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AMD APU

The AMD Accelerated Processing Unit (APU) is a microprocessor developed by Advanced Micro Devices (AMD) that integrates a central processing unit (CPU) and a graphics processing unit (GPU) onto a single die, enabling efficient combined processing for computing, graphics, and multimedia tasks in devices such as desktops, laptops, and embedded systems.^[1] Introduced in 2011 as part of AMD's Fusion initiative, the first APUs combined multi-core x86 CPU technology—initially based on the Bobcat microarchitecture—with a DirectX 11-capable Radeon GPU core, a parallel processing engine, and hardware-accelerated video decoding, all connected via a high-bandwidth on-chip bus to support seamless data sharing and reduced latency.^[1]^[2] The launch included low-power E-Series and C-Series models for ultrathin notebooks and netbooks, followed by the higher-performance A-Series "Llano" APUs in mid-2011, which delivered up to 500 GFLOPs of graphics performance and all-day battery life in mobile systems.^[1] Over the subsequent years, AMD's APU lineup evolved significantly, transitioning from early architectures like Bulldozer to the Zen family in the Ryzen series, incorporating advanced GPU designs based on RDNA architectures for enhanced gaming and content creation capabilities. By 2022, Rembrandt-based Ryzen 6000 Series mobile APUs on a 6 nm process featured Zen 3+ CPU cores and RDNA 2 graphics, supporting up to 1080p gaming at configurable thermal design powers (TDPs) from 15 W to 45 W. Desktop APUs, such as the Ryzen 7000 Series with integrated RDNA 2 graphics on the AM5 socket, introduced DDR5 memory support and up to 16 cores for broader productivity and light gaming without discrete GPUs. As of 2025, AMD's APU portfolio includes high-end mobile offerings like the Strix Halo architecture, which pairs Zen 5 CPU cores with up to 40 RDNA 3.5 compute units for uncompromising performance in thin-and-light laptops, alongside desktop Ryzen 8000G Series APUs and anticipated Ryzen 9000G refreshes emphasizing AI acceleration via XDNA NPUs.^[3]^[4] These designs prioritize power efficiency, cost savings through integration, and unified memory access, making APUs ideal for budget gaming rigs, embedded applications, and emerging AI workloads while competing in markets traditionally dominated by discrete graphics solutions.^[5]

Introduction

Definition and Purpose

An Accelerated Processing Unit (APU) is a system on a chip (SoC) developed by AMD that integrates x86 CPU cores and a discrete-level GPU on a single die, enabling enhanced efficiency and performance for general computing tasks.^[1] This design combines central processing capabilities with graphics acceleration in a unified package, distinct from traditional setups that pair separate CPU and discrete GPU components.^[1] The primary purpose of an AMD APU is to facilitate seamless collaboration between the CPU and GPU through shared system memory, which allows unified memory access and minimizes data transfer latency between the processors.^[6] This integration reduces overall power consumption and manufacturing costs compared to discrete CPU-GPU configurations, while simplifying system design by eliminating the need for high-bandwidth interconnects like PCIe for inter-processor communication.^[1] Additionally, it promotes energy-efficient operation suitable for mobile and embedded applications without sacrificing computational versatility.^[7] At its core, an AMD APU consists of AMD64-compatible CPU cores for general-purpose computing, an integrated Radeon-branded GPU for graphics and parallel processing, and shared resources such as a memory controller and I/O interfaces that enable cohesive operation.^[1] The CPU handles sequential tasks and system management, while the GPU accelerates vectorized workloads, with both accessing the same memory pool to optimize data sharing.^[6] AMD introduced the APU under the "Fusion" branding in 2011, later transitioning to the A-Series designation for consumer and embedded products, and subsequently incorporating them into the Ryzen lineup with integrated Radeon Graphics starting in 2018.^[1]^[8]^[9]

Significance and Applications

AMD Accelerated Processing Units (APUs) hold significant market importance in budget and mid-range laptops, all-in-one PCs, and embedded systems, where their integrated design facilitates compact, cost-effective solutions without the need for discrete graphics cards.^[10] This enables the creation of thin-and-light laptops and space-constrained devices like all-in-one desktops, which prioritize portability and affordability over high-end performance.^[11] In the embedded sector, APUs such as the AMD Embedded G-Series have been pivotal since their introduction, providing flexible platforms for industrial applications while adhering to stringent size and power requirements.^[12] Key applications of APUs span entry-level gaming, content creation, AI acceleration, gaming consoles, and industrial or automotive embedded systems. In entry-level gaming, APUs like the Ryzen AI Max Series deliver capable integrated graphics for casual play without additional hardware.^[13] For content creation tasks such as video editing, APUs support efficient processing through combined CPU and GPU resources. Recent models incorporate neural processing units (NPUs) for AI acceleration, enabling on-device inference in laptops and edge devices.^[14] Iconic examples include the custom Jaguar-based APUs powering the PlayStation 4 and [Xbox One](/page/Xbox One) consoles, which integrated CPU and GPU capabilities to drive immersive gaming experiences.^[15] In industrial and automotive domains, APUs like the Ryzen Embedded V2000A Series handle real-time sensor data processing for advanced driver-assistance systems (ADAS) and in-vehicle infotainment.^[16] The primary advantages of APUs stem from their space-saving integration of CPU and GPU on a single die, which reduces overall system complexity and board real estate compared to discrete configurations.^[17] This integration enhances power efficiency, with mobile APUs typically operating in a TDP range of 15W to 65W, contributing to longer battery life in laptops and lower thermal demands.^[18] Such scalability allows original equipment manufacturers (OEMs) to tailor APUs for diverse form factors, from ultrabooks to rugged embedded units, while maintaining consistent performance profiles.^[19] APUs address key challenges in traditional CPU-GPU setups by mitigating bandwidth bottlenecks through direct on-chip interconnects, enabling faster data sharing between processing elements. This is particularly beneficial for hybrid workloads like video encoding, where the CPU and GPU collaborate seamlessly—facilitated briefly by technologies such as Heterogeneous System Architecture (HSA)—to optimize throughput without excessive memory transfers.^[20]^[21]

History

Origins and Fusion Initiative

The origins of the AMD Accelerated Processing Unit (APU) trace back to AMD's acquisition of ATI Technologies in October 2006, which provided the graphics expertise necessary to pursue integrated CPU-GPU designs.^[22] The $5.4 billion deal, completed on October 24, 2006, merged AMD's microprocessor capabilities with ATI's GPU technology, enabling the company to develop unified processor architectures.^[22] Immediately following the acquisition, AMD announced its "Fusion" initiative on October 25, 2006, aiming to create processors that combined central processing units (CPUs) and graphics processing units (GPUs) on a single die or package.^[22] The primary goals of the Fusion initiative were to deliver discrete graphics-level performance within an integrated solution, thereby improving efficiency and reducing power consumption for mainstream computing.^[23] Targeted at laptops and desktops, Fusion sought to provide enhanced visual computing experiences without the need for separate discrete GPUs, positioning AMD to compete directly with Intel's evolving integrated graphics offerings in its Core i-series processors.^[23]^[24] This integration was envisioned to enable modular designs that leveraged both CPU and GPU compute capabilities, with initial platforms planned for commercial clients, mobile devices, and gaming by 2007, and full Fusion processors by late 2008 or early 2009.^[22] Development of early Fusion prototypes accelerated in the late 2000s, pairing AMD's K10 (Stars) CPU architecture with ATI's TeraScale GPU technology to create system-on-chip (SoC) solutions.^[25] This shift marked AMD's transition from selling standalone CPUs and GPUs to producing cohesive SoCs, responding to industry demands for more efficient, all-in-one processors amid Intel's advancements in integrated graphics.^[24] Internal codenames such as "Llano" were assigned to the first desktop-oriented APU prototype, which combined K10-based CPU cores with a TeraScale GPU on a single die, laying the groundwork for subsequent releases.^[25]

