antenna simulation workflow in Ansys HFSS, a powerful design tool renowned for its capability to accurately simulate ...Missing: VSWR | Show results with:VSWR
  38. [38]
    [PDF] Simulating a Dipole Array in HFSS - Ansys Customer Center
    In this module, we will look at the procedure for setting up and analyzing a finite array of antenna elements in Ansys' HFSS. We will be specifically ...Missing: patch VSWR
  39. [39]
    LC Filter Design with Ansys HFSS and Modelithics
    Sep 19, 2023 · Learn how to use the Modelithics COMPLETE+3D Library within Ansys HFSS to facilitate full-wave electromagnetic simulations.
  40. [40]
    Simulation of a Single-section Coupler Using Ansys Electronics ...
    Sep 19, 2022 · In this video lesson, we will design and simulate a single-section coupler using stripline and microstrip line technologies in Ansys HFSS.Missing: filters parameters
  41. [41]
    [PDF] Ansys High Frequency Structure Simulator (HFSS) Tutorial
    Jan 16, 2017 · Integrated into Ansys Electronics Desktop. Part of Ansys ... Insert into Electronics Desktop using Project > Insert HFSS Design. Page 21 ...<|control11|><|separator|>
  42. [42]
    Samtec Uses Ansys HFSS for High-Speed Interconnect Design
    Apr 19, 2021 · Samtec used Ansys HFSS to maximize signal integrity (SI) performance of the 0.80 mm NovaRay® Extreme Density Array product family.
  43. [43]
    Optimize High Speed Serial Links for Crosstalk - Ansys
    See how NVIDIA relied on Ansys RaptorX and Exalto to examine aggressors and victims that might cause electromagnetic crosstalk in high-speed chips.By Dai Dai, Mixed-Signal Ic... · Knowledge Is Key · Power-Clock Line Challenges
  44. [44]
    Parametrics and Optimization Using Ansoft HFSS | Microwave Journal
    Nov 1, 1999 · Optimetrics™ is a powerful new capability in Ansoft HFSS that speeds the design process and allows users to perform parametric analysis, ...Missing: HP partnership 1996
  45. [45]
    Optimize 5G Antenna Design and Solve Large Communication ...
    Using Ansys HFSS, engineers can design phased antenna arrays and optimize antenna properties for end-to-end channel modeling, as well as communication and ...
  46. [46]
    Ampleon Simulates RF Power to Reduce Cost, Boost Performance
    Electromagnetic and multiphysics simulation tools from Ansys tackle challenges at multiple scales, including chip, package, board, and cooling blocks.
  47. [47]
    Design Exploration of RF GaN Amplifier - 3D Packaging and ... - Ansys
    We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the ...
  48. [48]
    4-Way Multiphysics with Thermal Deformation Mapping to Ansys HFSS
    Apr 26, 2023 · This article is my current recommendation for how to approach this 4-way physics coupling and is taken from the perspective of someone who is:Missing: power amplifiers
  49. [49]
    Radar Cross Section and Scattering | Ansys Application Brief
    Efficient modeling of the radar cross section (RCS) in Ansys HFSS SBR+ can help determine or control proper radar signature characteristics.Missing: hybrid | Show results with:hybrid
  50. [50]
    Ansys Tames Product Complexity and Spurs Productivity with ...
    In the electromagnetics suite, Ansys introduces RCS analysis using HFSS SBR+. This technology is ideal for engineers designing autonomous vehicles, advanced ...
  51. [51]
    EMI/EMC Simulation & Analysis Tools - Ansys
    Ansys HFSS​​ A 3D electromagnetic field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address ...India · France · Deutschland · Italia
  52. [52]
    Ensuring EMI/EMC Compliance with Electronics Simulation - Ansys
    Nov 30, 2017 · Ansys electronic simulations make it possible to detect potential EMI/EMC problems early in the design stage of ICs and PCBs, when design changes are easier ...
  53. [53]
    Ansys 2022 R1 - GPU Accelerator Capabilities
    No information is available for this page. · Learn why
  54. [54]
    [PDF] Release 2023 R1 Highlights Ansys High Frequency Electromagnetics
    FilterSolutions: HFSS 3D Layout Automatic Port Tuning. • Simulation, optimization, and design reconstruction controls provided for in. FilterSolutions desktop ...
  55. [55]
    5G/6G Simulation Software - Technology Trends - Ansys
    This webinar will chart the progress of HFSS with respect to antenna design and how it has evolved into the established leader in the field. Watch Now ...Engineering A New Future Of... · Engineering The Next... · The Race Is On -- Are You In...
  56. [56]
    Ansys 2025 R2 Release Highlights
    The 2025 R2 release features enhanced physics-based solvers, streamlined workflows, and new AI-powered tools, all designed to accelerate simulations and ...Accelerating Innovation With... · Drive Digital Change With... · Product HighlightsMissing: mmWave quantum
  57. [57]
    Synopsys Collaborates with TSMC to Enable 2D and 3D Design ...
    Sep 24, 2025 · The solutions aid in validating power integrity of chips using TSMC N3C, N3P, N2P, and A16™ process technologies. Likewise, Ansys HFSS-IC Pro ...Missing: SiP | Show results with:SiP
  58. [58]
    Synopsys and Ansys Unite to Advance Engineering Innovation
    Jul 17, 2025 · Synopsys acquires Ansys, uniting silicon to systems expertise for AI-powered product innovation and comprehensive engineering solutions.Missing: aware | Show results with:aware
  59. [59]
    Synopsys Collaborates with TSMC to Enable 2D and 3D Design ...
    Sep 24, 2025 · Ansys HFSS-IC Pro™ platform is certified for system-on-chip ... photonic design kit release scheduled for the later part of 2025.Missing: expansions 2026
  60. [60]
    Signal and Power Integrity - Synopsys
    Explore how Synopsys' SIPI analysis solutions enhance high-performance systems. Ensure signal and power integrity with our expert tools and services.Missing: SiP | Show results with:SiP
  61. [61]
    Synopsys Wraps Up Ansys Acquisition, Eyes Integrated Design
    Synopsys' $35B acquisition of Ansys merges EDA and multiphysics simulation, expanding its TAM to $31B and enabling silicon-to-systems ...
  62. [62]
    Synopsys Finalizes Ansys Acquisition to Strengthen AI System ...
    Jul 31, 2025 · Announced in January 2024, the deal combines Synopsys' leadership in silicon design and IP with Ansys' renowned simulation and analysis tools ...
  63. [63]
    How Synopsys' $35bn Ansys Deal Reshapes Engineering Software
    Synopsys announced on 14 July 2025 that it had received approval from all necessary authorities to proceed with the acquisition. Synopsys' ...
  64. [64]
    Synopsys Collaborates with TSMC to Enable 2D and 3D Design ...
    Sep 24, 2025 · The partnership enables multiphysics analysis flows and AI-driven photonics optimization, supporting the development of chips for AI ...