Fact-checked by Grok 2 weeks ago

Pin grid array

A pin grid array (PGA) is a type of (IC) packaging in which the package body is typically square or rectangular, and numerous pins are arranged in a uniform grid pattern on the underside to enable electrical connections via insertion into a matching on a . These pins, often staggered for ease of insertion, provide a high number of (I/O) connections compared to earlier (DIP) formats, supporting up to several hundred pins in advanced configurations. PGA packages are commonly constructed from materials like (CPGA) or plastic (PPGA), with the die mounted via or flip-chip methods, and often include a or slug for improved thermal management. The packaging technology emerged in the late and early as a response to the growing complexity of microprocessors requiring more I/O pins and better performance than traditional packages could offer. pioneered early ceramic implementations for processors like the 80386 and 80486 in the , transitioning to plastic variants by 1993 to reduce costs and enhance manufacturability while maintaining socket compatibility for easier upgrades. This evolution addressed limitations in power distribution and , with features like multi-layer organic substrates and nickel-plated heat slugs enabling lower thermal resistance (typically 0.30–0.50 °C/W) and reduced propagation delays. PGA packages have been widely applied in desktop, server, and mobile computing, particularly for Intel microprocessors such as the 80386, 80486, and Pentium series, as well as early AMD Athlon models, with pin counts ranging from 168 to over 600. Key advantages include socketability for non-soldered installation, facilitating processor upgrades, and high pin density for complex ICs, though they have largely been supplanted by ball grid array (BGA) and land grid array (LGA) formats in modern designs due to the latter's smaller footprint and better suitability for surface-mount assembly. Variants like flip-chip PGA (FC-PGA) and micro-PGA (μPGA) further optimize electrical and thermal performance for high-speed applications, including embedded systems and testing environments.

Overview

Definition and Characteristics

A pin grid array (PGA) is a type of () packaging characterized by a square or rectangular package body from which an array of pins protrudes perpendicularly from the bottom surface in a uniform grid pattern, facilitating direct insertion into sockets or onto printed boards (PCBs). The pins are typically arranged with a standard pitch of 2.54 mm (0.1 inch), though finer pitches such as 1.27 mm (0.05 inch) may be used for higher-density configurations, enabling reliable electrical interfacing while maintaining mechanical stability. The package body encases the semiconductor die mounted on a multi-layer , which serves as an interconnect platform between the die and the external pins. These pins, often constructed from materials like with for resistance and , fulfill electrical , mechanical support, and thermal dissipation roles by conducting heat away from the die. Typical pin counts range from 68 for smaller ICs to over 1,000 for complex microprocessors, with package dimensions varying from approximately 14 × 14 mm for compact devices to 50 × 50 mm or larger to accommodate high pin densities. In a basic cross-sectional view, the structure reveals the die bonded to the (often via wirebonding), surrounded by the package lid or , with pins extending downward from the substrate's underside to form the grid array, providing a clear path for I/O signals, power, and ground. Functionally, the PGA design supports high-density (I/O) connections in a compact , allowing for greater integration of circuitry compared to earlier packages like dual in-line (DIP), while its protruding pins enable easy removable installation through zero-insertion-force (ZIF) or low-insertion-force (LIF) sockets on the . This socket compatibility distinguishes PGAs from permanent surface-mount alternatives, such as ball grid arrays (BGAs), by permitting field-upgradable or testable installations without , which is particularly advantageous for performance-critical applications like processors.

Historical Development

The pin grid array (PGA) originated in the mid-1970s as a solution to accommodate higher pin counts in large-scale integrated circuits, evolving from earlier dual in-line and flat package designs. In 1975, developed the world's first PGA using laminated , introducing a 52-pin configuration for logic LSI in mainframe computers using ECL technology, where pins were silver-brazed to a ceramic substrate in a pattern to support expanding I/O requirements up to 100 pins or more. This innovation addressed the limitations of linear pin arrangements in high-density systems, laying the groundwork for grid-based amid the rapid growth in integration driven by . PGA saw its first widespread commercial adoption in s during the 1980s, coinciding with the demand for 32-bit architectures and increased I/O pins. introduced the 132-pin ceramic PGA with the 80386 in 1985, enabling a 32-bit address bus and improved performance over prior 16-bit designs while maintaining . Adoption accelerated with the 80486 in 1989, which utilized a 168-pin PGA to incorporate additional signals like cache control and power/ground pins, standardizing the format through specifications for pin spacing (typically 0.1 inches or 2.54 mm) and layouts to ensure . By 1993, the original processor employed a 273-pin staggered PGA, further boosting pin density for superscalar processing and marking a key milestone in desktop computing. In the 1990s, PGA evolved toward cost-effective materials, with initiating development of plastic pin grid array (PPGA) packages in to replace ceramics, reducing manufacturing expenses while supporting higher volumes for consumer processors; by the late 1990s, PPGA variants exceeded 500 pins in some high-end designs for servers and workstations. The removable PGA (rPGA) emerged in the early 2000s for mobile applications, debuting prominently in 2009 with 's first-generation mobile Core i7 series using rPGA 988A () to facilitate upgradability in laptops. However, post-2000s and thermal demands led to a decline in PGA favor for mainstream consumer CPUs, as transitioned to (LGA) sockets starting in 2004 with Socket 775 for processors, and (BGA) for soldered mobile chips; PGA persists in niche high-reliability sectors like and some applications as of 2025, benefiting from JEDEC-standardized robustness.