Launch and Early Adoption

The initial commercial launches of AMD's Accelerated Processing Units (APUs) occurred in 2011, beginning with the low-power Ontario and Zacate APUs of the Brazos platform in the first quarter, followed by the desktop Llano platform in June and its mobile variants later that year. The Llano APUs, built on a 32nm process and integrating K10-based CPU cores with Radeon HD 6000-series graphics, were introduced under the A-Series branding to target mainstream consumer desktops. These releases represented AMD's first widespread deployment of fused CPU-GPU architectures, branded as A-Series processors with embedded Radeon HD graphics to deliver enhanced multimedia and light gaming capabilities without discrete GPUs.^[1] Early adoption was favorable, particularly for graphics-intensive tasks where Llano APUs outperformed Intel's Sandy Bridge integrated GPUs, achieving up to four times higher frame rates in benchmarks like 3DMark and select games. Positioned for budget systems, the APUs gained traction in entry-level PCs and netbooks, with models like the A8-3850 priced at $135 to undercut competitors and drive volume sales among cost-sensitive consumers and OEMs.^[26] Positive reviewer feedback on integrated graphics performance spurred uptake in affordable all-in-one systems and slim laptops, helping AMD capture share in the sub-$500 PC segment. Despite these strengths, early APUs encountered hurdles such as elevated power consumption, exemplified by Llano's 100W TDP which constrained thermal designs in compact chassis. The 32nm fabrication process also imposed efficiency limitations relative to emerging competitors' nodes, impacting battery life in mobile variants. In the nascent tablet space, AMD's x86-based APUs faced rivalry from Nvidia's ARM-oriented Tegra 2 SoCs, which prioritized ultra-low power for longer runtime in portable devices.^[27] A key milestone came with the 2012 launch of the Trinity APUs, which transitioned to the FM2 socket for desktops and improved integration, broadening ecosystem support and paving the way for further refinements.^[28] By 2013, APU adoption in OEM laptops had grown substantially, evidenced by partnerships like AMD's collaboration with HP to deliver over one million APU-equipped units to the Chinese market.^[29]

Evolution to Zen and Beyond

In the mid-2010s, AMD advanced its APU lineup by integrating Graphics Core Next (GCN) GPUs with the Kaveri APUs launched in 2014, marking the first use of this architecture in integrated graphics for improved compute and gaming performance.^[30]^[31] Concurrently, the company introduced the low-power Puma platform, featuring Mullins and Beema APUs targeted at tablets and ultrathin devices, which delivered up to twice the battery life and 25% better overall performance compared to prior generations like Temash.^[32] By 2015, the Carrizo APUs with Excavator cores further enhanced efficiency, achieving up to 25% longer battery life and 20% faster graphics performance through optimizations like improved voltage scaling and a more integrated SoC design.^[33] The transition to Zen architectures began in 2017 with Raven Ridge, AMD's first APU combining Zen CPU cores and Vega graphics, which extended support for the AM4 socket through at least 2020 to prolong platform longevity.^[34] This shift enabled better multi-threaded performance and integrated graphics capable of 1080p gaming without discrete GPUs. In 2020, the Renoir APUs adopted the Zen 2 microarchitecture on a 7nm process, doubling transistor density over prior 14nm designs and boosting single-threaded performance by up to 25% while maintaining Vega graphics for balanced mobile and desktop use.^[35] Recent developments have focused on graphics and AI enhancements, with the 2022 Rembrandt APUs introducing RDNA 2 integrated GPUs for ray tracing support and up to 50% more compute units than Vega predecessors, enabling solid 1080p gaming on 6nm processes.^[36] The 2023 Phoenix APUs paired Zen 4 cores with RDNA 3 graphics, delivering improved efficiency and AI acceleration on a 4nm node.^[37] In 2024, Strix Point APUs added a dedicated neural processing unit (NPU) delivering 50 TOPS for AI workloads, powering the Ryzen AI 300 series and advancing Copilot+ PC capabilities with Zen 5 cores and RDNA 3.5 graphics.^[38] APUs have expanded into high-impact applications, including custom Zen 2 variants in the PlayStation 5 console for seamless CPU-GPU integration in gaming.^[39] Their role in AI PCs has grown significantly, with Ryzen AI processors enabling on-device inference and over 150 AI PC models available by 2025, driving productivity and creative tools.^[40] In laptops, APUs now form the core of AMD's client portfolio, supporting the surge in thin-and-light designs with integrated AI and graphics.

Architectural Features

CPU Microarchitectures in APUs

The CPU microarchitectures in AMD APUs began with the K10-based "Stars" cores used in early desktop-oriented models like Llano. These cores featured up to four standard cores with dedicated floating-point units on a 32 nm process, emphasizing multi-threaded workloads to complement integrated graphics.^[41] Concurrently, the Bobcat microarchitecture powered low-power APUs, delivering a dual-issue, out-of-order execution model on a 40 nm process tailored for netbook and ultrathin applications with single or dual cores optimized for efficiency over peak performance.^[42] Subsequent iterations refined the Bulldozer lineage through the Piledriver microarchitecture, which introduced enhancements like improved branch prediction and floating-point scheduling, yielding approximately 15% higher instructions per clock (IPC) compared to Bulldozer while maintaining the modular structure. Steamroller followed, expanding execution units for wider integer and floating-point throughput, achieving up to 20% IPC gains over Piledriver through better resource sharing within modules and support for advanced instruction sets.^[43] The Puma family, a derivative optimized for mobile devices, refined Jaguar cores with enhanced power gating and decode efficiency for ultra-low-power scenarios, prioritizing battery life in thin-and-light systems.^[44] Excavator concluded this era, delivering a 14% IPC uplift over Steamroller via larger caches and optimized pipelines on a 28 nm process, marking a shift toward higher efficiency in mainstream mobile APUs.^[45] The Zen series represented a complete redesign, debuting in APUs with Zen 1 cores on a 14 nm process, supporting 4 to 8 cores per chip with simultaneous multithreading (SMT) for improved single-threaded performance through a wider front-end and deeper execution resources.^[46] Zen+ refined this on a 12 nm process, reducing latencies in cache and memory subsystems for up to 3% IPC gains while enabling higher boost clocks in APU configurations. Zen 2 advanced to a 7 nm process with a partial chiplet layout, incorporating a monolithic die for APUs but leveraging modular CCDs for scalability, alongside doubled L3 cache per core complex for better multi-core efficiency.^[47] Zen 3 emphasized higher clock speeds through unified L3 cache designs and improved branch prediction, achieving 19% IPC uplift over Zen 2 in APU variants. Zen 4 introduced AVX-512 support with double-pumped 256-bit execution units on a 4 nm monolithic die in APU configurations, enhancing vector workloads in integrated systems.^[48] Zen 5 further boosts IPC by ~16% via enhanced branch prediction with dual decode pipes and wider pipelines, targeting AI-accelerated APUs on advanced nodes.^[49] APU-specific adaptations across these microarchitectures emphasize balanced core counts from 2 to 16 to optimize power efficiency, allowing seamless scaling for thermal constraints in laptops and desktops while pairing CPU performance with integrated GPUs. In some embedded variants, elements like programmable logic akin to FPGA fabrics are integrated alongside Ryzen cores via the Embedded+ architecture, enabling customizable acceleration for edge AI and real-time processing.^[50]

GPU Microarchitectures in APUs

The GPU microarchitectures in AMD Accelerated Processing Units (APUs) have evolved significantly since the introduction of integrated graphics, transitioning from the TeraScale architecture to the more advanced RDNA family, with each generation enhancing rendering efficiency, compute capabilities, and API support tailored for power-constrained environments. In the TeraScale era, AMD employed the TeraScale 2 microarchitecture, based on a Very Long Instruction Word (VLIW5) design, in early APUs such as Llano and Trinity. This architecture featured up to 80 shader processors organized into 5 shader engines, enabling DirectX 11 compatibility for improved tessellation and geometry processing in graphics workloads. Later Piledriver-based APUs incorporated refinements from TeraScale 3 and 4, which introduced enhanced tessellation units and minor efficiency gains in pixel and vertex processing pipelines, though still limited by the VLIW paradigm's scalability issues. The shift to the Graphics Core Next (GCN) family marked a pivotal advancement, starting with GCN 1.0 in APUs like Kabini and Kaveri, which unified scalar and vector processing through a single-instruction multiple-data (SIMD) approach across compute units (CUs). This generation supported OpenCL 1.2 for general-purpose GPU computing and delivered up to 6 CUs in mobile variants, focusing on balanced rasterization and basic compute tasks. GCN 2.0, featured in Carrizo, added asynchronous compute engines to allow concurrent graphics and compute operations, reducing pipeline stalls and improving throughput in multi-threaded applications. Subsequent iterations included GCN 3.0 in Bristol Ridge, which emphasized higher clock speeds—up to 1 GHz in some configurations—for better performance in legacy DirectX 12 workloads without major architectural overhauls. The GCN 5.0 variants, based on Vega, appeared in Zen-based APUs such as Raven Ridge, Picasso, Renoir, and Cezanne, scaling to 8–11 CUs with high-bandwidth cache controllers and early hardware support for ray tracing primitives like bounding volume hierarchy traversal acceleration. The transition to the RDNA architecture brought further optimizations for gaming and AI workloads in APUs. RDNA 2, integrated in Rembrandt APUs, utilized 12 CUs with a dual-issue wavefront architecture, enhancing rasterization efficiency by up to 50% over Vega through improved instruction scheduling and primitive shaders. RDNA 3, integrated in Phoenix APUs, incorporated dedicated AV1 encode hardware and dual compute engines per workgroup processor for superior video processing and ray tracing performance. The latest RDNA 3.5, found in Strix Point APUs, expands to up to 16 CUs with refined ray tracing accelerators and integrated AI upscaling engines, enabling efficient hardware-accelerated neural rendering in thin-and-light devices. APU-specific optimizations across these microarchitectures emphasize scalability and resource sharing, with configurable CU counts ranging from 2 to 16 to match thermal and power envelopes. Recent models achieve shared memory bandwidth exceeding 100 GB/s via unified L3 caches and Infinity Fabric interconnects, while supporting modern APIs like Vulkan 1.3 for cross-platform compute and DirectX 12 Ultimate for advanced mesh shading and variable rate shading.

Integration Technologies

The Heterogeneous System Architecture (HSA), co-developed by AMD and introduced in 2013 through the HSA Foundation, enables cohesive CPU-GPU integration in APUs by allowing direct pointer sharing between the CPU and GPU, eliminating the need for data copying. This architecture provides unified virtual addressing across processors, permitting seamless memory access, and supports hOpenCL for heterogeneous computing tasks that leverage both CPU and GPU resources without kernel recompilation. HSA's design facilitates low-latency task dispatching to the GPU independently of the CPU, enhancing overall system efficiency for parallel workloads.^[51] Full HSA implementation in AMD APUs began with the Carrizo series in 2015, building on partial support in earlier models like Kaveri, and has since become a cornerstone for compute-intensive applications in subsequent generations. By unifying the programming model, HSA reduces overhead in heterogeneous computing, allowing developers to treat the APU as a single coherent system for tasks such as image processing and machine learning acceleration.^[52]^[53] The memory subsystem in AMD APUs emphasizes shared access to optimize CPU-GPU interactions, evolving from DDR3 support in early architectures to high-bandwidth LPDDR5X-7500 in modern designs like Strix Point. In Zen-based APUs, a shared L3 cache—typically 4-16 MB depending on configuration—serves both CPU cores and the integrated GPU, reducing latency for common data sets and improving cache coherency through hardware-managed protocols. Starting with Zen 2+ chiplet implementations, Infinity Fabric interconnect provides scalable, high-speed communication between dies, achieving bandwidths up to 40-60 GB/s for inter-component data transfer in multi-chiplet APUs.^[54]^[55] Power and thermal management in APUs incorporate dynamic voltage and frequency scaling (DVFS) applied jointly to CPU and GPU domains, enabling real-time adjustments based on workload demands to balance performance and efficiency. Thermal design power (TDP) configurations span ultra-low 4W for embedded and handheld applications to 120W for high-end desktop and mobile variants, with configurable profiles allowing system designers to tailor power envelopes. An integrated northbridge on the APU die handles I/O coherency and memory controller functions, minimizing external dependencies and latency in data routing.^[56]^[57]^[58] Further integrations enhance APU versatility, including an Input-Output Memory Management Unit (IOMMU) that supports secure virtualization by enabling direct memory access (DMA) remapping for GPU tasks in virtualized environments. PCIe support has advanced to version 4.0 in Zen 3+ APUs and 5.0 in select Zen 4+ models, providing up to 28 lanes in Phoenix APUs for expanded peripheral connectivity. Beginning with Zen 4+, APUs incorporate a dedicated Neural Processing Unit (NPU) based on the XDNA architecture, as seen in Strix Point, delivering up to 50 TOPS for AI inference while maintaining power efficiency through dedicated accelerators.^[59]

TeraScale-based APUs

Llano (2011)

Llano, released in June 2011, marked AMD's entry into desktop accelerated processing units (APUs) with the codename Llano and the introduction of the FM1 socket. The platform featured the A4, A6, and A8 series processors, offering dual- and quad-core configurations based on the Stars microarchitecture derived from the K10 family, providing 2 to 4 cores and corresponding threads without simultaneous multithreading.^[60]^[61] The integrated graphics drew from the Radeon HD 6000 series using the TeraScale 2 architecture, with variants including the HD 6410D (160 shading units) for A4 models, HD 6530D (320 shading units) for A6 models, and HD 6550D (400 shading units) for A8 models, delivering up to 480 GFLOPS of peak performance.^[62]^[63]^[64] These APUs supported Dual Graphics mode, allowing combination with compatible discrete AMD GPUs for enhanced rendering via crossfire technology. Fabricated on a 32 nm silicon-on-insulator (SOI) process by GlobalFoundries, Llano APUs contained 1.178 billion transistors across a 228 mm² die.^[60] They supported dual-channel DDR3 memory up to 1866 MT/s and operated within a 65–100 W thermal design power (TDP) envelope, balancing performance for mainstream desktops. As the first desktop APU to integrate DirectX 11-capable graphics, Llano pioneered unified CPU-GPU designs for consumer systems, significantly outperforming Intel's HD Graphics 2000 in gaming workloads—delivering up to 3–4 times higher frame rates in titles like Dirt 2 at 1680x1050 resolution. Its efficient video decode capabilities and low-power integrated graphics made it popular for budget home theater PCs (HTPCs) and all-in-one systems, enabling 1080p playback and light gaming without discrete GPUs.^[65]^[66]

Bobcat-based APUs (2011)

The Bobcat-based APUs, released in early 2011 as part of AMD's Brazos platform, targeted ultra-portable devices such as netbooks, mainstream laptops, and tablets with low-power requirements. These APUs integrated one or two Bobcat CPU cores, operating at clock speeds ranging from 1.0 to 1.6 GHz, under the E-Series (Zacate codename for netbooks) and C-Series (Ontario codename for mainstream low-power laptops).^[67] The Desna variant, aimed at tablets under the Z-Series branding, featured similar dual-core configurations at around 1.0 GHz but included enhanced display output support for touch-enabled devices.^[68] Fabricated on a 40 nm process node by TSMC, these APUs supported single-channel DDR3-1066 memory and had thermal design power ratings of 9–18 W, enabling fanless designs in slim form factors.^[69]^[2] The integrated graphics were based on the TeraScale 2 architecture, branded as Radeon HD 6xxxG series, with five compute units delivering approximately 30–50 GFLOPS of peak performance depending on the model and clock speeds up to 500 MHz. For instance, the Zacate E-350 featured the Radeon HD 6310 with 80 shader processors at 488 MHz, while Ontario models like the C-50 used the Radeon HD 6250 at lower clocks for reduced power draw.^[70] These GPUs included the third-generation Unified Video Decoder (UVD3), supporting hardware-accelerated 1080p video playback for H.264 and other formats, which enhanced multimedia capabilities in battery-constrained systems. The overall design emphasized integration on a single die, with die sizes around 75 mm², prioritizing cost efficiency over high transistor density.^[2] These APUs marked AMD's first sub-10 W offerings for the netbook and tablet markets, outperforming Intel's Atom processors in multimedia workloads and light productivity tasks by up to 80% in JavaScript execution while maintaining comparable power efficiency. The Brazos platform's reception was positive for reviving interest in x86-based ultra-portables, as the combined CPU-GPU setup enabled smooth 720p video playback and basic 3D graphics without discrete components. However, the in-order execution of Bobcat cores limited multithreaded performance, positioning these APUs as entry-level solutions rather than direct competitors to higher-end mobile chips. Desna's addition of multiple display outputs facilitated early Windows 7 tablet adoption, though overall adoption was tempered by the era's shift toward ARM-based alternatives.^[71]

Piledriver-based APUs (2012–2013)