Package Construction

Substrate Materials

The substrate in a pin grid array (PGA) package serves as a multi-layer board, typically comprising 2 to 10 layers, that interconnects the die to the protruding pins while providing electrical pathways, capabilities, and mechanical support for the overall package structure. substrates, primarily composed of alumina (Al₂O₃) or aluminum nitride (AlN), are favored for their superior and electrical properties in demanding environments. Alumina-based substrates offer a of approximately 20-30 W/m·K, enabling effective heat spreading, while AlN variants achieve significantly higher values of 170-230 W/m·K, making them suitable for applications requiring rapid heat . These materials also provide sealing to protect against and contaminants, along with a coefficient of (CTE) of 3-5 /°C for AlN and 6-8 /°C for alumina, which closely matches silicon's CTE of about 2.6-4 /°C to minimize thermomechanical stress. substrates are commonly employed in high-power or applications, such as multi-chip modules, where reliability under extreme conditions is critical. However, their higher and inherent brittleness limit widespread adoption in cost-sensitive designs. Organic substrates, typically laminates of epoxy resin reinforced with (similar to ), represent a more economical alternative with a of around 0.3 W/m·K, sufficient for moderate loads but reliant on additional vias or heat spreaders for enhanced dissipation. These substrates are lighter in weight and exhibit a of 15-20 ppm/°C, which, while mismatched with , is better aligned with printed circuit boards to reduce assembly stresses. Often using bismaleimide-triazine () resin for improved performance, organic substrates are prevalent in due to their low cost and compatibility with high-volume production. Plastic substrates, such as those in plastic pin grid array (PPGA) packages, build on bases through injection molding or encapsulation processes, incorporating or similar polymers to form a protective outer while retaining the laminate core for interconnections. This approach balances the cost-effectiveness and lightweight nature of organics with added mechanical durability against impacts and handling stresses, making plastic substrates suitable for mid-range applications where full ceramic robustness is unnecessary. Selection of substrate materials for PGA packages hinges on specific thermal requirements, budgetary constraints, reliability needs, and manufacturing considerations. High-thermal-conductivity ceramics like AlN are prioritized for power-intensive uses to prevent overheating, whereas organics or plastics suffice for lower-power scenarios to optimize cost. Reliability is enhanced by matching to avoid cracking during thermal cycling, with ceramics offering better compatibility than organics. Additionally, manufacturing favors organics and plastics due to simpler processing, though ceramics excel in yield for precision multilayer routing in specialized cases.

Pin Configurations

Pin grid array (PGA) packages typically feature a standard uniform rectangular of pins arranged in rows and columns on the underside of the package, providing a reliable for socketed or soldered connections. The most common for these pins is 2.54 mm (0.1 inch), though finer pitches of 1.27 mm (0.05 inch) are used in higher-density variants to accommodate increased requirements. Power and ground pins are frequently positioned along the periphery of the array to simplify and improve electrical by leveraging outer-layer traces for distribution. Staggered pin configurations, also known as staggered pin grid arrays (SPGA), offset alternate rows of pins to enhance pin density compared to a uniform grid at equivalent pitches, enabling higher I/O counts in the same footprint. This offset arrangement, often implemented with a 1.27 mm pitch, is particularly suited for high-I/O applications such as processors exceeding 600 pins, where it facilitates tighter packing while necessitating precise alignment to avoid insertion issues. Stud pins represent a variant of PGA pins designed as short, collared cylindrical stubs protruding minimally from the package base, which reduces overall package height and minimizes fragility during handling and . These stubs are commonly employed in modern low-profile PGA packages to maintain electrical connectivity while enabling surface-mount compatibility and lower profiles suitable for compact . Mechanically, PGA pins are engineered with lengths typically ranging from 3.0 to 3.3 mm for standard full-length designs, though some variants like micro-PGA have shorter pins at 1.2–1.3 mm, while pins have a mounting length of around 3.5 mm. Pin diameters generally fall between 0.4 and 0.6 mm, with precise tolerances such as 0.40–0.51 mm for plastic PGA (PPGA) types, ensuring compatibility with socket contacts. Materials consist of alloys like or copper-based (e.g., CuZn37), finished with over underlayers for resistance and reliable conductivity; these features, combined with controlled bending radii, help mitigate warping and maintain during thermal cycling. Pin density in PGA packages is determined by the grid dimensions, where a square n × n array theoretically supports up to n² pins, though practical counts are reduced by depopulated sites reserved for internal or vias—for instance, certain FC-PGA designs achieve 370 pins within a supporting up to a 19 × 19 grid, through optimized layouts including depopulation for . This approach balances I/O with manufacturability, with higher counts like 615 pins achieved in micro-PGA (μPGA) using finer 1.27 mm staggered grids.