The Piledriver-based APUs represented AMD's second-generation desktop and mobile accelerated processing units, succeeding the Llano architecture and bridging the TeraScale graphics era. Launched under the codenames Trinity and Richland, these APUs integrated Piledriver CPU cores with Radeon HD 7000 and 8000 series graphics, respectively, on the FM2 socket for desktops. They targeted mainstream consumer systems, emphasizing balanced performance for multimedia, light gaming, and everyday computing in budget-oriented PCs and laptops.^[72] Trinity debuted in May 2012 for mobile platforms, with desktop variants following in October 2012, while Richland arrived as a refresh in March 2013 for mobiles and June 2013 for desktops. The lineup spanned the A4 to A10 series, featuring 1 to 2 Piledriver modules (2 to 4 cores and threads), with base clocks starting at 2.0 GHz for entry-level models and peaking at 4.2 GHz for Trinity's flagship A10-5800K, which could turbo up to 4.2 GHz. Richland models, such as the A10-6800K, pushed frequencies higher to a 4.1 GHz base and 4.4 GHz turbo, offering modest gains through architectural tweaks and higher binning. These APUs supported up to 4 MB of L2 cache and were designed for multi-threaded workloads, though single-thread performance remained competitive primarily in value segments.^[73]^[28]^[74] Both platforms utilized a 32 nm SOI process node, with Trinity dies measuring 246 mm² and containing 1.303 billion transistors; Richland retained the same die size and transistor count as a silicon refresh, focusing on optimizations rather than a node shrink. Thermal design power (TDP) ranged from 65 W to 100 W for desktops and as low as 35 W for mobiles, enabling efficient operation in compact systems. Memory support included dual-channel DDR3-1866, an upgrade from prior generations, enhancing bandwidth for integrated graphics tasks. Piledriver delivered approximately 10-15% higher instructions per clock (IPC) compared to the original Bulldozer cores, primarily through improved branch prediction, floating-point execution, and reduced latency in the shared FPU, though multi-threaded scaling was limited by the module design.^[75]^[72] Graphics integration featured TeraScale 3 (Radeon HD 7000 series) in Trinity and TeraScale 3 (Radeon HD 8000 series) in Richland, with up to 384 shader processors (6 compute units) configurable across models. Peak performance reached approximately 614 GFLOPS in top Trinity configurations at 800 MHz GPU clocks, scaling to around 650 GFLOPS in Richland's higher-binned 844 MHz variants, supporting DirectX 11 and hardware-accelerated video decode via UVD3.^[76]^[77] These iGPUs excelled in budget gaming, delivering playable frame rates in titles like League of Legends at 1080p low settings when paired with dual-channel memory. PowerTune technology enabled dynamic GPU boosting within TDP limits, improving efficiency during bursty workloads like video playback or casual gaming.^[73]^[72] Key innovations included native USB 3.0 support via the accompanying A85X and A75 chipsets, providing up to four USB 3.0 ports alongside 10 USB 2.0 ports for enhanced peripheral connectivity in mainstream builds. The FM2 platform also introduced overclocking via AMD OverDrive for unlocked "K" models, appealing to enthusiasts on a budget. Reception was positive in the value market, where these APUs powered affordable all-in-one PCs and HTPCs, capturing significant share in emerging markets and contributing to APUs comprising nearly 75% of AMD's processor unit shipments by late 2012. Their integrated design reduced system costs, making them popular for entry-level gaming rigs capable of 30+ FPS in older titles without discrete GPUs.^[78]^[79]

Graphics Core Next-based APUs

Jaguar-based APUs (2013)

The Jaguar-based APUs, released in the second quarter of 2013, marked AMD's shift to a new low-power x86 core architecture paired with Graphics Core Next (GCN) graphics for mainstream mobile and ultra-low-power applications. Codenamed Kabini for entry-level laptops and Temash for tablets and embedded devices, these APUs targeted thin-and-light systems with improved power efficiency over prior generations. The A4 and A6 series processors featured four Jaguar cores with out-of-order execution, operating at clock speeds ranging from 1.5 GHz for the A4-5000 to 2.0 GHz for the A6-5200 in Kabini variants, and lower 1.0 GHz base (up to 1.4 GHz turbo) in the Temash A6-1450.^[80]^[81]^[82] These APUs were fabricated on a 28 nm process node, supporting DDR3-1600 memory in a single-channel configuration and delivering thermal design power (TDP) ratings from 15-25 W for Kabini to as low as 4-8 W for Temash, enabling fanless designs in ultrathin tablets. The packages used BGA mounting typical for mobile SoCs, with some variants compatible with FT3/FT4 interfaces in modular systems. Kabini and Temash found adoption in entry-level laptops like the Acer Aspire series and tablets, while custom variants powered the PlayStation 4 and Xbox One consoles, contributing to over 100 million indirect unit shipments through these gaming platforms by leveraging the same Jaguar and GCN foundations.^[83]^[84]^[85]^[15] The integrated GPUs, branded under the Radeon HD 8000 series, utilized GCN 1.0 architecture with 2 or 4 compute units (CUs) delivering up to approximately 300 GFLOPS of single-precision compute performance, depending on configuration and clock speeds up to 600 MHz. For instance, the A4-5000 paired with Radeon HD 8330 (2 CUs at 497 MHz), while higher-end A6 models used variants like HD 8400 (up to 4 CUs). These GPUs supported OpenCL 1.2 for general-purpose computing, enabling basic heterogeneous workloads alongside DirectX 11.1 graphics.^[86]^[87] Jaguar-based APUs delivered 20-25% better power efficiency compared to the preceding Piledriver architecture, primarily through smaller core design and optimized branch prediction, allowing sustained performance at lower TDPs. The Temash platform, in particular, achieved a configurable 3.95-8 W TDP, facilitating extended battery life in tablets without compromising quad-core x86 compatibility. Reception highlighted their role in reviving AMD's mobile presence, especially via console integrations that validated the architecture's scalability for real-time rendering and multitasking.^[88]^[89]^[90]^[91]

Steamroller and Puma-based APUs (2014–2015)

The Steamroller and Puma microarchitectures marked AMD's transition to more efficient APUs in 2014, targeting both mainstream desktop/mobile and low-power portable devices. The Kaveri family, based on Steamroller, debuted in the first quarter of 2014 for FM2+ socket desktop and mobile platforms, with models like the A10-7850K offering up to four cores clocked at 3.7 GHz.^[92]^[93] A refresh under the Godavari codename followed in the second quarter of 2015, introducing minor clock boosts such as the A10-7870K at up to 3.9 GHz while retaining the core architecture.^[94] Concurrently, the Puma-based Beema and Mullins platforms launched in early 2014, optimized for low-power applications with quad-core configurations in the A6 to A10 series reaching up to 2.4 GHz, emphasizing battery life in tablets and convertibles.^[95]^[96] These APUs were fabricated on a 28 nm process, with Kaveri featuring 2.41 billion transistors across a 245 mm² die, while Puma variants like Beema and Mullins integrated similar densities for compact SoCs.^[97] Thermal design power ranged from 65–95 W for desktop Kaveri models to 12–25 W for mobile Beema, with Mullins extending to ultra-low configurations as low as 2.5 W for fanless designs.^[98]^[99] Memory support included DDR3-2133, and Mullins notably incorporated SATA 6 Gb/s for enhanced storage connectivity in embedded and portable systems.^[100] The Steamroller cores in Kaveri improved instruction-level parallelism over prior architectures, while Puma refined Jaguar's efficiency for bursty workloads, as detailed in broader microarchitecture overviews.^[92] GPU integration advanced with Graphics Core Next (GCN) 1.2/2.0 architectures, branded as Radeon R7 and R5 in Kaveri and Puma respectively, featuring up to 8 compute units (CUs) for Kaveri and up to 6 for Puma variants for scalable performance.^[101] Kaveri's top configurations delivered up to approximately 0.86 TFLOPS of FP32 compute at base clocks, enabling smooth 1080p gaming and multimedia tasks without discrete graphics.^[102] HSA preview functionality first appeared in Kaveri, allowing preliminary unified memory access between CPU and GPU to streamline heterogeneous computing, though full interoperability required software ecosystem maturity.^[43] Innovations included Kaveri's support for 4K video decoding and display output via updated UVD 4.2 and VCE 2.0 engines, facilitating Ultra HD playback in compatible systems.^[103] Puma platforms, particularly Mullins at configurable TDPs around 10.6 W, were tailored for 2-in-1 convertibles and tablets, prioritizing all-day battery life and seamless mode switching.^[95] These APUs received mixed reception; Kaveri was praised for its integrated graphics leap and HSA potential but criticized for modest CPU gains over predecessors and premium pricing relative to Intel Haswell alternatives.^[104] Puma variants fared better in low-power niches, offering competitive efficiency for media consumption devices despite limited high-end appeal.

Excavator-based APUs (2015–2016)

The Excavator-based APUs represented AMD's sixth and seventh generation A-Series processors, integrating the Excavator CPU microarchitecture with Graphics Core Next (GCN) 3.0 graphics to target mobile and entry-level desktop markets. These platforms, including Carrizo, Carrizo-L, Bristol Ridge, and Stoney Ridge, emphasized energy efficiency improvements over prior Steamroller designs while supporting Heterogeneous System Architecture (HSA) for unified CPU-GPU computing.^[105] Carrizo APUs launched in the second quarter of 2015 for mobile devices, featuring quad-core Excavator configurations under the A6 to A12 branding with clock speeds up to 3.7 GHz. The lower-end Carrizo-L variant followed in the fourth quarter of 2015, also mobile-focused but with dual- or quad-core Puma+ cores derived from Excavator for mainstream configurations at reduced power levels.^[33] Bristol Ridge and Stoney Ridge arrived in the second quarter of 2016, with Bristol Ridge serving desktop systems on the FM2+ socket and Stoney Ridge targeting mobile ultrabooks via the FP4 package; both offered A6 to A12 models with up to four Excavator cores reaching 3.8 GHz in the top A12-9800.^[106]^[107] These APUs integrated Radeon R6 Graphics based on GCN 3.0, scaling from 3 to 8 compute units (CUs) across variants for peak performance up to approximately 730 GFLOPS, enabling features like hardware-accelerated H.265 decoding for 4K video.^[108] Full HSA 1.0 compliance allowed seamless GPU context switching and shared memory access between CPU and GPU, facilitating compute tasks without data copying overhead. All models supported DDR3L-1866 memory in dual-channel configurations for Bristol Ridge and single-channel for Stoney Ridge, with configurable TDPs from 12-35 W in mobile SKUs and 65 W for desktops. Fabricated on a 28 nm process, Carrizo and Carrizo-L dies measured around 250 mm² with approximately 3.1 billion transistors, while Bristol Ridge and Stoney Ridge used smaller 124-182 mm² dies with 1.2-2.4 billion transistors for better efficiency.^[109]^[106] AMD FreeSync technology was added for adaptive display refresh rates, enhancing multimedia playback up to 4K resolution. Excavator cores delivered up to 15% higher instructions per clock (IPC) compared to Steamroller, achieved through wider execution units and improved branch prediction without increasing die size significantly. Carrizo platforms specifically boosted notebook battery life by around 20% over predecessors through optimized power gating and voltage-frequency scaling, targeting all-day usage in ultrabooks for tasks like video streaming and light productivity.^[110] As the final APUs for the FM2+ socket, Bristol Ridge extended support for legacy AM4 motherboards, but the lineup overall found strength in cost-effective ultrabooks where integrated graphics excelled in casual gaming and media.^[111] However, they were overshadowed by Intel's Skylake processors, which offered superior single-threaded performance and broader ecosystem adoption in the mainstream laptop segment.^[112]

Zen-based APUs with GCN Graphics (2017–2021)

The Zen-based APUs with GCN graphics marked AMD's transition to integrating its high-performance Zen CPU cores with the Graphics Core Next (GCN) 5th generation architecture, specifically Vega graphics, in a monolithic die design. The series began with the Raven Ridge APUs, which debuted in mobile form factor at the end of 2017 and expanded to desktop with the Ryzen 2000G series in February 2018, supporting the AM4 socket for desktops and FP5 for mobiles. This was followed by the Picasso refresh in January 2019 for mobile and July 2019 for desktop Ryzen 3000G models, leveraging Zen+ enhancements on a 12 nm process. The lineup progressed to Renoir in Q1 2020 for mobile Ryzen 4000 series and July 2020 for desktop, adopting Zen 2 on 7 nm, before culminating with Cezanne in April 2021 for OEM mobile/desktop PRO variants and August 2021 for consumer Ryzen 5000G desktop models on Zen 3. These APUs featured 4 to 8 cores with simultaneous multithreading, base clocks starting at 3.6 GHz and boosts up to 4.6 GHz, targeting 35-65 W TDP envelopes for efficient all-in-one computing. At the heart of these APUs was the integrated Vega graphics based on GCN 5.0, offering configurations like Vega 8 (512 shaders, 8 compute units) or Vega 11 (704 shaders, 11 compute units), with peak performance reaching up to approximately 1.8 TFLOPS at official boost clocks around 1250 MHz in higher-end models like the Ryzen 5 2400G. The Vega iGPU supported FP16 half-precision compute, enabling early machine learning workloads and accelerating tasks like video encoding, while providing DirectX 12 compatibility and hardware-accelerated video decode for H.264, H.265, and VP9. Key system specifications included DDR4-3200 memory support with dual-channel configuration for optimal graphics bandwidth, PCIe 3.0 lanes (up to 20) in Zen 1 models evolving to PCIe 4.0 (up to 24) in Zen 2 and 3 variants, and transistor counts ranging from 4.95 billion on the 14 nm/210 mm² Raven Ridge die to 10.7 billion on the denser 7 nm/180 mm² Cezanne die, with Renoir and Picasso at approximately 9.8 billion and 4.94 billion transistors respectively on 156 mm² and 210 mm² dies. From Raven Ridge onward, including Cezanne, these APUs used a monolithic design without chiplets while benefiting from Zen 3's unified L3 cache improvements.^[113] These APUs represented a significant leap in integrated graphics performance, delivering discrete-level capabilities comparable to entry-level dedicated GPUs like the GeForce GTX 1050 in 1080p gaming at low to medium settings, making them popular for budget builds without a separate graphics card.^[114] Innovations included the debut of Zen architecture in APUs with Raven Ridge, offering up to 2x the IPC over prior Bulldozer-era designs, and the 7 nm shift in Renoir, which achieved nearly double the power efficiency of Picasso through process shrinks and Zen 2 optimizations, enabling sustained performance at lower TDPs. Cezanne further extended AM4 socket longevity into 2022 with unlocked multipliers for overclocking and enhanced iGPU clocks up to 2 GHz, solidifying reception as a value-driven solution for light gaming, content creation, and OEM systems.^[115]

RDNA-based APUs

Rembrandt (2022)

The Rembrandt platform, codenamed for AMD's Ryzen 6000 series mobile processors, was announced on January 4, 2022, with laptops featuring these APUs becoming available starting in February 2022.^[116] This laptop-focused lineup emphasizes the Ryzen 5 and Ryzen 7 6000U and HS variants, which incorporate 6 to 8 Zen 3+ CPU cores and 12 to 16 threads, with boost clocks reaching up to 4.9 GHz.^[116] Built on TSMC's 6 nm process, Rembrandt APUs contain approximately 13.1 billion transistors across a 210 mm² die and support configurable TDPs from 15 W to 45 W, enabling efficient operation in thin-and-light designs. They utilize the FP7 socket and include four 32-bit memory channels compatible with LPDDR5-6400, alongside PCIe 4.0 and USB4 connectivity for enhanced data throughput.^[117] A key advancement in Rembrandt is the integration of the Radeon 680M graphics processor, AMD's first APU to employ the RDNA 2 architecture with 12 compute units (768 shaders), operating at up to 2.4 GHz.^[118] This iGPU delivers up to 3.7 TFLOPS of FP32 compute performance, roughly doubling the graphics capabilities of the Vega-based iGPUs in the prior Cezanne generation (Ryzen 5000 series).^[116] It introduces hardware-accelerated ray tracing via 12 ray accelerators and AV1 video decode support, enabling smoother 1080p playback and improved efficiency for streaming and content creation.^[119] These features position Rembrandt as a strong contender for integrated 1080p gaming in ultrabooks, achieving 40-60 FPS in select AAA titles at low to medium settings without discrete GPUs.^[120] Rembrandt's refinements to the Zen 3 architecture, including optimized power delivery and higher average clocks, contribute to up to 28% better multi-threaded CPU performance over Cezanne while maintaining similar cache latencies.^[121] As the inaugural RDNA-based APU, it marked a significant shift from prior GCN/Vega integrations, prioritizing graphics efficiency for mobile workloads. The platform saw widespread adoption, powering over 200 premium laptop models from OEMs like ASUS, Lenovo, and HP by mid-2022, and capturing substantial share in the high-end ultrabook segment for its balance of productivity, battery life (up to 29 hours in office tasks), and casual gaming.^[116]

Phoenix (2023–2024)