Variants

Ceramic and Organic Packages

Ceramic Pin Grid Array (CPGA) packages feature a fully construction, providing hermetic sealing essential for high-reliability environments. These packages utilize multilayer cofired s, manufactured through processes such as tape casting for green sheets, of conductive pastes, , and high-temperature to form a dense with integrated vias and traces. The die is mounted centrally, wire-bonded, and enclosed with a metal or lid brazed for hermeticity, ensuring protection against moisture and contaminants in demanding applications like and systems, including radiation-hardened integrated circuits. Organic Pin Grid Array (OPGA) packages employ multilayer organic laminates, typically bismaleimide-triazine () resin with copper traces, connected via solder-filled vias to protruding pins. Manufacturing involves standard techniques, including core preparation, for vias, , patterning, and pin insertion or , followed by surface finishing for solderability. These packages are suited for commercial electronics requiring moderate reliability, offering a balance of performance and affordability, though they are non-hermetic and susceptible to moisture absorption, necessitating preconditioning per (MSL) classifications during assembly. Enhanced is achieved through build-up layers with finer line widths and controlled impedance. A prominent example of an organic-based variant is the Plastic Pin Grid Array (PPGA), introduced by in 1997 for the MMX processor using a 296-pin configuration. This package consists of a plastic-encapsulated organic substrate with a metal lid or heat slug for thermal spreading, manufactured via lamination of resin layers, via formation, pin press-fit or attachment, die attachment with , gold , and overmolding for environmental protection. The 296-pin PPGA measures approximately 49.5 mm square with a 3.0 mm body thickness (including heat slug) and supports Socket 5 interfacing for consumer CPUs in the 1990s and early . Comparatively, CPGA packages are roughly twice the weight of OPGA or PPGA equivalents (e.g., 29 g versus 18 g for a 296-pin ) due to the denser materials, and they incur significantly higher manufacturing costs from custom tooling and processes. Reliability for CPGA includes sealing that withstands extreme conditions, such as 1000 thermal cycles from -55°C to 125°C, while organic packages like OPGA and PPGA undergo MSL testing (typically Level 3) to mitigate risks from humidity and , with lower overall lifecycle costs for non-critical applications.

Specialized Layouts

The Reversible Pin Grid Array (rPGA) is a specialized variant of the PGA package optimized for applications, featuring pins arranged on the substrate to facilitate (ZIF) socket mating. Introduced by for its first-generation Core i7 mobile processors in 2009, the rPGA-989 socket (compatible with rPGA-988A processors) supports up to 988 pins at a 1 mm pitch, enabling higher pin density in compact form factors while minimizing assembly risks through symmetric pin layouts that reduce the need for precise orientation during insertion. This design has been widely adopted in processors, such as those in the Nehalem architecture series, to balance thermal performance and electrical connectivity in thin profiles. Staggered pin variants of the , known as Staggered Pin Grid Array (SPGA), incorporate offset pin rows to achieve greater pin density without increasing overall package size, making them suitable for environments. In SPGA layouts, pins are arranged in alternating positions within the , allowing closer spacing compared to standard aligned PGAs while maintaining mechanical stability. A prominent example is the Opteron server processor's 940-pin configuration, which utilizes a staggered 1.27 mm to support multi-core architectures with extensive I/O requirements, as specified in AMD's design guidelines. This approach enhances and routing flexibility in dense server boards. Stud and low-profile PGA variants employ shortened pins or stud-like protrusions to minimize vertical height, typically achieving total package Z-heights around 5 mm, which is critical for space-constrained systems. These designs use selective techniques, such as gold-over-nickel deposition on pin tips, to ensure reliable and resistance during . For instance, low-profile PGA sockets with 0.60 mm pin protrusion above the are common in industrial applications, where they interface with microcontrollers requiring robust yet compact connectivity. involves precision turning of short pins followed by selective to target only the contact areas, reducing material costs and improving yield. Other specialized PGA layouts include hybrids combining elements of (LGA) contacts with pin structures for enhanced thermal and electrical performance in niche high-speed applications during the 2020s. Fine-pitch PGAs with pitches below 1 mm, such as 0.8 mm variants, enable integration in advanced networking and AI accelerators, though they remain less common due to pin fragility concerns. These evolutions often adhere to outline standards adapted for PGA families, ensuring interoperability in evolving ecosystems.