The Phoenix platform, codenamed Phoenix Point, represents AMD's Zen 4-based accelerated processing unit (APU) architecture introduced in the Ryzen 7040 series for mobile devices, with a refresh under the Hawk Point codename in the Ryzen 8040 series. Launched in the second quarter of 2023 following an announcement at CES, the initial lineup targeted thin-and-light laptops and handhelds, featuring 6 to 8 Zen 4 cores and 12 to 16 threads, with maximum boost clocks reaching up to 5.2 GHz on the flagship Ryzen 9 7940HS model.^[122] The Hawk Point refresh, announced in December 2023 and available starting early 2024, maintained the core Zen 4 design while enhancing AI capabilities, extending the platform's lifecycle into 2024 for broader commercial adoption.^[123] Central to the Phoenix architecture is the integration of RDNA 3 graphics via the Radeon 760M and 780M iGPUs, marking AMD's first mobile APU with this GPU generation. The Radeon 780M, found in Ryzen 7 and 9 models, employs 12 compute units (CUs) with 768 shaders, operating at up to 2.7–3.0 GHz for approximately 4.3 TFLOPS of FP32 performance, while the Radeon 760M in Ryzen 5 variants uses 8 CUs at similar clocks for around 2.9 TFLOPS. These iGPUs leverage RDNA 3's dual compute units per workgroup processor (WGP) design, improving efficiency over prior architectures, alongside dedicated AI accelerators for machine learning tasks. Built on TSMC's 4nm process node with an approximate die size of 178 mm² and approximately 25.4 billion transistors in the primary compute/graphics chiplet (plus a separate I/O die), the platform supports configurable thermal design power (TDP) from 15 W to 54 W, LPDDR5X-7500 memory, and the FP8 socket for mobile integration.^[124]^[125] A key innovation in Phoenix is the introduction of the Ryzen AI neural processing unit (NPU) based on AMD's XDNA architecture, the first dedicated AI engine in an x86 processor, enabling native support for features like Microsoft Copilot+. The original 7040 series delivers up to 10 TOPS of INT8 performance via the NPU, while the Hawk Point refresh boosts this to 16 TOPS, qualifying for Copilot+ PC certification and accelerating AI workloads such as image generation and video upscaling. Graphics performance sees over 50% uplift compared to the prior Rembrandt platform's Radeon 680M, driven by RDNA 3 advancements, allowing efficient 1080p and 1440p gaming in titles like Cyberpunk 2077 at medium settings.^[123]^[126]^[127] The platform gained positive reception for its balance of power efficiency and integrated graphics prowess, particularly in handheld gaming devices like the ASUS ROG Ally, which employs a custom Phoenix-derived Ryzen Z1 Extreme APU (8 Zen 4 cores, 12-CU Radeon 780M at 15–30 W TDP). Reviews highlighted its ability to deliver playable frame rates at 1440p with low power draw, outperforming competitors like Intel's Meteor Lake in gaming efficiency by up to 139% in select benchmarks, while maintaining strong battery life in ultrathin laptops. This efficiency stems from the 4nm process and optimized chiplet design, positioning Phoenix as a foundational step for AI-enhanced mobile computing.^[122]^[128]^[129]

Strix Point (2024)

The Strix Point platform, codenamed for AMD's Ryzen AI 300 series, was announced at Computex in June 2024 and became available in premium laptops starting in July 2024.^[38] Targeted at high-end mobile computing, it features up to 12 Zen 5 CPU cores—comprising a mix of full Zen 5 and dense Zen 5c cores—delivering up to 24 threads and a maximum boost clock of 5.1 GHz in models like the Ryzen AI 9 HX 370.^[130]^[38] These APUs emphasize AI-driven tasks in thin-and-light designs from manufacturers such as ASUS and Lenovo, with configurable power envelopes suited for creative professionals and mobile gamers.^[131] Integrated graphics are powered by the Radeon 890M, based on the RDNA 3.5 architecture with 16 compute units (1024 shaders) clocked up to 2.9 GHz, providing up to approximately 5.9 TFLOPS of FP32 compute performance.^[132]^[133] Enhancements include improved ray-tracing accelerators over prior RDNA generations and support for AMD Fluid Motion Frames, enabling frame generation for smoother gameplay in supported titles. The platform is fabricated on TSMC's 4 nm process node, with the core die measuring about 233 mm² and incorporating roughly 15 billion transistors across the CPU, GPU, and other components.^[134] It supports LPDDR5X memory up to 8000 MT/s and operates within a 15-54 W TDP range, though some configurations extend to 80 W for higher performance.^[135] The dedicated XDNA 2 neural processing unit delivers 50 TOPS of INT8 performance, optimized for generative AI workloads such as on-device large language models.^[130]^[38] Architecturally, Strix Point achieves a 16% increase in instructions per clock over the Zen 4-based predecessors, contributing to strong efficiency in multi-threaded applications.^[38] This marks the first AMD APU series capable of running advanced on-device LLMs fluidly without cloud dependency, excelling in creative workflows like video editing and 3D rendering due to the combined CPU, GPU, and NPU capabilities.^[136] Early reviews highlight its prowess in AI-accelerated content creation, with the integrated NPU handling tasks like image generation and real-time upscaling more efficiently than CPU-only alternatives.^[137] Strix Halo (Ryzen AI Max series), announced at CES 2025 and launched in Q1-Q2 2025, features up to 16 Zen 5 cores and 40 RDNA 3.5 compute units (Radeon 890M-equivalent iGPU scaled up) in premium laptops and handhelds, delivering up to 70+ TFLOPS iGPU performance and powering devices like ASUS ROG models by mid-2025.^[3]^[138]