Integration and Assembly

Chip Mounting Techniques

The primary methods for mounting the semiconductor die to the pin grid array () substrate involve and flip-chip techniques, each offering distinct advantages in electrical connectivity, thermal management, and manufacturing yield. remains the most common approach for packages due to its reliability and cost-effectiveness in connecting peripheral die pads to substrate traces. In contrast, flip-chip mounting enables higher I/O density and shorter interconnect paths, reducing signal inductance, particularly in high-performance applications. Other specialized techniques, such as tape-automated bonding (), are employed for fine-pitch requirements, while die attachment suits low-power scenarios. Wire connects the die's pads to the 's traces using fine metallic wires, typically or aluminum with ranging from 25 to 50 µm. wires, often 18 to 40 µm in , are preferred for their resistance and , while aluminum wires provide a cost-effective alternative for less demanding applications. The process employs ultrasonic or thermosonic methods: ultrasonic uses high-frequency vibrations (around 60-120 kHz) combined with to form or without heat, whereas thermosonic adds moderate heat (150-200°C) to enhance formation and strength. Wire loops typically exhibit heights of 0.2 to 0.5 mm to accommodate topography and prevent shorts, with the die first secured to the using silver-filled for mechanical stability. This method ensures robust electrical connections but introduces higher compared to direct attachment approaches. Flip-chip mounting inverts the die and attaches it face-down to the via bumps, such as in IBM's Controlled Collapse Chip Connection () process using Pb/Sn alloys. bumps, formed on the die pads through or followed by reflow, collapse under controlled heat and pressure during attachment, creating reliable metallurgical joints with heights of 50-100 µm. To enhance mechanical reliability and mitigate mismatches between the die ( ~3 ppm/°C) and organic substrates ( ~15-20 ppm/°C), an underfill is dispensed around the bumps and cured, filling voids to prevent and . This technique significantly shortens electrical paths, reducing by up to 50% relative to , and has been widely adopted in high-performance PGAs, such as Intel's FC-PGA for processors. Alignment precision is critical, with tolerances below 5 µm—often achieving 3 µm in production—to ensure bump-to-trace registration and high yield. Alternative techniques include for fine-pitch applications in high-pin-count PGAs, where the die bonds to a flexible tape with copper leads (pitch as low as 50 µm) before outer lead attachment to the , enabling up to 820 I/O connections. For low-power devices, adhesive die attach uses non-conductive epoxies to simply secure the die without electrical interconnects, minimizing in applications with power dissipation under 1 W. Thermal considerations across methods emphasize void-free underfill or encapsulation to avoid hotspots and , with cure temperatures controlled below 150°C to preserve integrity. The overall process sequence begins with die placement on the using automated pick-and-place tools for precise positioning (accuracy ~10 µm). Bonding follows—wire formation or reflow—monitored for parameters like pull strength (>5 g for 25 µm wires) and integrity. Encapsulation with silica-filled molding compound protects the assembly, followed by curing and . Yield is influenced by factors such as alignment tolerance (<5 µm for flip-chip to achieve >99% ) and process controls to minimize defects like non-stick bumps or wire sweeps.

Socket and Board Interfacing

Pin grid array (PGA) packages interface with printed circuit boards (PCBs) primarily through specialized sockets that accommodate the array of pins on the package underside. Common socket types include (ZIF) designs, which employ a or to gently the pins without applying pressure during insertion or removal, facilitating easy and replacement of processors. For instance, the Intel PGA370 socket, used for 370-pin packages in and processors, features a single-lever ZIF actuation for reliable in and applications. Low-insertion-force (LIF) sockets, often equipped with spring-loaded or multi-finger contacts, provide an alternative for testing scenarios where minimal —typically 12.5 per pin or less—is required to avoid stressing high-pin-count arrays exceeding 250 pins. The interfacing process begins with aligning the PGA package pins with the socket's contact holes, followed by insertion using the actuation mechanism to secure the connection. Pin insertion tolerances are tightly controlled, typically at ±0.05 mm, to ensure precise and prevent misalignment in high-density grids spaced at 1.27 mm or 2.54 mm. Socket designs incorporate features such as tapered entries and precision-machined contacts to guide pins smoothly, while package and socket geometries, including beveled corners on the package, aid in to avoid during . Post-assembly, testing is commonly performed using dedicated ZIF sockets to stress the under elevated temperatures and voltages, identifying potential defects before full deployment. On the board side, sockets are attached to the via () soldering for ZIF types or through-hole soldering for LIF variants, with socket pins or tails connecting directly to PCB vias for electrical routing. To maintain in high-speed applications, PCB traces linked to these vias are designed with controlled impedance, typically 50–100 Ω, to minimize reflections and in interfaces. management is enhanced by placing thermal vias beneath key socket pins, particularly or pins, to conduct from the package to inner PCB layers or external sinks, improving dissipation in power-intensive setups. Reliability in socket-board interfacing is ensured through design features that limit pin deflection to a maximum of 10° during handling or insertion, reducing bending risks in arrays with delicate leads. Sockets are rated for a minimum lifecycle of 100 insertion/ cycles, with low-force contacts maintaining below 10 mΩ throughout. Qualification follows standards such as EIA-364, which outlines environmental and mechanical tests including , (10–500 Hz at 10 g), and shock (50 g), to verify performance under operational stresses.