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AMD Radeon HD 6530D IGP Specs | TechPowerUp GPU Database
It features 320 shading units, 16 texture mapping units, and 8 ROPs. The GPU is operating at a frequency of 444 MHz. Its power draw is rated at 65 W maximum.
[64]
AMD Radeon HD 6410D IGP Specs | TechPowerUp GPU Database
It features 160 shading units, 8 texture mapping units, and 4 ROPs. The GPU is operating at a frequency of 444 MHz. Its power draw is rated at 65 W maximum.Missing: Llano 6550D
[65]
AMD ships Llano, the ultimate HTPC processor - Ars Technica
Apr 5, 2011 · AMD is calling Llano's combination of a CPU and GPU on the same die an APU, for “accelerated processing unit.” Whatever you call it, it's pretty ...
[66]
AMD Llano APU System Build: Mini-ITX for HTPC and Gaming
Jul 24, 2012 · CPU: AMD A8-3870K Unlocked Llano 3.0 GHz APU With four cores running at 3.0 GHz and an unlocked overclocking capability, this part will perform ...
[67]
AMD Zacate core - CPU-World
Zacate is based on Bobcat micro-architecture, and integrates 1 or 2 CPU cores, single-channel DDR3 memory controller, and graphics controller in one chip.Missing: 40nm | Show results with:40nm<|control11|><|separator|>
[68]
AMD Z-01 APU now shipping to manufacturers - NotebookCheck.net
Jun 4, 2011 · Previously revealed at CeBIT 2011, the 110W has since had its specs upgraded. This 10-inch tablet will now sport Windows 7, 2GB DDR2 RAM, up to ...
[69]
AMD's 40nm Bobcat versus Intel's 45nm Atom - Chip Architect
Sep 4, 2010 · The small size of AMD's Bobcat core on TSMC's 40nm process. AMD's Ontario APU will be launched early 2011 using TSMC's 40nm bulk process.Missing: TDP | Show results with:TDP
[70]
AMD Radeon HD 6310 IGP Specs | TechPowerUp GPU Database
It features 80 shading units, 8 texture mapping units, and 4 ROPs. The GPU is operating at a frequency of 488 MHz. Its power draw is rated at 18 W maximum.Missing: UVD | Show results with:UVD
[71]
AMD confirms tablet-friendly Z-series APU, next-gen Trinity APU for ...
Jun 1, 2011 · Its integrated dual 1Ghz Bobcat chips and Radeon HD 6250 graphics should allow the full Windows 7 experience on a tablet, from USB peripheral ...
[72]
AMD Trinity FM2 APU Preview Review | TechPowerUp
Rating 4.0 · Review by cadaveca (TPU)Sep 26, 2012 · Specifications ; Up to DDR3 1866 @ 1.5V · Up to 384 Radeon Cores 2.0, DirectX 11 capable, UVD3, VCE · 3x Digital Display: each supporting Display ...
[73]
Socket FM2 - Wikipedia
FM2 was launched on September 27, 2012. Motherboards which feature the at the time new FM2 CPU socket also utilize AMD's at the time new A85X chipset.
[74]
Second-Generation AMD A-Series APUs Enable Best-in-Class PC ...
May 15, 2012 · The 2nd-Generation AMD A-Series APU gives users superior Web-based video experience thanks to plug-ins for Google Chrome, Firefox and Internet ...
[75]
AMD "Richland" Desktop APU Lineup Detailed | TechPowerUp
Jan 24, 2013 · The series will be led by AMD A10-6800K, which features every component on the "Richland" silicon unlocked, which includes two "Piledriver" CPU modules ...
[76]
Scaling mobile GPUs to 1000 GFLOPS - StreamHPC
Apr 22, 2013 · OpenCL on ARM: Growth-expectation of GFLOPS/Watt of mobile GPUs exceeds Moore's law. ... AMD Trinity, 32 nm, 246 mm2, 1.303B. Intel Sandy Bridge ( ...<|separator|>
[77]
AMD A10-6790K Specs - CPU Database - TechPowerUp
AMD is making the A10-6790K on a 32 nm production node using 1,303 million transistors. The silicon die of the chip is not fabricated at AMD, but at the ...
[78]
AMD A10-6800K and A10-6700 Review: Richland Finally Lands
Jun 5, 2013 · It also features four USB 3.0 ports to boot. a10-6800-bios.png. Richland still supports a maximum of two modules with four cores. It has a ...
[79]
APUs Make Up Nearly 75% of AMD's Processor Sales | TechPowerUp
Nov 19, 2012 · The chips make up 39 percent of AMD's sales in Q3, followed by another APU line, the A-Series "Trinity", which is available in desktop and ...
[80]
10-K: Annual report pursuant to Section 13 and 15(d) - AMD
In May 2013, we launched our next generation 2013 AMD Mainstream quad-core x86 SOC, codenamed “Kabini,” designed for entry-level and small-form factor touch ...
[81]
AMD A6-5200 vs AMD A4-5000 - NotebookCheck.net
The AMD A4-5000 is a mobile quad-core SoC for low-end laptops, which was presented in mid-2013. In addition to 4 CPU cores with a clock speed of 1.5 GHz (no ...Missing: 8000 GFLOPS
[82]
AMD A6-1450 Specs | TechPowerUp CPU Database
With a TDP of 8 W, the A6-1450 consumes extremely little energy. AMD's processor supports DDR3 memory with a single-channel interface. The highest officially ...
[83]
AMD A4-5000 Kabini Reference Notebook Tested - PC Perspective
May 23, 2013 · Kabini Architecture Overview. The building blocks of Kabini are four Jaguar x86 cores and 128 Radeon cores colleted in a pair of Compute ...
[84]
AMD A4-5000 Specs | TechPowerUp CPU Database
A4-5000 has 2 MB of L2 cache and operates at 1500 MHz. AMD is making the A4-5000 on a 28 nm production node, the transistor count is unknown. The silicon die of ...
[85]
AMD Temash A6-1450 Quad Core SOC Spotted in Acer Aspire V5 ...
Apr 30, 2013 · The chip comes with 2 MB of L2 cache and has a 4-6 Watt TDP which is pretty impressive for the new architecture by AMD. In addition to the CPU, ...
[86]
AMD A4-5000 vs AMD A6-5200: What is the difference? - Versus
Why is AMD A6-5200 better than AMD A4-5000? ; 33.33% faster CPU speed · 4 x 2 GHzvs4 x 1.5 GHz ; 128 MHz faster GPU clock speed · 625 MHzvs497 MHz ; 29.01% higher ...Missing: Kabini Temash Jaguar 8000 GFLOPS
[87]
AMD A4-5000 Review: Kabini, the mainstream APU - TechSpot
Rating 80% · Review by Steven WaltonMay 24, 2013 · The A4-5000 features four Jaguar cores clocked at 1.5GHz and a total L2 cache of 2MB, while the on-die GPU is the Radeon HD 8330. The faster A6- ...Missing: GFLOPS | Show results with:GFLOPS
[88]
AMD launches Temash, Richland and Kabini mobile APUs - Bit-Tech
May 23, 2013 · AMD launches Temash, Richland and Kabini mobile APUs ; A6-1450, HD 8250, 4, 1GHz/1.4GHz, 2MB ; A4-1250, HD 8210, 2, 1GHz, 1MB ; A4-1200, HD 8180, 2 ...
[89]
Jaguar vs K10 (llano) at same clocks | AnandTech Forums
May 25, 2013 · Jaguar is AMD's most efficient design to date from perf./watt/mm^2 POV. Kaveri has a good chance to take the crown but die area is unknown ...
[90]
[notebookcheck] Review AMD A6-1450 APU "Temash" - Overclock.net
May 15, 2013 · ... GPU inside and a successor to A6-1450 would have a GPU comparable to HD4600 with lower TDP/power consumption likely. Save Share. Reply Quote ...[Sweclockers]AMD Temash APU A6-1450 in Cinebench R11.5[youtube/amd] The AMD Embedded G-Series SOC - Overclock.netMore results from www.overclock.netMissing: specs | Show results with:specs
[91]
AMD has shipped 100 million chips for consoles this gen ... - IconEra
Feb 15, 2025 · "Overall, this console generation has been very strong. Highlighted by cumulative unit shipments surpassing 100 million in the fourth quarter.Missing: Kabini Temash
[92]
AMD reveals Kaveri details, release date: Can the ... - ExtremeTech
Nov 12, 2013 · The flagship part, dubbed the A10-7850K, will be clocked at 3.7GHz, feature four cores (two Steamroller modules) built on GlobalFoundries' 28nm ...
[93]
AMD "Kaveri" APUs to launch on January 14 - CPU-World
Nov 12, 2013 · Desktop "Kaveri" microprocessors for socket FM2+ will be available on January 14, 2014. One of these APUs could be A10-7850K, that was spotted ...
[94]
AMD A10-7870K Godavari APU Review - Legit Reviews
Jul 27, 2015 · Back on May 28th, 2015 AMD introduced the new A10-7870K Accelerated Processing Units (APU) as part of the Kaveri refresh.
[95]
AMD Unveils 'Mullins' and 'Beema' APUs for 2014 | PCMag
Nov 13, 2013 · The new APUs utilize a System-on-a-Chip (SoC) design featuring AMD's "Puma" central processor cores and Graphics Core Next (GCN)-class Radeon ...
[96]
AMD launches Beema and Mullins ULV processors - CPU-World
May 4, 2014 · AMD E2-6110, A4-6210 and A6-6310 "Beema" processors incorporate 4 "Puma+" CPU cores, 2 MB of L2 cache, and a GCN GPU with 128 shaders. The chips ...
[97]
AMD Officially Launches The Mobility Kaveri APU Lineup - Wccftech
Jun 4, 2014 · AMD's Kaveri APUs feature a 245mm2 and a transistor count of 2.41 Billion transistors.
[98]
AMD Announces 4th Generation A-Series "Kaveri" Desktop APUs
Jan 14, 2014 · Based on the Graphics CoreNext 2.0 micro-architecture, "Kaveri" features eight GCN compute units (CUs), which make up 512 stream processors, and ...
[99]
Introduction To Beema and Mullins - HotHardware
Rating 4.0 · Review by Marco ChiappettaApr 29, 2014 · HotHardware takes a deep dive look at the brand new mainstream and low-power AMD APUs for 2014, codenamed Beema and Mullins.Missing: Puma | Show results with:Puma
[100]
AMD Mullins Powered Compulab Fitlet mini PCs Run Linux Mint or ...
Jan 14, 2015 · Storage – mSATA up to 1 TB (SATA 3.0), power eSATA (5V), and micro-SD slot (SDXC support, rate 25 MB/s); Video Output – Dual HDMI 1.4a up to ...
[101]
https://www.wccftech.com/amd-kaveri-apu-architecture-specifications-prices-revealed-241-billion-transistors-245mm2-die/
[102]
AMD Kaveri APU promises 1 teraflops - DVHARDWARE
The Trinity APU that was just released is currently rated at 726 GFLOPS. This is around a 38% performance improvement, which shows the heterogeneous ...<|separator|>
[103]
AMD A8-7600 (Kaveri) Review | bit-tech.net
Jan 14, 2014 · As for video output, Kaveri should comfortably be able to deal with 4K 60Hz displays, assuming you've got a motherboard with a DisplayPort 1.2 ...
[104]
AMD Kaveri review roundup: a solid gaming chip that's ahead of its ...
Jan 17, 2014 · Overall, Anandtech concluded that Kaveri could be an "ideal fit" for many people who aren't power users, but who like to indulge in a bit of ...Missing: innovations 4K
[105]
AMD Discloses Architecture Details of High-Performance, Energy ...
Feb 23, 2015 · Using a true System-on-Chip (SoC) design, AMD expects Carrizo to reduce the power consumed by the x86 cores alone by 40 percent, while also ...
[106]
AMD's Bristol Ridge and Stoney Ridge Architecture - Notebookcheck
Jul 24, 2016 · Bristol Ridge and Stoney Ridge were announced during Computex on June 1, 2016 and are already shipped in the A-series APUs starting in June.<|separator|>
[107]
AMD Ships New 7th Gen A-Series Bristol Ridge APUs To OEMs ...
Sep 6, 2016 · It features the newest GCN core architecture (Radeon R7 Graphics) with 512 stream processors and eight CUs racing along at 1,108MHz. Over on the ...
[108]
AMD's 6th Generation Carrizo APUs Officially Launched and Detailed
Jun 1, 2015 · The Carrizo chips feature 4 x86 Excavator cores with 2 MB L2 cache, 3rd generation GCN GPU (integrated) that pack 8 graphics compute units or ...
[109]
Media Alert: AMD to Present "Carrizo" APU Paper at ISSCC 2015
Feb 17, 2015 · Power efficient technologies designed to deliver improved battery life and performance-per-watt; High-density design delivering 29 percent more ...
[110]
AMD Carrizo APU With Excavator Core Architecture Targets Higher ...
Feb 24, 2015 · “AMD has been pursuing Heterogeneous System Architecture (HSA) and proprietary power management technologies to make continued gains. The ...
[111]
AMD Officially Launches Bristol Ridge Processors And Zen-Ready ...
Sep 8, 2016 · At the top end AMD has the (65W) quad core A12-9800 running at 3.8 GHz base and 4.2 GHz boost paired with GCN 3.0-based Radeon R7 graphics ( ...
[112]
AMD's moment of Zen: Finally, an architecture that can compete
Mar 2, 2017 · Fourth-generation Excavator added as much as 15-percent IPC over Steamroller. However, neither Steamroller nor Excavator were used in high ...
[113]
AMD Ryzen 5000 Mobile 'Cezanne' SoC Deep Dive: Zen 3 Powers ...
Jan 26, 2021 · The Ryzen 5000 mobile die spreads 10.7 billion 7nm TSMC transistors across 180mm2 of silicon, with the core complexes, L3 cache, and GPU in the ...
[114]
Ryzen 5 2400G, Ryzen 3 2200G APUs reviewed: Vega meets Zen
Feb 12, 2018 · AMD's Ryzen 3 2200G and Ryzen 5 2400G APUs are everything budget gamers have been praying for: surprisingly decent gaming performance at a ...
[115]
AMD Ryzen 7 5700G Review - Great Performance & Integrated ...
Rating 5.0 · Review by W1zzard (TPU)Aug 3, 2021 · ... Cezanne." Built entirely on the 7 nm silicon fabrication process, it has a die area of 180 mm² with a transistor-count of 10.7 billion.
[116]
AMD Unveils New Ryzen Mobile Processors Uniting “Zen 3+” core ...
Jan 4, 2022 · The AMD Ryzen 7 5800X3D will be available for Socket AM4 later in Spring 2022. “Zen 4” Core and Socket AM5 AMD previewed its Ryzen 7000 Series ...Missing: Rembrandt APU
[117]
AMD Rembrandt core - CPU-World
Jun 25, 2022 · All models in FP7 BGA package have four 32-bit memory channels and support LPDDR5 memory with up to LPDDR5-6400. ... Socket, BGA (FP7) BGA ...
[118]
AMD Radeon 680M Specs | TechPowerUp GPU Database
The card also has 12 raytracing acceleration cores. The GPU is operating at a frequency of 2000 MHz, which can be boosted up to 2200 MHz. Its power draw is ...
[119]
AMD Radeon 680M GPU - Benchmarks and Specs - Notebookcheck
Jan 4, 2022 · The AMD Radeon 680M is an integrated GPU in the Ryzen 6000 series for laptops (Rembrandt, eg Ryzen 9 6980HX). The iGPU is based on the RDNA2 architecture.
[120]
AMD RDNA 2 'Radeon 680M' Integrated GPU Shines In ... - Wccftech
Mar 4, 2022 · AMD's Radeon 680M 'RDNA 2' iGPU has showcased impressive performance in games, delivering 40-60 FPS in modern AAA titles at 1080p.
[121]
AMD 6nm Ryzen 6000 'Rembrandt' SoC Deep Dive - Tom's Hardware
Feb 17, 2022 · RDNA 2 should make these chips solid 1080p medium/high performers. With graphics cards prices still high, and not being able to mine on ...
[122]
AMD Details Ryzen 7040U Mobile Processors - Tom's Hardware
May 3, 2023 · The 780M is the top model, on Ryzen 7 and 9 chips, with 12 cores up to 2.7 GHz. The new Radeons use RDNA 3, and have a new media engine for AV1 ...
[123]
The refresh that wasn't — AMD announces 'Hawk Point' Ryzen 8040 ...
Dec 6, 2023 · AMD also provided performance claims for XDNA 1, saying the NPU alone delivers 10 TOPS (teraops INT8) of performance in the Phoenix 7040 series ...
[124]
Hot Chips 2023: AMD's Phoenix SoC - by Chester Lam
Sep 16, 2023 · The chip has 25.4 billion transistors, and combines Zen 4 cores with RDNA 3 graphics. Alongside the all-important CPU and GPU, AMD has added ...
[125]
AMD Radeon 780M GPU - Benchmarks and Specs - Notebookcheck
The AMD Radeon 780M is an integrated GPU in the Ryzen 7040 series for laptops (Phoenix, eg Ryzen 9 7940HS). The iGPU is based on the new RDNA3 architecture.
[126]
https://www.amd.com/en/technologies/xdna.html
[127]
[PDF] amd ryzen™ 7040hs series processors
4nm “Zen 4” architecture from AMD. HIGH PERFORMANCE GAMING ON THIN & LIGHT LAPTOPS2. 100+ FPS on top game titles (at 1080p high settings, up to). Core i9-13900H.
[128]
ASUS ROG Ally with AMD Ryzen Z1 Extreme "Phoenix" APU leaks out
Apr 20, 2023 · ASUS ROG Ally console confirmed with AMD Ryzen Z1 Extreme APU ; 7″ 1920×1080, 120Hz (VRR), 500 nits, 7ms · Wi-Fi 6E, Bluetooth 5.2 ; 7″ 1920×1080, ...
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https://hothardware.com/reviews/asus-rog-ally-review
[130]
AMD Ryzen™ AI 9 HX 370
The AMD Ryzen AI 9 HX 370 has 12 cores, 24 threads, up to 5.1 GHz boost, 28W TDP, 256GB max memory, and 80 TOPS AI performance.
[131]
ASUS launches AMD Ryzen AI 300 series 'Strix Point' APU laptops ...
Jul 29, 2024 · ASUS has just launched its new AMD Ryzen AI 300 series "Strix Point" APU-powered laptops, for both gamers and creators, starting from $1399.
[132]
AMD Radeon 890M Specs | TechPowerUp GPU Database
AMD Radeon 890M ; Graphics Processor: Strix Point ; Cores: 1024 ; TMUs: 64 ; ROPs: 32 ; Memory Size: System Shared.Missing: 300 | Show results with:300
[133]
AMD Radeon 890M - Benchmarks and Specs - Notebookcheck
Jun 2, 2024 · AMD Radeon 890M ; Codename, Strix Point ; Architecture, RDNA 3+ ; Pipelines, 1024 - unified ; Core Speed, 2900 (Boost) MHz ; Memory Speed, 7500 MHz.
[134]
AMD Granite Ridge and Strix Point Zen 5 Die-sizes and Transistor ...
Jul 16, 2024 · The "Zen 5" CCD has a transistor count of 8.315 billion, which is a significant increase over the 6.5 billion of "Durango," the 8-core CCD based on "Zen 4," ...Missing: Richland process
[135]
https://www.wccftech.com/amd-strix-point-apus-upgraded-lpddr5x-8000-krackan-point-strix-halo-get-96-gb-memory/
[136]
'Strix Point' First Tests: AMD Ryzen AI 300 Laptop Chip Flexes Real ...
Jul 28, 2024 · About the AMD Ryzen AI 300 Series · The CPU: 'Zen 5' Cores · The GPU: RDNA 3.5 · The NPU: XDNA 2 · The Test System: Asus Zenbook S 16 (UM5606).
[137]
AMD Ryzen AI 300 series 'Strix Point' APU laptops launch
Jul 28, 2024 · AMD has launched its new Ryzen AI 300 series "Strix Point" APU-powered laptops, which see the combination of Zen 5 CPU cores, RDNA 3.5 GPU cores, and an XDNA 2 ...