Applications and Performance

Typical Uses

Pin grid array (PGA) packages find their primary application in microprocessors for desktop and server environments, where the socketed design facilitates upgradability and maintenance. The 80486, introduced in 1989, exemplifies this use with its 168-pin PGA configuration for 5-volt designs, enabling high-performance computing in early personal computers. Similarly, AMD's K6 family of processors, launched in the late 1990s, utilized 321-pin ceramic PGA packages compatible with motherboards, supporting speeds up to 550 MHz in consumer and embedded computing setups. In embedded systems, PGA packages support industrial controls and networking equipment, providing robust I/O connectivity for complex signal routing. The removable pin grid array (rPGA) variant extends this to , particularly in laptops, where socketed designs like Intel's rPGA 988B allow processor upgrades in models supporting dual-core i3 series chips. Ceramic PGA packages are favored in high-reliability sectors due to their sealing and durability, including , , and applications. These packages house radiation-tolerant integrated circuits for satellites and systems, ensuring performance in harsh radiation environments. As of 2025, PGA persists in niche modern roles, such as legacy server maintenance, custom application-specific integrated circuits (), repairable systems in medical devices, and high-reliability applications in and .

Advantages and Limitations

One key advantage of Pin Grid Array (PGA) packages is their ability to support high pin counts, typically ranging from 28 to over 800 pins in advanced designs, enabling dense I/O connectivity for complex integrated circuits. This configuration facilitates socketability, allowing easy installation, removal, and upgrades of components without soldering, which enhances in systems requiring frequent changes. Additionally, the protruding pins provide effective paths from the die to the board or heatsink, improving heat dissipation compared to surface-mount alternatives in certain applications. PGA packages also offer mechanical robustness in the Z-direction due to the pin structure, which absorbs shocks and vibrations better than flat-pad designs, reducing stress on joints. Furthermore, in configurations with short pins or optimized layouts, PGA can exhibit lower inductance than traditional , aiding in moderate-speed operations. Despite these benefits, PGA packages have notable limitations, including a taller profile of approximately 5-10 mm due to pin length, compared to about 1 mm for (BGA) packages, which increases overall system height and limits use in compact devices. The pins are prone to fragility, with risks of bending or breaking during handling or insertion, potentially leading to connection failures. Socket-based implementations add higher costs, as specialized PGA sockets are more expensive than direct methods used in BGA. Moreover, PGA requires a larger PCB footprint to accommodate through-hole pins, complicating board layout compared to surface-mount options. In terms of , PGA's longer pins introduce higher , approximately 1-3 nH per pin, which can cause issues at frequencies above 1 GHz by increasing and reflections. Compared to BGA, PGA offers lower I/O density, around 15-60 pins/cm² depending on , versus over 200 pins/cm² for fine-pitch BGA, making it less suitable for ultra-high-density applications. Relative to (LGA), PGA is similar in socketability but uses protruding pins instead of flat pads, resulting in bulkier assemblies, while LGA avoids pin fragility at the cost of more precise needs. BGA, being soldered, provides a smaller form factor and better high-frequency performance but lacks the easy replaceability of PGA. To mitigate these drawbacks, variants like removable PGA (rPGA) are employed in mobile systems, offering socketed upgradability in thinner profiles suitable for laptops. As of 2025, PGA remains relevant in upgradable desktop and server systems, even as soldered packages like BGA dominate for their compactness and cost efficiency.

References

  1. [1]
    Pin Grid Array (PGA) Sockets - TE Connectivity
    A pin grid array (PGA) socket is the integrated circuit packaging standard used in most second- through fifth-generation processors. These sockets are either ...Missing: definition | Show results with:definition
  2. [2]
    Package Type Guide for Intel® Desktop Processors
    PGA package type PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA ...Missing: definition | Show results with:definition
  3. [3]
    [PDF] Pinned Packaging - Intel
    The Micro Pin Grid Array (µPGA) is the latest innovative packaging approach, developed as a conveyance for Organic Land Grid Array (OLGA) package technology ...
  4. [4]
    The Evolution of IC Packaging | Advanced PCB Design Blog
    Oct 3, 2023 · The demand for higher pin counts led to the introduction of Pin Grid Array (PGA) and Ball Grid Array (BGA) packages, while miniaturization drove ...
  5. [5]
    https://ieeexplore.ieee.org/document/906346
  6. [6]
    [PDF] EIAJ EDR-7323A - 1 -
    This technical report accounts for the industrial standard of Pin Grid Array (hereinafter referred to as. PGA) which is applied terminal pitch e = 2.54mm and ...Missing: typical count<|control11|><|separator|>
  7. [7]
    [PDF] Designing Pin Grid Array Ceramic Packages For High Performance ...
    This work describes the development of a pin-grid array ceramic package (PGA) designed to meet high performance requirements for the Mars Laser.
  8. [8]
    [PDF] Introduction to the 80386
    The 80386 is implemented in Intel's CHMOS III, a semiconductor process ... The initial 80386 package is a 132-pin ceramic pin grid array (PGA). Pins of ...
  9. [9]
    [PDF] 80486DX2-66-Intel-datasheet-7086155.pdf - Octopart
    A 168-pin. Pin Grid Array (PGA) is available for 5-Volt designs and a 208-lead Shrink Quad Flat Pack (SQFP) is available for 3.3-Volt designs. The processor ...
  10. [10]
    [PDF] Volume 1: Pentium Processor Data Book - Bitsavers.org
    The Pentium processor has. 3.1 million transistors and is built on Intel's .8 Micron BiCMOS silicon technology. I. PENTIUMTM PROCESSOR. • 273-Pin Grid Array ...
  11. [11]
    [PDF] An Introduction to Plastic Pin Grid Array (PPGA) Packaging
    In 1993, Intel engineers began the development of plastic pin grid array (PPGA) packages to alleviate potential performance-limiting package problems. Compared ...
  12. [12]
    [PDF] Mobile 4th Generation Intel® Core™ Processor Family, Mobile Intel ...
    Jul 2, 2014 · For rPGA processors, to achieve better memory performance and timing, Intel Design performed DDR Data pin swizzling that will allow a better ...
  13. [13]
    [PDF] PACKAGING
    Package Types. PGA – Pin Grid Array Package. • Material—the main body consists of co-firing multilayer alumina ceramics, and pin terminals made of an alloy of ...
  14. [14]
    What is PGA Package Substrate?
    It consists of a grid of pins arranged in a uniform pattern on the underside of the chip package. These pins are used to connect the chip to the motherboard or ...
  15. [15]
    Alumina | CoorsTek Technical Ceramics
    Alumina properties ; Thermal Conductivity (20° C) · Coefficient of Thermal Expansion (25-1000°C) · Specific Heat (100° C) ; W/m · 1x10-6/°C · J/kg*K ; 22.4 · 8.2 · 880 ...
  16. [16]
    Aluminum Nitride (AlN) Substrates | Products | MARUWA CO., LTD.
    With both extremely high thermal conductivity (170-230W/mK) and insulating properties. MARUWA's AlN substrate can be the best solution in electronics ...Missing: FR- | Show results with:FR-
  17. [17]
    What Are "Ceramic Packages"? - Kyocera
    Kyocera's ceramic packages are used in various fields due to their high strength, high thermal conductivity, design flexibility, and favorable thermal ...
  18. [18]
    https://global.kyocera.com/prdct/semicon/about_ceramic_package/detail/cm_pkg.html
  19. [19]
    Thermal conductivity of Aluminum nitride: Things to know
    Jan 20, 2025 · Electronic substrate: AlN substrates are used as military multi-chip modules. They function as heat dissipation boards in power electronics ...Properties Of Aln: A Quick... · Aln Properties: A Glance · Aluminum Nitride Cte
  20. [20]
    PCB Substrates Ceramic or Organic? Printed Circuit Board ... - ACDi
    Nov 15, 2016 · Ceramic PCBs boast better overall quality, higher resolution, and excellent bonding properties over organic, rendering the substrate more ...Missing: pin grid array
  21. [21]
    What is the Thermal Conductivity of Different PCBs [Solved]
    Sep 15, 2022 · T he thermal conductivity of FR4 is only 0.1W/mK to 0.5W/mK, but thanks to the copper in the PCB, the FR4 PCB thermal conductivity is better ...
  22. [22]
    Impact of temperature-dependent die warpage on TIM1 thermal ...
    However, large mismatch in coefficients of thermal expansion (CTE) between silicon die and organic substrate results in significant die/package warpage that ...
  23. [23]
    [PDF] An Introduction to Plastic Pin Grid Array (PPGA) Packaging
    Package Body Material. Ceramic body, Al bond wires. BT laminate, Ni/Cu slug ... This process is performed at the piece part supplier. Figure 4. Piece Part ...
  24. [24]
    A Comprehensive Guide to BGA Substrates - Highleap Electronic
    While early BGA packages utilized ceramic substrates, newer organic substrates now predominate due to their lower cost along with advantages in thermal shock ...
  25. [25]
    PGA Vs LGA: Types, Keyfeatures and Advantage - ELEPCB
    Mar 7, 2025 · Two widely used CPU socket types are PGA (Pin Grid Array) and LGA (Land Grid Array). The main difference between PGA and LGA is how they interconnect.
  26. [26]
    [PDF] MOULDED, PLASTIC PGA PACKAGES - Periodica Polytechnica
    The increase of the size of le chips and the numbers of the pins made it necessary to develop a new kind of package a couple of years ago. PGA packages have ...
  27. [27]
    [PDF] Packaging Influences Microprocessor Cost: 9/13/93 - CECS
    Sep 13, 1993 · CPGAs are expensive to manufacture. Figure 4 shows that a CPGA consists of layers of ceramic mater- ial that contain traces used to route ...
  28. [28]
    None
    Summary of each segment:
  29. [29]
    [PDF] Comparison Between Multilayer Ceramic and Organic Package ...
    Comparisons between organic and ceramic packaging is a difficult task given the considerable number of differences in material properties and.
  30. [30]
    [PDF] thermo-mechanical reliability models for life ... - Auburn University
    Also, certain packages are more expensive than others. Ceramic packages and hermetically sealed packages cost much more than PBGAs and DIPs. Not only are ...
  31. [31]
    Reversed pin grid array socket for the Intel Core-i7 processors - EE Times
    ### Summary of rPGA Information from the Article
  32. [32]
    [PDF] AMD Socket 940 Design Specification
    Sep 3, 2003 · This document defines the requirements for a 940-pin, 1.27-mm pitch, surface mount technology. (SMT), zero insertion force (ZIF) socket (herein ...Missing: staggered PGA
  33. [33]
    The Big Processor Guide - Sockets - 10stripe
    Has 940 pins, but is not physically compatible with Socket 940. Support for some Athlon 64s, Athlon 64 X2s, Semrpons, and Opterons. Manufacturer, Socket, Type ...
  34. [34]
    PGA Pin Grid Array Super Low Profile - E-tec Interconnect
    PGA Sockets THT Super Low Profile precision turned contacts contacts siting 0.60mm above the PCB with Insulator code “E” FR4 Epoxy and contact pitch 2.54 mm.Missing: stud embedded systems
  35. [35]
    Selective Gold Plating: Precision Solutions - Electro-Spec
    A plating process that selectively plates gold onto loose piece pins and contacts. This advanced precision plating process utilizes a controlled depth plating ...Missing: low profile PGA short embedded manufacturing
  36. [36]
    Pin-Grid Array | Advanced PCB Design Blog | Cadence
    Sep 29, 2025 · Pin Grid Array (PGA) is a packaging format predominantly used for microprocessors and microcontrollers. This design features pins organized in a consistent ...
  37. [37]
    Plastic Chip Carrier (PCC) Family .050 inch Lead Spacing ... - JEDEC
    Registration - Plastic Chip Carrier (PCC) Family .050 inch Lead Spacing, Square. Item 11.11-242. MO-047-B. Published: Dec 1969 ...
  38. [38]
    [PDF] PIN GRID ARRAY SOCKETS - Mill-Max
    Pin grid array sockets are designed to accept high pin count. IC's. They use low force 6-finger contacts to ease insertion / extraction of the device.
  39. [39]
    US6431878B1 - Socket for PGA package - Google Patents
    A socket for a PGA package includes a planar insulative housing for mounting a plurality of terminals in grid array fashion. Each of the terminals has a ...
  40. [40]
    PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 ...
    In stockThis socket has a metal cam, accepts any footprint on 13x13 to 21x21 grid, has a PPS body, BeCu contacts, and operates from -85°F to 257°F.Missing: types interfacing reliability EIA- 540
  41. [41]
    How Thermal Vias Enhance Heat Dissipation in PCBs - Sierra Circuits
    Thermal vias in PCBs transfer heat away from high-power components. They dissipate excess heat from hot spots to internal copper layers or external heat sinks.Missing: socket bending
  42. [42]
    Controlled Impedance Routing for Signal Integrity | Cadence
    Apr 30, 2025 · Controlled impedance routing prevents signal distortion by matching trace impedances to preserve signal integrity. Proper impedance matching ...Missing: PGA | Show results with:PGA
  43. [43]
    Why aren't components in DIP package shipped with straight pins?
    Sep 21, 2011 · ... pin is not bent at all and it sticks straight out and not down. When a pin is bent in shipping/handling it will be bent a max of + or - 10 deg.
  44. [44]
    [PDF] PGA / BGA / PLCC SOCKETS - March Electronics
    ENVIRONMENTAL CHARACTERISTICS. The sockets withstand the following environmental tests without mechanical and electrical defects:.
  45. [45]
    EIA-364: Electrical Connector Performance Test Standards
    This standard sets up a testing method for exposing connectors and sockets to extreme high and low temperatures at a specific ramp-up and ramp-down rate. None.Missing: 540 | Show results with:540
  46. [46]
    [PDF] AMD-K6-2E Embedded Processor Data Sheet
    platform-compatible, 321-pin ceramic pin grid array (CPGA) package allows the product designer to reduce time-to-market by leveraging today's cost-effective.
  47. [47]
    [PDF] PowerPC 601 and Alpha 21064: a tale of two RISCs - Computer
    431-pin PGA. 150 to 200 Mhz. 117 @ 200 MHz. 194 @ 200 Mhz. 50. (FXU), and the floating-point unit (FPU). The BU fetches instructions, executes branches, and ...
  48. [48]
    How to Identify Either my Laptop Socket is BGA or rPGA?
    Oct 20, 2014 · PGA = Pin Grid Array. PGA CPUs are inserted into a socket which means they can potentially be upgraded in the future. The BIOS must ...Missing: definition | Show results with:definition
  49. [49]
    Pin Grid Array (PGA) - Find TI packages - Texas Instruments
    Pin Grid Array (PGA) are high pin count, leaded substrate packages that are rectangular in shape with pin connections on the bottom. The ceramic package is ...
  50. [50]
    Fine pitch TAB assembly technology for 820 pin count ceramic PGA ...
    A ceramic pin grid array (PGA) package for industrial computers has been developed by applying tape automated bonding (TAB) technology to one of the largest ...
  51. [51]
    LGA vs. PGA: What's the Difference and Which is Better? - PCBasic
    Jun 3, 2025 · The pins of a PGA CPU can bend and even break when handled; that's a nonfunctioning CPU. PGA sockets are larger and have fewer pins than LGA ...Missing: count | Show results with:count
  52. [52]
    Ceramic Pin Grid Array | Evergreen Semiconductor Materials, Inc.
    A Ceramic Pin Grid Array (PGA) is a square or rectangular through-hole ceramic package with pins arranged in a square array at the bottom.Missing: history | Show results with:history
  53. [53]
    [PDF] ECE 546 Lecture 04 Resistance, Capacitance, Inductance
    Inductance (nH/m). 312.71680 23.42397 1.83394 0.14361 0.01128. 23.42397 ... 68-pin PGA pin† †. 2. 7. 256-pin PGA pin† †. 5. 15. Wire bond. 1. 1. Solder bump. 0.5.
  54. [54]
    Pin Grid Array (PGA) vs Ball Grid Array (BGA) Guide - PCBASAIL
    Jul 15, 2025 · PGA (Pin Grid Array) is a plug-in packaging type with vertical pins arranged in an array on the bottom surface, each approximately 3.4mm long.
  55. [55]
    LGA vs. PGA: What's the Difference and Which is Better? - PCBA Store
    Aug 1, 2025 · LGA has pins on the motherboard, while PGA has pins on the CPU. LGA is for performance, PGA is easier to install. LGA is more future-proof.<|control11|><|separator|>
  56. [56]
    LGA vs PGA - What's the Difference - IBE Electronics
    Oct 11, 2023 · PGA (Pin Grid Array). Advantages: Easy Installation: Installing CPUs with PGA sockets is generally straightforward & there's no need to worry ...Which One Is Better, Pga Or... · Does Cpu Socket Type Matter? · Lga Vs Pga Sockets
  57. [57]
    BGA, PGA, LGA - What do the different grid arrays mean? - spo-comm
    Jan 28, 2020 · The Staggered Pin Grid Array (SPGA) is characterized by staggered rows of connections. This variant is required for CPUs that have more than 200 ...Missing: highest count
  58. [58]
    Benefits of Using Ball Grid Arrays | Creative Hi-Tech Ltd
    Aug 27, 2019 · The pins used in the PGA packages are thin and fragile. Thus, these pins are easily damaged or bent. However, this does not happen with BGA ...<|control11|><|separator|>
  59. [59]
    LGA vs. PGA vs. BGA - PCBX
    Nov 26, 2024 · Staggered Pin Grid Array (SPGA): Has staggered pins to provide higher pin counts. Can be utilized by most new processors with over 200 pins.Missing: pitch | Show results with:pitch<|separator|>